Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices

Abstract

A method for making an electronic device includes forming an interconnect layer stack on a rigid wafer substrate having a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer. An LCP solder mask having at least one aperture therein alignable with the at least one solder pad is formed. The LCP solder mask and interconnect layer stack are aligned and laminated together. Solder is positioned in the at least one aperture. At least one circuit component is attached to the at least one solder pad using the solder.

That which is claimed is: 
     
       1. A method of making an electronic device comprising:
 forming an interconnect layer stack on a rigid wafer substrate and comprising a plurality of patterned electrical conductor layers with dielectric layers between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer; 
 forming an LCP solder mask separate from the interconnect layer stack and having at least one aperture therein alignable with the at least one solder pad; 
 aligning the LCP solder mask and interconnect layer stack so that the at least one aperture is aligned with the at least one solder pad; 
 aligning and laminating the LCP solder mask and the interconnect layer stack together by applying heat and pressure to the LCP solder mask and the uppermost layer of the plurality of circuit layers; 
 positioning a conductive material in the at least one aperture by dipping the electronic device in a solder bath; and 
 attaching at least one circuit component to the at least one solder pad using the solder conductive material. 
 
     
     
       2. The method of  claim 1 , wherein the conductive material comprises solder; and wherein attaching the at least one circuit component comprises heating the solder. 
     
     
       3. The method of  claim 1 , wherein the conductive material comprises epoxy; and wherein attaching the at least one circuit component comprises heating the epoxy. 
     
     
       4. The method of  claim 1 , wherein applying heat and pressure is performed in an autoclave. 
     
     
       5. The method of  claim 1 , wherein forming the LCP solder mask comprises at least one of punching and laser milling the at least one aperture. 
     
     
       6. The method of  claim 1 , wherein forming the interconnect layer stack comprises forming the plurality of patterned electrical conductor layers using conventional thin film deposition. 
     
     
       7. The method of  claim 1 , wherein the at least one circuit component comprises at least one integrated circuit. 
     
     
       8. The method of  claim 1 , wherein the LCP solder mask has a thickness of less than 0.0015 inches. 
     
     
       9. An electronic device comprising:
 a semiconductor layer; 
 an interconnect layer stack on said rigid wafer substrate semiconductor layer and comprising a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer; 
 an LCP solder mask on said interconnect layer stack and having at least one aperture aligned with said at least one solder pad; 
 a fused seam between said interconnect layer stack and said LCP solder mask; 
 a conductive material in the at least one aperture; and 
 at least one circuit component electrically coupled to said at least one solder pad through said solder conductive material. 
 
     
     
       10. The electronic device of  claim 9 , wherein the conductive material comprises solder. 
     
     
       11. The electronic device of  claim 9 , wherein the conductive material comprises epoxy. 
     
     
       12. The electronic device of  claim 9 , wherein said at least one solder pad comprises a plurality thereof arranged in an array pattern. 
     
     
       13. The electronic device of  claim 9 , wherein said at least one circuit component comprises at least one integrated circuit. 
     
     
       14. The electronic device of  claim 9 , wherein said LCP solder mask has a thickness of less than 0.0015 inches. 
     
     
       15. A method of making an electronic device comprising:
 forming an interconnect layer stack on a substrate and comprising a plurality of patterned electrical conductor layers with dielectric layers between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer; 
 forming an LCP solder mask separate from the interconnect layer stack and having at least one aperture therein; 
 aligning the LCP solder mask and interconnect layer stack so that the at least one aperture is aligned with the at least one solder pad; 
 laminating the LCP solder mask and the interconnect layer stack together; and 
 attaching at least one circuit component to the at least one solder pad using a conductive material positioned in the at least one aperture. 
 
     
     
       16. The method of  claim 15 , wherein the conductive material comprises solder; and wherein attaching the at least one circuit component comprises heating the solder. 
     
     
       17. The method of  claim 15 , wherein the conductive material comprises epoxy; and wherein attaching the at least one circuit component comprises heating the epoxy. 
     
     
       18. The method of  claim 15 , wherein laminating comprises applying heat and pressure in an autoclave. 
     
     
       19. The method of  claim 15 , wherein forming the LCP solder mask comprises at least one of punching and laser milling the at least one aperture. 
     
     
       20. The method of  claim 15 , wherein forming the interconnect layer stack comprises forming the plurality of patterned electrical conductor layers using thin film deposition. 
     
     
       21. The method of  claim 15 , wherein the at least one circuit component comprises at least one integrated circuit. 
     
     
       22. The method of  claim 15 , wherein the LCP solder mask has a thickness of less than 0.0015 inches.