LED array member and integrated control module assembly having active circuitry

Abstract

An LAM/ICM assembly comprises an integrated control module (ICM) and an LED array member (LAM). The ICM includes interconnect through which power from outside the assembly is received. In a first novel aspect, active circuitry is embedded in the ICM. In one example, the circuitry monitors LED operation, controls and supplies power to the LEDs, and communicates information into and out of the assembly. In a second novel aspect, a lighting system comprises an AC-to-DC converter and a LAM/ICM assembly. The AC-to-DC converter outputs a substantially constant current or voltage. The magnitude of the current or voltage is adjusted by a signal output from the LAM/ICM. In a third novel aspect, the ICM includes a switching DC-to-DC converter. An AC-to-DC power supply supplies a roughly regulated supply voltage. The switching converter within the LAM/ICM receives the roughly regulated voltage and supplies a regulated LED drive current to its LEDs.

What is claimed is: 
     
       1. An apparatus for use with a light emitting diode (LED) array member (LAM), wherein the LAM comprises a substrate member, a plurality of LED dice disposed on the substrate member, and an amount of luminescent material disposed over the LED dice, the apparatus comprising:
 electronic circuitry that monitors and supplies power to the LAM when the LAM is coupled to the apparatus; 
 an interconnect structure with an inside lip of an opening, wherein the inside lip of the interconnect structure is attached to the LAM when the LAM is coupled to the apparatus; and 
 an encapsulant that encases the interconnect structure and the electronic circuitry, wherein the interconnect structure is adapted to hold the LAM in thermal contact with a heat sink such that a bottom surface of the substrate member of the LAM is in thermal contact with the heat sink and such that light emitted from the plurality of LED dice passes in a direction away from the heat sink through the opening in the interconnect structure, and wherein the apparatus comprises no LED. 
 
     
     
       2. The apparatus of  claim 1 , wherein the substrate member of the LAM has an upper peripheral edge that is substantially the same size as the inside lip of the opening of the interconnect structure. 
     
     
       3. The apparatus of  claim 1 , wherein the interconnect structure is a multi-layer printed circuit board, and wherein the electronic circuitry is mounted to the multi-layer printed circuit board. 
     
     
       4. The apparatus of  claim 1 , wherein the interconnect structure includes a patterned sheet metal, and wherein the electronic circuitry is mounted to the patterned sheet metal. 
     
     
       5. The apparatus of  claim 1 , wherein the interconnect structure is a flexible printed circuit, and wherein the electronic circuitry is mounted to the flexible printed circuit. 
     
     
       6. The apparatus of  claim 1 , wherein the encapsulant forms an upper surface of the apparatus, and wherein the encapsulant also contacts the electronic circuitry. 
     
     
       7. The apparatus of  claim 1 , wherein the encapsulant forms an upper surface of the apparatus, and wherein the upper surface has a substantially circular outer peripheral edge. 
     
     
       8. The apparatus of  claim 1 , wherein at least two cylindrical holes in the encapsulant and the interconnect structure are located outside the opening on opposite sides of the opening, and wherein each of the cylindrical holes extends from a bottom surface of the apparatus to an upper surface of the apparatus. 
     
     
       9. The apparatus of  claim 1 , wherein the electronic circuitry is a microcontroller. 
     
     
       10. The apparatus of  claim 1 , wherein the electronic circuitry includes an amount of digital logic. 
     
     
       11. The apparatus of  claim 1 , wherein the electronic circuitry is a part of a radio frequency (RF) transmitter. 
     
     
       12. The apparatus of  claim 1 , wherein the electronic circuitry is disposed within an electronic package, and wherein a part of the electronic package forms a part of a bottom surface of the apparatus. 
     
     
       13. The apparatus of  claim 1 , wherein the apparatus comprises a first power terminal and a second power terminal, wherein a current flows in through the first power terminal and out through the second power terminal. 
     
     
       14. The apparatus of  claim 13 , wherein the apparatus further comprises a third terminal, wherein a digital signal is communicated out of the apparatus through the third terminal. 
     
     
       15. The apparatus of  claim 1 , wherein power is supplied to the LED dice through the electronic circuitry. 
     
     
       16. An integrated control module (ICM) comprising:
 a molded encapsulant material that is formed such that the ICM defines a central opening, wherein the central opening has a peripheral edge; 
 an interconnect structure with an inside lip under the peripheral edge of the central opening, wherein contact pads are disposed on the inside lip of the interconnect structure; 
 a first power terminal disposed on an upper surface of the ICM; 
 a second power terminal disposed on the upper surface of the ICM; and 
 electronic circuitry that controls a light emitting diode (LED), wherein the electronic circuitry is at least in part encapsulated by the molded encapsulant material, wherein the electronic circuitry is coupled to be powered via the contact pads and the first and second power terminals, and wherein the ICM comprises no LED. 
 
     
     
       17. The ICM of  claim 16 , further comprising:
 a third terminal through which digital signals are communicated out of the ICM. 
 
     
     
       18. An apparatus for use with a light emitting diode (LED) array member (LAM), wherein the LAM comprises a substrate member, a plurality of LED dice disposed on the substrate member, and an amount of luminescent material disposed over the LED dice, the apparatus comprising:
 electronic circuitry that monitors and supplies power to the LAM when the LAM is coupled to the apparatus; 
 means for mechanically and electrically attaching the LAM to the apparatus solely through contact pads on an upper surface of the LAM; and 
 an encapsulant that encases the means and the electronic circuitry, wherein the means holds the LAM in thermal contact with a heat sink such that a bottom surface of the substrate member of the LAM is in thermal contact with the heat sink and such that light emitted from the plurality of LED dice passes in a direction away from the heat sink through an opening in the means, and wherein the apparatus comprises no LED. 
 
     
     
       19. The apparatus of  claim 18 , wherein the means is a structure taken from the group consisting of: a printed circuit structure, a printed circuit board structure, a flexible printed circuit structure, a patterned metal layer structure, and a metal lead frame structure. 
     
     
       20. The apparatus of  claim 18 , wherein the means is also for providing holes through which threaded members can extend and engage the heat sink so that the threaded members pull the means toward the heat sink and thereby press the LAM against the heat sink.