Semiconductor device for protecting battery cell, protection circuit module and battery pack having the same

Abstract

A semiconductor device is provided. The semiconductor device includes an integrated circuit that senses a voltage of a battery cell and outputs a control signal; a charge switch that is electrically coupled to the integrated circuit and interrupts a charge path according to the control signal output from the integrated circuit; at least one first lead electrically coupled to the integrated circuit; a second lead electrically coupled to the charge switch; and a sealing portion that seals the integrated circuit, charge switch, the at least one first lead and the second lead.

What is claimed is: 
     
       1. A semiconductor device comprising:
 an integrated circuit configured to sense a voltage of a battery cell and outputs a control signal; 
 a charge switch electrically coupled to the integrated circuit and configured to interrupt a charge path according to the control signal output from the integrated circuit; 
 a first lead electrically coupled to the integrated circuit; 
 a second lead electrically coupled to the charge switch; and 
 a sealing portion that seals the integrated circuit, charge switch, the first lead, the second lead, and a dummy lead, 
 wherein the sealing portion comprises a charge switch mounting board and the charge switch is mounted on the charge switch mounting board, 
 wherein the charge switch mounting board is exposed outside the sealing portion so that the charge switch mounting board serves as a conductive pad that can be coupled to the outside, 
 wherein the dummy lead is electrically isolated from all circuits sealed by the sealing portion, and 
 wherein the integrated circuit and the charge switch are located in the sealing portion and are a single package. 
 
     
     
       2. The semiconductor device of  claim 1 , wherein the integrated circuit and the charge switch are coupled to each other by at least one conductive wire. 
     
     
       3. The semiconductor device of  claim 1 , wherein the integrated circuit and the first lead are coupled to each other by at least one conductive wire. 
     
     
       4. The semiconductor device of  claim 1 , wherein the charge switch and the second lead are coupled to each other by at least one conductive wire. 
     
     
       5. The semiconductor device of  claim 1 , wherein the first lead and the second lead protrude outside the sealing portion. 
     
     
       6. The semiconductor device of  claim 1 , wherein the at least one first lead comprises a first sub lead for supplying power to the integrated circuit, and a second sub lead for sensing a voltage of the battery cell. 
     
     
       7. The semiconductor device of  claim 6 , wherein the first sub lead is arranged at one side of the sealing portion, and the second sub lead and the second lead are aligned with each other at the other side of the sealing portion facing the first sub lead. 
     
     
       8. The semiconductor device of  claim 6 , wherein the first sub lead is electrically coupled to a battery terminal and a pack terminal. 
     
     
       9. The, semiconductor device of  claim 6 , wherein the second sub lead is electrically coupled to a pack terminal. 
     
     
       10. The semiconductor device of  claim 1 , wherein the second lead is electrically coupled to a pack terminal. 
     
     
       11. The semiconductor device of  claim 1 , wherein the sealing portion comprises an integrated circuit mounting board and the integrated circuit is mounted on the integrated circuit mounting board. 
     
     
       12. The semiconductor device of  claim 11 , wherein the integrated circuit mounting board is coupled to the integrated circuit using an insulating adhesive. 
     
     
       13. The semiconductor device of  claim 1 , wherein the charge switch mounting board is coupled to the charge switch using a conductive adhesive. 
     
     
       14. The semiconductor device of  claim 1 , wherein the dummy lead protrudes outside the sealing portion. 
     
     
       15. The semiconductor device of  claim 1 , wherein the dummy lead is formed at the same side of the sealing portion as the first lead of the sealing portion. 
     
     
       16. A battery pack comprising:
 a protection circuit module comprising the semiconductor device as claimed in  claim 1 , the semiconductor device being mounted on a printed circuit board; and 
 a battery cell electrically coupled to the protection circuit module. 
 
     
     
       17. The battery pack of  claim 16 , wherein the printed circuit board further comprises:
 a battery terminal electrically coupled to the battery cell; and 
 a pack terminal electrically coupled to an external system.