US9187808B2ActiveUtilityA1

Ni-base dual multi-phase intermetallic compound alloy containing Ti and C, and manufacturing method for same

51
Assignee: TAKASUGI TAKAYUKIPriority: Mar 26, 2010Filed: Mar 25, 2011Granted: Nov 17, 2015
Est. expiryMar 26, 2030(~3.7 yrs left)· nominal 20-yr term from priority
B22D 21/025C22C 19/03C22F 1/10
51
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Cited by
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References
14
Claims

Abstract

The present invention provides an Ni-base dual multi-phase intermetallic compound alloy which has a dual multi-phase microstructure including: a primary precipitate L1 2 phase and an (L1 2 +D0 22 ) eutectoid microstructure, and which comprises more than 5 atomic % and up to 13 atomic % of Al; at least 9.5 atomic % and less than 17.5 atomic % of V; between 0 atomic % and 5.0 atomic % inclusive of Nb; more than 0 atomic % and up to 12.5 atomic % of Ti; more than 0 atomic % and up to 12.5 atomic % of C; and a remainder comprising Ni.

Claims

exact text as granted — not AI-modified
The invention claimed is: 
     
       1. An Ni-base intermetallic compound alloy which has a dual multi-phase microstructure comprising a primary precipitate L1 2  phase and an (L1 2 +D0 22 ) eutectoid microstructure, and which comprises:
 more than 5 atomic % and up to 13 atomic % of Al; 
 at least 9.5 atomic % and less than 17.5 atomic % of V; 
 between 0 atomic % and 5.0 atomic % inclusive of Nb; 
 more than 0 atomic % and up to 12.5 atomic % of Ti; 
 more than 0 atomic % and up to 12.5 atomic % of C; and 
 a remainder comprising Ni, wherein Ti and C are included in the dual multi-phase microstructure as a solid solution. 
 
     
     
       2. The Ni-base intermetallic compound alloy according to  claim 1 , wherein the Ti content is more than 0 atomic % and up to 4.6 atomic %, and the C content is more than 0 atomic % and up to 4.6 atomic %. 
     
     
       3. The Ni-base intermetallic compound alloy according to  claim 1 , wherein the Ti content is between 0.2 atomic % and 2.4 atomic % inclusive, and the C content is between 0.2 atomic % and 2.4 atomic % inclusive. 
     
     
       4. The Ni-base intermetallic compound alloy according to  claim 1 , formed by adding TiC to Al, V, Nb and Ni as the alloy materials. 
     
     
       5. The Ni-base intermetallic compound alloy according to  claim 1 , further comprising more than 0 ppm by weight and up to 1000 ppm by weight of B. 
     
     
       6. The Ni-base intermetallic compound alloy according to  claim 5 , wherein the B content is between 50 ppm by weight and 1000 ppm by weight inclusive. 
     
     
       7. The Ni-base intermetallic compound alloy according to  claim 1 , wherein the Al content is between 6 atomic % and 10 atomic % inclusive, the V content is at least 12.0 atomic % and less than 16.5 atomic %, and the Nb content is between 1 atomic % and 4.5 atomic % inclusive. 
     
     
       8. An Ni-base intermetallic compound alloy which has a dual multi-phase microstructure comprising a primary precipitate L1 2  phase and an (L1 2 +D0 22 ) eutectoid microstructure, and which comprises:
 more than 5 atomic % and up to 13 atomic % of Al; 
 at least 9.5 atomic % and less than 17.5 atomic % of V; 
 between 0 atomic % and 5.0 atomic % inclusive of Nb; 
 more than 0 atomic % and up to 12.5 atomic % of Ti; 
 more than 0 atomic % and up to 12.5 atomic % of C; and 
 a remainder comprising Ni, wherein Ti and C are contained as TiC. 
 
     
     
       9. The Ni-base intermetallic compound alloy according to  claim 8 , having a different microstructure from the dual multi-phase microstructure, the microstructure containing TiC. 
     
     
       10. An Ni-base intermetallic compound alloy which has a dual multi-phase microstructure comprising a primary and L1 2  phase and an (L1 2 +D0 22 ) eutectoid microstructure, and which comprises:
 more than 5 atomic % and up to 13 atomic % of Al; 
 at least 9.5 atomic % and less than 17.5 atomic % of V; 
 between 0 atomic % and 5.0 atomic % inclusive of Nb; 
 more than 0 atomic % and up to 12.5 atomic % of Ti; 
 more than 0 atomic % and up to 12.5 atomic % of C; and 
 a remainder comprising Ni, wherein V, Ti and C form a microstructure comprising (V,Ti)C. 
 
     
     
       11. An Ni-base intermetallic compound alloy comprising a dual multi-phase microstructure and a microstructure comprising (V,Ti)C, the Ni-base intermetallic compound alloy obtained by a manufacturing method comprising the steps of:
 forming a microstructure in which a primary precipitate L1 2  phase and an A1 phase coexist by slow cooling a molten metal containing more than 5 atomic % and up to 13 atomic % of Al, at least 9.5 atomic % and less than 17.5 atomic % of V, between 0 atomic % and 5.0 atomic % inclusive of Nb, more than 0 atomic % and up to 12.5 atomic % of Ti, more than 0 atomic % and up to 12.5 atomic % of C, and a remainder comprising Ni; and 
 decomposing the A1 phase into an L1 2  phase and a D0 22  phase by cooling the microstructure in which the primary precipitate L1 2  phase and the A1 phase coexist. 
 
     
     
       12. The Ni-base intermetallic compound alloy according to  claim 11 , wherein the manufacturing method further comprises homogenization heat treatment or solution heat treatment. 
     
     
       13. The Ni-base intermetallic compound alloy according to  claim 12 , wherein the homogenization heat treatment or the solution heat treatment is performed at a temperature from 1503 K to 1603 K. 
     
     
       14. A method for manufacturing an Ni-base intermetallic compound alloy, comprising the steps of:
 preparing an ingot from a molten metal containing more than 5 atomic % and up to 13 atomic % of Al, at least 9.5 atomic % and less than 17.5 atomic % of V, between 0 atomic % and 5.0 atomic % inclusive of Nb, more than 0 atomic % and up to 12.5 atomic % of Ti, more than 0 atomic % and up to 12.5 atomic % of C, and a remainder comprising Ni; 
 giving a first heat treatment to the ingot at a temperature at which a primary precipitate L1 2  phase and an A1 phase coexist; and 
 decomposing the A1 phase into an L1 2  phase and a D0 22  phase by cooling after the first heat treatment.

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