P
US9085705B2ActiveUtilityPatentIndex 47

Photosensitive conductive paste and method of producing conductive pattern

Assignee: TORAY INDUSTRIESPriority: Mar 28, 2012Filed: Mar 4, 2013Granted: Jul 21, 2015
Est. expiryMar 28, 2032(~5.7 yrs left)· nominal 20-yr term from priority
Inventors:MIZUGUCHI TSUKURUMATSUBA SATOSHIKUSANO KAZUTAKA
H05K 2201/10151G03F 7/027H05K 1/0296C09D 5/24G03F 7/40G03F 7/038G03F 7/0047H05K 1/092H01B 1/22H05K 1/028H05K 2201/0145H05K 1/095H05K 3/106H05K 2203/0793
47
PatentIndex Score
0
Cited by
20
References
19
Claims

Abstract

A photosensitive conductive paste includes an epoxy acrylate (A) including a urethane bond, a photopolymerization initiator (B), and a conductive filler (C), wherein an added amount of the conductive filler (C) is 70 to 95% by weight with respect to the total solids in the photosensitive conductive paste.

Claims

exact text as granted — not AI-modified
The invention claimed is: 
     
       1. A photosensitive conductive paste comprising:
 an epoxy acrylate (A) comprising a urethane bond; 
 a photopolymerization initiator (B); and 
 a conductive filler (C), 
 wherein an added amount of the conductive filler (C) is 70 to 95% by weight with respect to the total solids in the photosensitive conductive paste. 
 
     
     
       2. The photosensitive conductive paste according to  claim 1 , wherein said epoxy acrylate (A) comprising a urethane bond comprises a carboxyl group. 
     
     
       3. The photosensitive conductive paste according to  claim 2 , wherein said epoxy acrylate (A) comprising a urethane bond has an acid value of 40 to 250 mg KOH/g. 
     
     
       4. The photosensitive conductive paste according to  claim 2 , wherein said epoxy acrylate (A) comprising a urethane bond contains an unsaturated double bond. 
     
     
       5. The photosensitive conductive paste according to  claim 2 , wherein said epoxy acrylate (A) comprising a urethane bond has a bisphenol A skeleton, a bisphenol F skeleton, a biphenyl skeleton or a hydrogenated bisphenol A skeleton. 
     
     
       6. The photosensitive conductive paste according to  claim 2 , wherein said epoxy acrylate (A) comprising a urethane bond has a glass transition temperature of −10 to 60° C. 
     
     
       7. The photosensitive conductive paste according to  claim 1 , wherein said epoxy acrylate (A) comprising a urethane bond has an acid value of 40 to 250 mg KOH/g. 
     
     
       8. The photosensitive conductive paste according to  claim 7 , wherein said epoxy acrylate (A) comprising a urethane bond contains an unsaturated double bond. 
     
     
       9. The photosensitive conductive paste according to  claim 7 , wherein said epoxy acrylate (A) comprising a urethane bond has a bisphenol A skeleton, a bisphenol F skeleton, a biphenyl skeleton or a hydrogenated bisphenol A skeleton. 
     
     
       10. The photosensitive conductive paste according to  claim 7 , wherein said epoxy acrylate (A) comprising a urethane bond has a glass transition temperature of −10 to 60° C. 
     
     
       11. The photosensitive conductive paste according to  claim 1 , wherein said epoxy acrylate (A) comprising a urethane bond contains an unsaturated double bond. 
     
     
       12. The photosensitive conductive paste according to  claim 11 , wherein said epoxy acrylate (A) comprising a urethane bond has a bisphenol A skeleton, a bisphenol F skeleton, a biphenyl skeleton or a hydrogenated bisphenol A skeleton. 
     
     
       13. The photosensitive conductive paste according to  claim 11 , wherein said epoxy acrylate (A) comprising a urethane bond has a glass transition temperature of −10 to 60° C. 
     
     
       14. The photosensitive conductive paste according to  claim 1 , wherein said epoxy acrylate (A) comprising a urethane bond has a bisphenol A skeleton, a bisphenol F skeleton, a biphenyl skeleton or a hydrogenated bisphenol A skeleton. 
     
     
       15. The photosensitive conductive paste according to  claim 14 , wherein said epoxy acrylate (A) comprising a urethane bond has a glass transition temperature of −10 to 60° C. 
     
     
       16. The photosensitive conductive paste according to  claim 1 , wherein said epoxy acrylate (A) comprising a urethane bond has a glass transition temperature of −10 to 60° C. 
     
     
       17. The photosensitive conductive paste according to  claim 1 , further comprising a dicarboxylic acid or an acid anhydride thereof (D). 
     
     
       18. A method of producing a conductive pattern comprising:
 coating the photosensitive conductive paste according to  claim 1  on a substrate, drying, exposing and developing the thus coated photosensitive conductive paste; and 
 subsequently curing said photosensitive conductive paste at a temperature of 100° C. to 300° C. 
 
     
     
       19. A touch panel comprising the conductive pattern produced by the method of  claim 18 .

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.