Conductivity of resin materials and composite materials

Abstract

A resin material is provided which comprises at least one thermoset resin, carbon conductive additive material, and at least one thermoplastic polymer resin. The thermoplastic polymer resin dissolves in the thermoset polymer resin and phase separates upon cure. There is also provided a method of making the resin material, and additionally a composite material that comprising said resin material in combination with a fibrous reinforcement. The resin material and composite material may each be used in an uncured or cured form, and may find particular use as a prepreg material.

The invention claimed is: 
     
       1. A resin material comprising:
 from 10 wt % to 80 wt %, based on the total weight of said resin material of a non-thermoplastic polymer phase comprising uncured epoxy resin; 
 from 2 wt % to 10 wt %, based on the total weight of said resin material, of a thermoplastic polymer selected from the group consisting of block copolymers of styrene-butadiene-methacrvlate, and block copolymers of methylmethacrylate-butylacrylate-methyl methacrylate, which upon curing of said uncured epoxy resin, forms phase separated domains of thermoplastic polymer located within said non-thermoplastic polymer; and 
 from 1 wt % to 5 wt %, based on the total weight of said resin material, of carbon nanofibres having a diameter of from 110 nanometers to 150 nanometers and lengths in the range of 1 μm to 10 μm wherein, upon curing of said epoxy resin, said carbon nanofibres become located only in said non-thermoplastic polymer phase so as to form an electrically conductive connective network therein. 
 
     
     
       2. A resin material according to  claim 1 , which additionally comprises carbon nanotubes. 
     
     
       3. A composite material, said composite material comprising a resin material according to  claim 2  and a fibrous reinforcement. 
     
     
       4. A resin material according to  claim 2  wherein the carbon nanotubes have a diameter in range of 1 nm to 50 nm and a length in the range of 0.1 μm to 5 μm. 
     
     
       5. A composite material, said composite material comprising a resin material according to  claim 4  and a fibrous reinforcement. 
     
     
       6. A composite material, said composite material comprising a resin material according to  claim 1  and a fibrous reinforcement. 
     
     
       7. A composite material according to  claim 6  wherein said uncured epoxy resin is selected from the group consisting of bisphenol-A diglycidyl ether and bisphenol-F diglycidyl ether. 
     
     
       8. A composite material according to  claim 7  wherein said uncured epoxy resin is bisphenol-F diglycidyl ether. 
     
     
       9. A composite material according to  claim 8  wherein said thermoplastic polymer is a block copolymer of methyl methacrylate-butylacrylate-methyl methacrylate. 
     
     
       10. A composite material according to  claim 9  which further includes a curing agent consisting of 4,4′ diaminodiphenylsulphone. 
     
     
       11. A composite material according to  claim 6  which further includes a curing agent. 
     
     
       12. A resin material according to  claim 1  wherein said uncured epoxy resin is selected from the group consisting of bisphenol-A diglycidyl ether and bisphenol-F diglycidyl ether. 
     
     
       13. A resin material according to  claim 12  wherein said uncured epoxy resin is bisphenol-F diglycidyl ether. 
     
     
       14. A resin material according to  claim 13  wherein said thermoplastic polymer is a block copolymer of methyl methacrylate-butylacrylate-methyl methacrylate. 
     
     
       15. A resin material according to  claim 14  which further includes a curing agent consisting of 4,4′ diaminodiphenylsulphone. 
     
     
       16. A resin material according to  claim 1  which further includes a curing agent.