Method of fabricating stimulation lead for applying electrical stimulation to tissue of a patient

Abstract

In one embodiment, a method of fabrication of a stimulation lead for electrical stimulation of tissue of a patient, the method comprises: providing a substrate of non-conductive material for a stimulation portion of the stimulation lead; processing the substrate to create a plurality of recessed features into a surface of the substrate, wherein the plurality of recessed features comprise a plurality of paths for electrical traces and a plurality of surfaces for electrodes with each of the surfaces being connected to one of the traces; providing first conductive material over the surface of the substrate; subjecting the surface of the substrate to mechanical processing to remove conductive material from portions of the substrate disposed above the plurality of recessed features, wherein each respective connected electrode and trace is electrically isolated from the other electrodes and traces after the mechanical processing; electrically plating second conductive material over the first conductive material; providing insulative material over the plurality of electrical traces; and electrically connecting conductive material of electrical traces with conductor wires of a lead body.

What is claimed is: 
     
       1. A method of fabrication of a stimulation lead for electrical stimulation of tissue of a patient, the method comprising:
 providing a substantially annular substrate of non-conductive material for a stimulation portion of the stimulation lead, wherein the annular substrate is adapted for implantation with a brain of a patient; 
 processing the substrate to create a plurality of recessed features into a surface of the substrate; 
 providing first conductive material over the surface of the substrate to form a first conductive layer for electrical traces and electrodes defined by the plurality of recessed features; 
 subjecting the surface of the substrate to a mechanical grinding process to remove conductive material from portions of the substrate disposed above the plurality of recessed features, wherein each respective connected electrode and electrical trace of conductive material In the plurality of recesses is electrically isolated from the other electrodes and electrical traces after the mechanical processing; 
 electrically plating second conductive material over the first conductive material to provide a second conductive layer for each respective connected electrical trace and electrode; 
 providing insulative material over the plurality of electrical traces; and 
 electrically connecting conductive material of electrical traces with conductor wires of a lead body to connect electrodes of the stimulation portion to wires of the lead body. 
 
     
     
       2. The method of  claim 1  wherein the processing the substrate comprises:
 employing a mold to define at least a subset of the plurality of recessed features. 
 
     
     
       3. The method of  claim 1  wherein the processing the substrate comprises:
 laser machining insulative material from the substrate. 
 
     
     
       4. The method of  claim 1  wherein the providing first conductive material comprises at least one of (i) vapor deposition and (ii) sputtering. 
     
     
       5. The method of  claim 1  wherein the electrically connecting comprises:
 inserting conductive wires within and welding the conductive wires to a plurality of weld tubes disposed circumferentially about a proximal end of the substrate. 
 
     
     
       6. The method of  claim 5  further comprising:
 coupling an annular ring holding the plurality of weld tubes with the stimulation portion and the lead body of the stimulation lead. 
 
     
     
       7. The method of  claim 6  wherein the coupling comprises:
 molding material over the annular ring.