Networking packages based on interposers

Abstract

A package structure includes a networking unit including a plurality of switches/routers and a plurality of network interface units coupled to the plurality of switches/routers, and an interposer including a plurality of metal connections. The interposer is substantially free from functional elements built therein. A functional element is outside of, and bonded onto, the interposer, wherein the functional element is electrically coupled to the networking unit through the plurality of metal connections.

What is claimed is: 
     
       1. A package structure comprising:
 a networking unit comprising a plurality of switches/routers and a plurality of network interface units coupled to the plurality of switches/routers; 
 an interposer comprising a plurality of metal connections, wherein the interposer is substantially free from active devices built inside the interposer; 
 a functional element outside of, and bonded onto, the interposer, wherein the functional element is electrically coupled to the networking unit through one of the plurality of metal connections in the interposer; 
 a printed circuit board (PCB) bonded to the interposer, wherein the PCB and the functional element are on opposite sides of the interposer, and wherein one of the plurality of network interface units is not directly connected to any functional element external to the interposer; and 
 a plurality of functional elements bonded onto the interposer, wherein each of the plurality of functional elements is connected to one of a plurality of ports of the networking unit through the plurality of metal connections in the interposer. 
 
     
     
       2. The package structure of  claim 1 , wherein the networking unit is built in a networking die external to the interposer, and wherein the networking die is bonded onto the interposer. 
     
     
       3. The package structure of  claim 1 , wherein the interposer comprises a silicon substrate. 
     
     
       4. The package structure of  claim 1  wherein the plurality of functional elements is bonded onto the interposer through flip-chip bonding. 
     
     
       5. The package structure of  claim 1 , wherein the plurality of network interface units supports a plurality of different bus protocols. 
     
     
       6. The package structure of  claim 1 , wherein the functional element is selected from the group consisting essentially of a die and a package chip. 
     
     
       7. The package structure of  claim 1 , wherein the functional element is selected from the group consisting essentially of an embedded graphic processing unit (eGPU), a power management unit (PMU), a digital signal processing (DSP) unit, an audio/video unit, a 3G radio unit, and a WiFi/GPS/blue tooth unit. 
     
     
       8. The package structure of  claim 1 , wherein the interposer comprises a dielectric substrate. 
     
     
       9. A package structure comprising:
 an interposer comprising a plurality of metal connections; 
 a networking die bonded onto the interposer, wherein the networking die comprises a plurality of switches/routers and a plurality of network interface units coupled to the plurality of switches/routers; 
 a plurality of functional elements bonded onto the interposer as the networking die, wherein each of the plurality of functional elements is electrically coupled to at least one of the plurality of network interface units of the networking die through the plurality of metal connections, and wherein at least one of the plurality of functional elements is electrically connected to two or more of the plurality of network interface units; 
 a plurality of functional elements bonded onto the interposer, wherein each of the plurality of functional elements is connected to one of a plurality of ports of the networking die through the plurality of metal connections in the interposer; and 
 a printed circuit board (PCB) bonded to the interposer, wherein the PCB is on an opposite side of the interposer than the plurality of functional elements. 
 
     
     
       10. The package structure of  claim 9 , wherein the interposer is substantially free from active devices built inside the interposer. 
     
     
       11. The package structure of  claim 9 , wherein the plurality of network interface units supports a plurality of different bus protocols. 
     
     
       12. The package structure of  claim 9  further comprising a plurality of additional functional elements bonded directly to the PCB. 
     
     
       13. The package structure of  claim 9 , wherein one of the plurality of network interface units is not directly connected to any functional element external to the interposer. 
     
     
       14. The package structure of  claim 9 , wherein the interposer comprises a silicon substrate. 
     
     
       15. The package structure of  claim 9 , wherein the interposer comprises a dielectric substrate. 
     
     
       16. The package structure of  claim 9  further comprising a plurality of additional functional elements bonded directly to the PCB.