Light emitting diode package and backlight unit including the same

Abstract

Provided are a light emitting diode package and a backlight assembly including the light emitting diode package. The light emitting diode package may comprise a package main body including a cavity; a light emitting diode (LED) chip positioned in the cavity; a lead frame installed in the package main body, positioned in the cavity at least partly, electrically connected to the light emitting diode chip mounted on the lead frame, and having one surface having a diffusion reflective layer thereon.

What is claimed is: 
     
       1. A light emitting diode package comprising:
 a package main body including a cavity; 
 a light emitting diode (LED) chip positioned in the cavity; 
 a lead frame installed in the package main body, positioned in the cavity at least partly, electrically connected to the light emitting diode chip mounted on the lead frame, and having one surface having a diffusion reflective layer thereon, wherein the diffusion reflective layer comprises light diffuser particles composed of one selected from group including silicon resin, polyacrylate, polyurethane, polyethylene, polypropylene, nylon, polystyrene, polymethylmethacrylate, polycarbonate, CaCO 3 , BaSO 4 , silica, TiO 2 , alumina, CeO 2 , ZnO, talc, mica, and a mixture thereof. 
 
     
     
       2. The light emitting diode package of  claim 1 , further comprising a protection resin that fills in the cavity to protect the light emitting diode chip. 
     
     
       3. The light emitting diode package of  claim 2 , wherein the protection resin comprises at least one phosphor selected from the group including garnets, silicates, sulfides, oxynitrides, nitrides, and aluminates. 
     
     
       4. The light emitting diode package of  claim 1 , wherein the diffusion reflective layer is in a region that overlaps the cavity. 
     
     
       5. A light emitting diode package comprising:
 a package main body including a cavity; 
 a light emitting diode (LED) chip positioned in the cavity; 
 a lead frame installed in the package main body, positioned in the cavity at least partly, electrically connected to the light emitting diode chip mounted on the lead frame, and having one surface having a mirror reflective layer thereon, the mirror reflective layer having a diffusion reflective pattern thereon, wherein the diffusion reflective pattern is a dot pattern. 
 
     
     
       6. The light emitting diode package of  claim 5 , further comprising a protection resin that fills in the cavity to protect the light emitting diode chip. 
     
     
       7. The light emitting diode package of  claim 6 , wherein the protection resin comprises at least one phosphor selected from the group including garnets, silicates, sulfides, oxynitrides, nitrides, and aluminates. 
     
     
       8. The light emitting diode package of  claim 5 , wherein the mirror reflective layer is a silver (Ag)-plated layer. 
     
     
       9. The light emitting diode package of  claim 5 , wherein the diffusion reflective pattern comprises light diffuser particles composed of one selected from the group including silicon resin, polyacrylate, polyurethane, polyethylene, polypropylene, nylon, polystyrene, polymethylmethacrylate, polycarbonate, CaCO 3 , BaSO 4 , silica, TiO 2 , alumina, CeO 2 , ZnO, talc, mica, and a mixture thereof. 
     
     
       10. The light emitting diode package of  claim 5 , wherein the diffusion reflective pattern is in a region that overlaps the cavity. 
     
     
       11. The light emitting diode package of  claim 5 , wherein the dot pattern is one selected from the group including a matrix type, a radial type, and a circular type. 
     
     
       12. A light emitting diode package comprising:
 a printed circuit board including an insulating board, a circuit pattern printed on the insulating board, and a diffusion reflective layer on the circuit pattern, wherein the diffusion reflective layer comprises light diffuser particles composed of one selected from the group including silicon resin polyacrylate, polyurethane, polyethylene, polypropylene, nylon, polystyrene, polymethylmethacrylate, polycarbonate, CaCO 3 , BaSO 4 , silica, TiO 2 , alumina, CeO 2 , ZnO, talc, mica and a mixture thereof; and 
 a light emitting diode chip mounted on the diffusion reflective layer and electrically connected to the printed circuit board. 
 
     
     
       13. A light emitting diode package comprising:
 a printed circuit board including an insulating board, a circuit pattern printed on the insulating board, a mirror reflective layer on the circuit pattern, and a diffusion reflective pattern on the mirror reflective layer, wherein the diffusion reflective pattern is a dot pattern; and
 a light emitting diode chip mounted on the diffusion reflective pattern and electrically connected to the printed circuit board. 
 
 
     
     
       14. The light emitting diode package of  claim 13 , wherein the mirror reflective layer is a silver (Ag)-plated layer. 
     
     
       15. The light emitting diode package of  claim 13 , wherein the diffusion reflective pattern comprises light diffuser particles composed of one selected from the group including silicon resin, polyacrylate, polyurethane, polyethylene, polypropylene, nylon, polystyrene, polymethylmethacrylate, polycarbonate, CaCO 3 , BaSO 4 , silica, TiO 2 , alumina, CeO 2 , ZnO, talc, mica, and a mixture thereof. 
     
     
       16. The light emitting diode package of  claim 13 , wherein the dot pattern is one selected from the group including a matrix type, a radial type, and a circular type.