Sputtering target

Abstract

Provided is a sputtering target characterized by containing Ag and C. The sputtering target contains Ag in addition to Fe, Pt and C. By allowing the sputtering target to contain Ag, the sputtering target has high density. As a result, when the sputtering target is placed in a vacuum atmosphere in the sputtering process, the amount of a gas emitted from the sputtering target can be reduced, and the properties of a thin film formed by sputtering can be improved. Moreover, even when the sputtering target is produced by low-temperature sintering, it has high density.

The invention claimed is: 
     
       1. A sputtering target containing Fe, Pt, Ag and C, wherein the composition of the sputtering target is represented by [(Fe x Pt 100-x ) 100-y —Ag y ] 100-z —C z  (x, y, z: % by mol), wherein x is 45 to 65, y is 1 to 20, and z is 13 to 59. 
     
     
       2. The sputtering target as claimed in  claim 1 , which is produced by calcining a raw material powder containing Fe powder, Pt powder, Ag powder and C powder. 
     
     
       3. The sputtering target as claimed in  claim 1 , which has a density of not less than 90%. 
     
     
       4. The sputtering target as claimed in  claim 2 , which has a density of not less than 90%.