Sealed infrared imagers

Abstract

The architecture, design and fabrication of array of suspended micro-elements with individual seals are described. Read out integrated circuit is integrated monolithically with the suspended elements for low parasitics and high signal to noise ratio detection of changes of their electrical resistance. Array of individually sealed, suspended micro-elements is combined with signal processing chip that contains nonvolatile memory with sensitivity calibration of all elements and interpolation between non-functional elements. When the micro-elements are infrared light absorbers, image analysis and recognition is embedded in the processing chip to form the infrared imaging solution for infrared cameras.

What is claimed is:  
     
       1. A suspended, individually sealed element with sensing multilayer that includes infrared light absorbing, temperature sensing and antireflective layers for detection of intensity of infrared radiation, integrated monolithically with readout integrated circuit underneath. 
     
     
       2. The element of  claim 1  with optically transparent cover and sealing layers. 
     
     
       3. Read out integrated circuit located below the suspended element of  claim 1  by monolithic integration with such element. 
     
     
       4. Getter layers enclosed within each cavity of elements or adjacent to the array of elements in  claim 1 . 
     
     
       5. The doped amorphous silicon or doped silicon-germanium temperature sensing materials of the elements of  claim 1 . 
     
     
       6. One or two dimensional arrays of infrared light sensing elements of  claim 1 . 
     
     
       7. An infrared camera system consisting of array of elements of  claim 1 , control electronics and digital image processing electronics. 
     
     
       8. The system of infrared arrays of  claim 1  and visible sensing arrays with the signal processing using visible imaging data to improve infrared image and infrared imaging data to improve visible image.