Semiconductor lighting module package

Abstract

A semiconductor lighting module package comprises a substrate, a lead frame, at least one semiconductor lighting element, and a plurality of nanoscale reflectors formed on the substrate and the lead frame for increasing reflection efficiency of the lighting module package. A pitch between every two of the plurality of nanoscale reflectors has a distance P which is shorter than a half wavelength of the visible light. Moreover, a gap between every two of the plurality of the nanoscale reflectors has a depth H, and a ratio of the depth H over the distance P is not less than 2. The distance P is between 90 nm and 130 nm. Furthermore, the light generated by the semiconductor lighting element has at least a part which is reflected by the nanoscale reflectors.

What is claimed is: 
     
       1. A semiconductor lighting module package, comprising:
 a substrate including a first surface and a second surface; 
 a lead frame arranged on the first surface of the substrate with a carrier portion, a first connecting portion, and a second connecting portion, the carrier portion, the first connecting portion and the second connecting portion electrically insulated from each other; 
 a first semiconductor lighting element and a second semiconductor lighting element arranged on the carrier portion and electrically connected to the first connecting portion and the second connecting portion separately; and 
 a plurality of first nanoscale reflectors arranged on the first surface of the substrate, and a plurality of second nanoscale reflectors arranged on the carrier portion of the lead frame, a plurality of third nanoscale reflectors arranged on the first connecting portion of the lead frame, and a plurality of fourth nanoscale reflectors arranged on the second connecting portion of the lead frame; 
 wherein shapes of the plurality of the fourth nanoscale reflectors are different from shapes of the plurality of the first, second and the third nanoscale reflectors; 
 wherein a pitch between every two of the plurality of nanoscale reflectors has a distance which is less than a half wavelength of a visible light; 
 wherein the distance is between 90 nm and 130 nm; and 
 wherein a gap between the every two of the plurality of nanoscale reflectors has a depth, and a ratio of the depth over the distance is not less than 2. 
 
     
     
       2. The semiconductor lighting module package as claimed in  claim 1 , wherein a shape of each of the nanoscale reflectors is selected from the group consisting of trapezoid, inverted trapezoid, elliptical, semicircular, rectangular, pyramidical and inverted pyramidical. 
     
     
       3. The semiconductor lighting module package as claimed in  claim 1 , wherein the plurality of nanoscale reflectors is metal. 
     
     
       4. The semiconductor lighting module package as claimed in  claim 1 , wherein a material for forming the substrate is selected from the group consisting of plastic, polymer, ceramic, silicon and metal. 
     
     
       5. The semiconductor lighting module package as claimed in  claim 1 , wherein the reflective index of the plurality of nanoscale reflectors exceeds the reflective index of the substrate and the lead frame. 
     
     
       6. The semiconductor lighting module package as claimed in  claim 1  further comprising a cover layer on the first surface of the substrate covering the at least one semiconductor lighting element and a part of the lead frame. 
     
     
       7. The semiconductor lighting module package as claimed in  claim 6 , wherein the cover layer further comprises at least one wavelength converting element. 
     
     
       8. A semiconductor lighting module package, comprising:
 a substrate including a first surface and a second surface; 
 a lead frame arranged on the first surface of the substrate with a carrier portion, a first connecting portion, and a second connecting portion, the carrier portion, the first connecting portion and the second connecting portion electrically insulated from each other; 
 a first semiconductor lighting element and a second semiconductor lighting element arranged on the carrier portion and electrically connected to the first connecting portion and the second connecting portion separately; and 
 a plurality of first nanoscale reflectors arranged on the first surface of the substrate, and a plurality of second nanoscale reflectors arranged on the carrier portion of the lead frame, a plurality of third nanoscale reflectors arranged on the first connecting portion of the lead frame, and a plurality of fourth nanoscale reflectors arranged on the second connecting portion of the lead frame; 
 wherein shapes of the plurality of the fourth nanoscale reflectors are different from shapes of the plurality of the first, second and the third nanoscale reflectors.