Semiconductor device packaging having plurality of wires bonding to a leadframe

Abstract

A semiconductor device includes a semiconductor element, a lead, and a wire including a first bonding portion bonded to the semiconductor element and a second bonding portion bonded to the lead. The semiconductor element includes a first bonding surface which faces to a first side in a first direction and to which the first bonding portion is bonded. The lead includes a second bonding surface and a third bonding surface both facing to the first side in the first direction and forming an angle larger than 180° on the first side in the first direction. The semiconductor device further includes a ball bump extending onto both the second bonding surface and the third bonding surface. The second bonding portion is bonded to the lead via the ball bump.

The invention claimed is: 
     
       1. A semiconductor device comprising:
 a semiconductor element; 
 a lead; and 
 a wire including a first bonding portion bonded to the semiconductor element, a second bonding portion bonded to the lead and a bridge portion connecting the first bonding portion and the second bonding portion to each other; wherein, 
 the semiconductor element includes a first bonding surface, the first bonding portion being bonded to the first bonding surface, 
 the lead includes a second bonding surface and a third bonding surface forming an angle larger than 180° at an outside of the lead, 
 the second bonding surface and the third bonding surface are is provided with a ball bump extending on both the second and the third bonding surfaces, 
 the second bonding portion is bonded to the lead via the ball bump, 
 the bridge portion of the wire includes an elongated section connected to the second bonding portion, and 
 the second bonding surface lies between the third bonding surface and the position of the semiconductor element in a direction along which the elongated section of the bridge portion extends as viewed in a normal direction relative to the first bonding surface. 
 
     
     
       2. The semiconductor device according to  claim 1 , wherein the third bonding surface is non-parallel to the first bonding surface. 
     
     
       3. The semiconductor device according to  claim 2 , wherein the second bonding surface is parallel to the first bonding surface. 
     
     
       4. The semiconductor device according to  claim 1 , wherein the second bonding surface and the third bonding surface adjoin to each other with a ridge inbetween. 
     
     
       5. The semiconductor device according to  claim 4 , wherein the second bonding surface and the third bonding surface have an elongated shape and are arranged next to each other in a width direction thereof. 
     
     
       6. The semiconductor device according to  claim 5 , wherein the wire extends from the ball bump in the direction in which the second bonding surface and the third bonding surface are arranged next to each other. 
     
     
       7. The semiconductor device according to  claim 1 , wherein the second bonding portion overlaps the second bonding surface and the third bonding surface as viewed in the normal direction relative to the first bonding surface. 
     
     
       8. The semiconductor device according to  claim 7 , wherein as viewed in the normal direction, an area where the second bonding portion and the second bonding surface overlap each other is larger than an area where the second bonding portion and the third bonding surface overlap each other. 
     
     
       9. The semiconductor device according to  claim 1 , wherein the wire and the ball bump are made of Au. 
     
     
       10. The semiconductor device according to  claim 1 , wherein the lead has a bent shape comprising a front end including the second and the third bonding surfaces, a base end, and a connecting portion connecting the front end and the base end to each other. 
     
     
       11. The semiconductor device according to  claim 10 , further comprising a die bonding portion on which the semiconductor element is mounted,
 wherein the die bonding portion and the base end of the lead are at a same horizontal position in the normal direction relative to the first bonding surface. 
 
     
     
       12. The semiconductor device according to  claim 1 , wherein the semiconductor element is provided with a gate electrode including the first bonding surface, and a source electrode, conduction of the source electrode being controlled by input from the gate electrode,
 the semiconductor device further comprises a main-current lead insulated from the lead, 
 the source electrode and the main-current lead are connected to each other by at least one main-current wire. 
 
     
     
       13. The semiconductor device according to  claim 12 , wherein the main-current wire comprises a plurality of main-current wires. 
     
     
       14. The semiconductor device according to  claim 12 , wherein the main-current wire is made of Cu. 
     
     
       15. The semiconductor device according to  claim 12 , wherein the main-current lead includes a main-current bonding surface to which said at least one main-current wire is bonded. 
     
     
       16. The semiconductor device according to  claim 15 , wherein the main-current bonding surface has an elongated shape, and
 each of the second and the third bonding surfaces has an elongated shape, longitudinal directions of the second and the third bonding surfaces corresponding to a longitudinal direction of the main-current bonding surface. 
 
     
     
       17. The semiconductor device according to  claim 16 , wherein the main-current bonding surface and the second and the third bonding surfaces are parallel to an edge of the semiconductor device and overlap each other in a direction proceeding away from the edge. 
     
     
       18. The semiconductor device according to  claim 1 , further comprising a resin package covering the semiconductor element and the wire. 
     
     
       19. The semiconductor device according to  claim 1  further comprising:
 an additional semiconductor element including an additional first bonding surface; 
 an additional lead including an additional second bonding surface and an additional third bonding surface; and 
 an additional wire bonded to the additional first bonding surface, the additional second bonding surface and the additional third bonding surface; 
 wherein the second and the third bonding surfaces and the additional second and the additional third bonding surfaces are spaced apart from each other with the semiconductor element and the additional semiconductor element positioned therebetween, and the second and the third bonding surfaces and the additional second and the additional third bonding surfaces have elongated shapes, longitudinal directions of the second and the third bonding surfaces and longitudinal directions of the additional second and the additional third bonding surfaces being parallel to each other and perpendicular to a direction in which the second and the third bonding surfaces and the additional second and the additional third bonding surfaces are spaced apart from each other.