P
US9117976B2ActiveUtilityPatentIndex 92

Flexible light-emitting device

Assignee: SEMICONDUCTOR ENERGY LABPriority: Oct 16, 2008Filed: Nov 7, 2013Granted: Aug 25, 2015
Est. expiryOct 16, 2028(~2.3 yrs left)· nominal 20-yr term from priority
Inventors:HATANO KAORUSEO SATOSHINAGATA TAKAAKIOKANO TATSUYA
G02F 1/136209Y02E10/549G06F 1/1641H10K 59/873H10K 59/8722H10K 59/8721H10K 59/80524H10K 59/124H10D 86/40H10D 86/423H10D 86/0214H10D 86/60H10D 30/6745H10D 30/6732H10H 20/833H10H 20/85H01L 27/1225H01L 51/0097H01L 2251/558H01L 33/48H01L 2251/5338H01L 27/1266H01L 27/3244H01L 27/1214H01L 51/5237H10K 77/111H10K 2102/311G02F 1/136222H05B 33/14H10K 71/80G02F 1/1368H10K 59/30H10K 50/125H10K 50/844H10K 2102/351H10K 59/38H10K 59/12H10K 50/8423H10K 50/828H10K 59/1201H10K 50/8426H10K 50/84H10K 2101/27H10K 50/865Y02P70/50
92
PatentIndex Score
17
Cited by
128
References
16
Claims

Abstract

It is an object to provide a flexible light-emitting device with long lifetime in a simple way and to provide an inexpensive electronic device with long lifetime using the flexible light-emitting device. A flexible light-emitting device is provided, which includes a substrate having flexibility and a light-transmitting property with respect to visible light; a first adhesive layer over the substrate; an insulating film containing nitrogen and silicon over the first adhesive layer; a light-emitting element including a first electrode, a second electrode facing the first electrode, and an EL layer between the first electrode and the second electrode; a second adhesive layer over the second electrode; and a metal substrate over the second adhesive layer, wherein the thickness of the metal substrate is 10 μm to 200 μm inclusive. Further, an electronic device using the flexible light-emitting device is provided.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A light-emitting device comprising:
 a substrate having flexibility; 
 an adhesive; 
 an insulating film over the substrate having flexibility, the insulating film comprising nitrogen and silicon; 
 a light-emitting element over the insulating film; 
 a layer capable of preventing entry of moisture over the light-emitting element; and 
 a second adhesive between the light-emitting element and the layer capable of preventing entry of moisture, 
 wherein the adhesive is provided between the light-emitting element and the substrate having flexibility, 
 wherein the insulating film is provided between the substrate having flexibility and the light-emitting element, and 
 wherein the light-emitting element comprises:
 a first electrode; 
 a second electrode over the first electrode; and 
 an electroluminescence layer interposed between the first electrode and the second electrode, the electroluminescence layer comprising an organic compound. 
 
 
     
     
       2. The light-emitting device according to  claim 1 , wherein the layer capable of preventing entry of moisture is a metal substrate. 
     
     
       3. The light-emitting device according to  claim 1 , wherein the substrate having flexibility is capable of transmitting visible light. 
     
     
       4. The light-emitting device according to  claim 1 , wherein the substrate having flexibility is a plastic substrate. 
     
     
       5. An electronic device comprising the light-emitting device according to  claim 1 , the electronic device comprising at least one of a FPC, an IC chip, a printed wiring board, and a housing. 
     
     
       6. A light-emitting device comprising:
 a substrate having flexibility; 
 an adhesive; 
 an insulating film over the substrate having flexibility, the insulating film comprising nitrogen and silicon; 
 a light-emitting element over the insulating film; 
 a metal capable of preventing entry of moisture over the light-emitting element; and 
 a second adhesive between the light-emitting element and the metal capable of preventing entry of moisture, 
 wherein the adhesive is provided between the light-emitting element and the substrate having flexibility, 
 wherein the insulating film is provided between the substrate having flexibility and the light-emitting element, and 
 wherein the light-emitting element comprises:
 a first electrode; 
 a second electrode over the first electrode; and 
 an electroluminescence layer interposed between the first electrode and the second electrode, the electroluminescence layer comprising an organic compound. 
 
 
     
     
       7. The light-emitting device according to  claim 6 , wherein the metal capable of preventing entry of moisture is a metal substrate. 
     
     
       8. The light-emitting device according to  claim 6 , wherein the substrate having flexibility is capable of transmitting visible light. 
     
     
       9. The light-emitting device according to  claim 6 , wherein the substrate having flexibility is a plastic substrate. 
     
     
       10. An electronic device comprising the light-emitting device according to  claim 6 , the electronic device comprising at least one of a FPC, an IC chip, a printed wiring board, and a housing. 
     
     
       11. A light-emitting device comprising:
 a substrate having flexibility; 
 an adhesive; 
 an insulating film over the substrate having flexibility, the insulating film comprising nitrogen and silicon; 
 a light-emitting element over the insulating film; 
 a transistor over the insulating film, the transistor is electrically connected to the light-emitting element; 
 a layer capable of preventing entry of moisture over the light-emitting element; and 
 a second adhesive between the light-emitting element and the layer capable of preventing entry of moisture, 
 wherein the adhesive is provided between the light-emitting element and the substrate having flexibility, 
 wherein the insulating film is provided between the substrate having flexibility and the light-emitting element, and 
 wherein the light-emitting element comprises:
 a first electrode; 
 a second electrode over the first electrode; and 
 an electroluminescence layer interposed between the first electrode and the second electrode, the electroluminescence layer comprising an organic compound. 
 
 
     
     
       12. The light-emitting device according to  claim 11 ,
 wherein the transistor comprises a semiconductor layer and a gate electrode which overlap with each other, 
 wherein the semiconductor layer comprises polysilicon. 
 
     
     
       13. The light-emitting device according to  claim 11 , wherein the layer capable of preventing entry of moisture is a metal substrate. 
     
     
       14. The light-emitting device according to  claim 11 , wherein the substrate having flexibility is capable of transmitting visible light. 
     
     
       15. The light-emitting device according to  claim 11 , wherein the substrate having flexibility is a plastic substrate. 
     
     
       16. An electronic device comprising the light-emitting device according to  claim 11 , the electronic device comprising at least one of a FPC, an IC chip, a printed wiring board, and a housing.

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