Organic light emitting diode display device and method of fabricating the same

Abstract

An organic light emitting diode display device is disclosed. The organic light emitting diode display device includes: an element substrate configured to include a plurality of pixel regions; a first passivation layer formed on the element substrate; an organic light emitting diode which includes a first electrode formed on the first passivation layer, a first insulation film formed on the first passivation layer with the first electrode and configured to define an emission region, and an organic layer and a second electrode formed on the first insulation film; a first fixed layer formed on the first passivation layer under an edge of the insulation film and configured to prevent a direct contact of the first passivation layer and the edge of the first insulation film; and a second passivation layer formed on the organic light emitting diode.

What is claimed is: 
     
       1. An organic light emitting diode display device comprising:
 a substrate configured to include a plurality of pixel regions; 
 a first passivation layer arranged above the substrate; 
 an organic light emitting diode formed on the first passivation layer and including:
 a first electrode formed on the first passivation layer, 
 a first insulation film formed on the first electrode and defining an emission region; 
 an organic layer; and 
 a second electrode of the organic light emitting diode formed on the organic layer; 
 
 a first adhesion enhancement pattern arranged at an end portion or an edge of the first insulation film and disposed on the first passivation layer such that the end portion of the first insulation film avoids contacting the first passivation layer; and 
 a second passivation layer configured to cover the organic light emitting diode. 
 
     
     
       2. The organic light emitting diode display device of  claim 1 , wherein the first adhesion enhancement pattern extends from the end portion or the edge of the first insulation film and contacts the second passivation layer. 
     
     
       3. The organic light emitting diode display device of  claim 1 , wherein the first passivation layer contacts the first insulation film between the first electrode and the first adhesion enhancement pattern. 
     
     
       4. The organic light emitting diode display device of  claim 1 , wherein the first adhesion enhancement pattern extends without contacting the second passivation layer. 
     
     
       5. The organic light emitting diode display device of  claim 1 , wherein the first adhesion enhancement pattern comprises a metal oxide material. 
     
     
       6. The organic light emitting diode display device of  claim 1 , wherein the first adhesion enhancement pattern comprises the same material as that of the first electrode. 
     
     
       7. The organic light emitting diode display device of  claim 1 , wherein the first adhesion enhancement pattern comprises an uneven upper surface. 
     
     
       8. The organic light emitting diode display device of  claim 7 , wherein the uneven upper surface of the first adhesion enhancement pattern comprises a plurality of slits. 
     
     
       9. The organic light emitting diode display device of  claim 1 , wherein the first passivation layer and the second passivation layer enclose the first adhesion enhancement pattern and the organic light emitting diode therebetween. 
     
     
       10. The organic light emitting diode display device of  claim 1 , wherein the first electrode extends toward an end portion or an edge of the first insulation film to form the first adhesion enhancement pattern such that the end portion or the edge of the first insulation film avoids contacting the first passivation layer. 
     
     
       11. The organic light emitting diode display device of  claim 1 , further comprises:
 a second insulation film formed on the first passivation layer opposite to the first insulation film and spaced apart from the first insulation film; and 
 a second adhesion enhancement pattern arranged at an end portion or an edge of the second insulation film and disposed on the first passivation layer such that the end portion of the second insulation film avoids contacting the first passivation layer. 
 
     
     
       12. The organic light emitting diode display device of  claim 11 , wherein the second insulation film is formed in a closed loop surrounding the first insulation film. 
     
     
       13. The organic light emitting diode display device of  claim 11 , wherein the first adhesion enhancement pattern and the second adhesion enhancement pattern comprise the same material as that of the first electrode. 
     
     
       14. A method of fabricating an organic light emitting diode display device, the method comprising:
 forming an element substrate which includes a plurality of pixel regions; 
 forming a first passivation layer on the element substrate; 
 forming a first electrode of an organic light emitting diode on the first passivation layer; 
 forming a first adhesion enhancement pattern on the first passivation layer such that the end portion or the edge of a first insulation film avoids contacting the first passivation layer; 
 forming a first insulation film on the first electrode; 
 forming an organic layer on the insulation film; 
 forming a second electrode of the organic light emitting diode on the organic layer; and 
 forming a second passivation layer on the second electrode. 
 
     
     
       15. The method of  claim 14 , wherein forming the first adhesion enhancement pattern comprises forming an upper surface of the first adhesion enhancement pattern to have an uneven structure using a half tone mask. 
     
     
       16. The method of  claim 14 , wherein forming the first adhesion enhancement pattern comprises forming the first adhesion enhancement pattern from the same material as the first electrode. 
     
     
       17. The method of  claim 14 , wherein forming the first adhesion enhancement pattern comprises forming the first adhesion enhancement pattern simultaneously with the first electrode. 
     
     
       18. The method of  claim 14 , further comprising patterning the first adhesion enhancement pattern which is initially connected with the first electrode from the first electrode. 
     
     
       19. The method of  claim 14 , wherein forming the first adhesion enhancement pattern comprises extending the first electrode toward the end portion or the edge of the first insulation film to form the first adhesion enhancement pattern. 
     
     
       20. The method of  claim 14 , wherein forming the first adhesion enhancement pattern comprises forming a second adhesion enhancement pattern simultaneously with the first adhesion enhancement pattern,
 wherein forming the first insulation film comprises forming a second insulation film on the second adhesion enhancement pattern in a position opposite to the first insulation film and spaced apart from the first insulation film, and 
 wherein the second adhesion enhancement pattern arranged at an end portion or an edge of the second insulation film and disposed on the first passivation layer such that the end portion of the second insulation film avoids contacting the first passivation layer. 
 
     
     
       21. The method of  claim 20 , wherein forming the first adhesion enhancement pattern and the second adhesion enhancement pattern comprises forming the first adhesion enhancement pattern and the second adhesion enhancement pattern from the same material as the first electrode. 
     
     
       22. The method of  claim 20 , wherein forming the first adhesion enhancement pattern and the second adhesion enhancement pattern comprises forming the first adhesion enhancement pattern and the second adhesion enhancement pattern simultaneously with the first electrode.