Composition for encapsulant, encapsulant, and electronic device

Abstract

A composition for an encapsulant, an encapsulant, and an electronic device, the composition including an adhesion-promoting agent, the adhesion-promoting agent including an epoxy group in an amount of about 2.0 to about 5.0 mmol/g, at least one first polysiloxane that includes a hydrogen bound to a silicon at a terminal end thereof, and at least one second polysiloxane that includes an alkenyl group bound to a silicon at a terminal end thereof.

What is claimed is: 
     
       1. A composition for an encapsulant, the composition comprising:
 at least one first polysiloxane that includes a hydrogen bound to a silicon at a terminal end thereof, 
 at least one second polysiloxane that includes an alkenyl group bound to a silicon at a terminal end thereof, and 
 an adhesion-promoting agent, the adhesion-promoting agent being a third siloxane represented by the following Chemical Formula 1,
   (R 1 R 2 R 3 SiO 1/2 ) M1 (R 4 R 5 SiO 2/2 ) D1 (R 6 SiO 3/2 ) T1 (R 7 SiO 3/2 ) T2 (SiO 4/2 ) Q1   [Chemical Formula 1]
 
 
 wherein, in the above Chemical Formula 1,
 R 1  to R 7  are each independently hydrogen, a hydroxy group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, an epoxy group-containing group, a substituted or unsubstituted C1 to C30 carbonyl group, or a combination thereof, 
 at least one of R 1  to R 3  is a hydroxy group, 
 at least one of R 4  or R 5  is an epoxy group-containing group, 
 at least one of R 1  to R 7  is a substituted or unsubstituted C2 to C30 alkenyl group, 
 0<M1<1, 0<D1<1, 0≦T1<1, 0≦T2<1, 0≦Q1<1, and 
 M1+D1+T1+T2+Q1=1, 
 
 wherein the first polysiloxane, the second polysiloxane, and third siloxane are each different from one another, and 
 wherein composition includes the third siloxane in an amount such the composition includes about 0.100 to about 0.250 mmol of epoxy group per gram of the composition. 
 
     
     
       2. The composition for an encapsulant as claimed in  claim 1 , wherein the adhesion-promoting agent is included in the composition in an amount of about 0.5 to about 10 wt %, based on a total weight of the composition. 
     
     
       3. The composition for an encapsulant as claimed in  claim 1 , wherein the first polysiloxane is represented by the following Chemical Formula 2:
   (R 8 R 9 R 10 SiO 1/2 ) M2 (R 11 R 12 SiO 2/2 ) D2 (R 13 SiO 3/2 ) T3 (SiO 3/2 —Y 1 —SiO 3/2 ) T4 (SiO 4/2 ) Q2   [Chemical Formula 2]
 
 wherein, in the above Chemical Formula 2, 
 R 8  to R 13  are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxy group, or a combination thereof, 
 at least one of R 8  to R 13  is hydrogen, 
 Y 1  is a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, a substituted or unsubstituted C2 to C20 heteroarylene group, a substituted or unsubstituted C2 to C20 alkenylene group, a substituted or unsubstituted C2 to C20 alkynylene group, or a combination thereof, 
 0<M2<1, 0≦D2<1, 0≦T3<1, 0≦T4<1, 0≦Q2<1, and 
 M2+D2+T3+T4+Q2=1. 
 
     
     
       4. The composition for an encapsulant as claimed in  claim 1 , wherein the second polysiloxane is represented by the following Chemical Formula 3:
   (R 14 R 15 R 16 SiO 1/2 ) M3 (R 17 R 18 SiO 2/2 ) D3 (R 19 SiO 3/2 ) T5 (SiO 3/2-Y   2 —SiO 3/2 ) T6 (SiO 4/2 ) Q3   [Chemical Formula 3]
 
 wherein, in the above Chemical Formula 3, 
 R 14  to R 19  are each independently a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxy group, or a combination thereof, 
 at least one of R 14  to R 19  is a substituted or unsubstituted C2 to C30 alkenyl group, 
 Y 2  is a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, a substituted or unsubstituted C2 to C20 heteroarylene group, a substituted or unsubstituted C2 to C20 alkenylene group, a substituted or unsubstituted C2 to C20 alkynylene group, or a combination thereof, 
 0<M3<1, 0≦D3<1, 0≦T5<1, 0≦T6<1, 0≦Q3<1, and 
 M3+D3+T5+T6+Q3=1. 
 
     
     
       5. The composition for an encapsulant as claimed in  claim 1 , wherein the composition includes:
 about 10 to about 40 wt % of the first polysiloxane, and 
 about 60 to about 90 wt % of the second polysiloxane, all amounts being based on a total weight of the composition for an encapsulant. 
 
     
     
       6. An encapsulant obtained by curing the composition for an encapsulant as claimed in  claim 1 . 
     
     
       7. An electronic device comprising the encapsulant as claimed in  claim 6 . 
     
     
       8. The composition for an encapsulant as claimed in  claim 1 , wherein at least one of R 4  to R 7  is a substituted or unsubstituted C6 to C30 aryl group, the at least one of R 4  to R 7  that is the substituted or unsubstituted C6 to C30 aryl group being different from the at least one of R 4  or R 5  that is the epoxy group-containing group.