Methods of forming wirings in electronic devices

Abstract

A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate, except on the first wire; forming a surface treatment film on the material layer; and forming a second wire on the first wire. The surface treatment film has physical properties opposite to the first wire. A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate and the first wire; removing a portion of the material layer from the first wire; forming a surface treatment film on the material layer and the first wire; removing a portion of the surface treatment film from the first wire; and forming a second wire on the first wire. A thickness of the material layer on the substrate is greater than a thickness of the first wire on the substrate.

What is claimed is: 
     
       1. A method of forming a wiring, the method comprising:
 forming a first wire on a region of a substrate; 
 forming a material layer having a thickness greater than that of the first wire on the substrate, except on the first wire; 
 forming a surface treatment film on an upper surface of the material layer; and 
 forming a second wire on the first wire; 
 wherein the surface treatment film has physical properties opposite to that of a surface of the first wire, 
 wherein the first wire is hydrophilic for the second wire, and 
 wherein the surface treatment film is hydrophobic for the second wire. 
 
     
     
       2. The method of  claim 1 , wherein forming a first wire is performed before or after forming a material layer on the substrate. 
     
     
       3. The method of  claim 1 , wherein forming a surface treatment film comprises:
 coating a solution that includes a component of the surface treatment film on the first wire and the material layer; 
 drying the coated solution; and 
 removing the dried resultant product from the surface of the first wire. 
 
     
     
       4. The method of  claim 3 , wherein removing the dried resultant product from the surface of the first wire comprises irradiating UV rays on a remaining film, after drying the coated solution, until the first wire is exposed. 
     
     
       5. The method of  claim 4 , wherein the UV rays are deep UV rays or UV-ozone rays. 
     
     
       6. The method of  claim 1 , wherein forming a material layer and forming a surface treatment film on an upper surface of the material layer comprises:
 sequentially forming the material layer and the surface treatment film on the substrate; 
 removing a portion of the surface treatment film corresponding to the first wire; and 
 removing a portion of the material layer corresponding to the first wire. 
 
     
     
       7. The method of  claim 6 , wherein removing a portion of the surface treatment film corresponding to the first wire comprises irradiating UV rays on the portion of the surface treatment film corresponding to the first wire. 
     
     
       8. The method of  claim 6 , wherein the first wire is formed before the material layer is formed. 
     
     
       9. The method of  claim 6 , wherein the first wire is formed after removing a portion of the material layer corresponding to the first wire. 
     
     
       10. The method of  claim 6 , further comprising:
 removing contaminants from a surface where the surface treatment film is formed before forming the surface treatment film. 
 
     
     
       11. The method of  claim 10 , wherein removing contaminants comprises irradiating UV rays or plasma onto the surface where the surface treatment film is formed. 
     
     
       12. The method of  claim 11 , wherein the plasma is oxygen plasma or argon plasma. 
     
     
       13. The method of  claim 1 , wherein forming a second wire on the first wire comprises inkjet printing conductive ink that includes a component of the second wire on the first wire. 
     
     
       14. The method of  claim 1 , further comprising:
 removing contaminants from a surface where the surface treatment film is formed before forming the surface treatment film. 
 
     
     
       15. The method of  claim 1 , wherein the material layer is an organic material layer or an inorganic material layer. 
     
     
       16. The method of  claim 1 , wherein the surface treatment film is a hydrophobic film, and
 wherein the surface treatment film is an organic material film that comprises a self-assembled monolayer or a fluorine group polymer compound. 
 
     
     
       17. The method of  claim 16 , wherein the self-assembled monolayer is an organic silicon compound film. 
     
     
       18. The method of  claim 17 , wherein the organic silicon compound film includes RSiX 3 , where R is an n-alkylsilane compound and X is a halogen or an alkoxy group. 
     
     
       19. The method of  claim 1 , wherein the first wire is at least one of a wiring that connects a semiconductor device and a power source, a wiring that connects a semiconductor device and another semiconductor device, a wiring that connects a semiconductor device and a connection wire, a wiring that connects a semiconductor device and a pixel, and a wiring that connects two separated contacts. 
     
     
       20. A method of forming a wiring, the method comprising:
 forming a first wire on a substrate; 
 forming a material layer on the substrate and the first wire; 
 removing a portion of the material layer from the first wire; 
 forming a surface treatment film on the material layer and the first wire; 
 removing a portion, of the surface treatment film from the first wire; and 
 forming a second wire on the first wire; 
 wherein a thickness of the material layer on the substrate is greater than a thickness of the first wire on the substrate, 
 wherein the first wire is hydrophilic for the second wire, and 
 wherein the surface treatment film is hydrophobic for the second wire. 
 
     
     
       21. The method of  claim 20 , wherein forming a second wire on the first wire comprises inkjet printing conductive ink that includes a component of the second wire on the first wire. 
     
     
       22. The method of  claim 20 , wherein the material layer is an organic material layer. 
     
     
       23. The method of  claim 20 , wherein the material layer is an inorganic material layer. 
     
     
       24. The method of  claim 20 , wherein a surface of the first wire is hydrophilic. 
     
     
       25. The method of  claim 20 , wherein a surface of the substrate is hydrophilic. 
     
     
       26. The method of  claim 20 , wherein a surface of the substrate is hydrophobic. 
     
     
       27. The method of  claim 20 , wherein a surface of the surface treatment film is hydrophobic. 
     
     
       28. The method of  claim 20 , further comprising:
 removing contaminants from a surface of the material layer before forming the surface treatment film on the material layer. 
 
     
     
       29. The method of  claim 20 , further comprising:
 removing contaminants from a surface of the first wire before forming the surface treatment film on the first wire.