Resin for thermal imprinting

Abstract

A cyclic-olefin-based thermoplastic resin for thermal imprint to be used in the production of a sheet or a film which contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]<30. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved.

The invention claimed is: 
     
       1. A method of using a cyclic-olefin-based thermoplastic resin for an imprint process, the resin being used for producing a film by spin coating method, and containing at least one of skeletons represented by a chemical equation 9 or a chemical equation 10 in a main chain, and wherein:
 a glass transition temperature Tg (° C.) of the resin and a value ([M]) of MFR at 260° C. satisfy a equation 1; and
   [ M ]<20 and Tg>90° C.
 
 
 and wherein the chemical equation 9 is represented by: 
 
       
         
           
           
               
               
           
         
         the chemical equation 10 is represented by: 
       
       
         
           
           
               
               
           
         
         and the equation 1 is:
   Tg(° C.)>219×log[ M ]−160;
 
 
         and further wherein R 1  to R 29  in chemical equation 9 and chemical equation 10 may differ or may be same, each of which is a substituent containing a hydrogen atom, a deuterium atom, a hydrocarbon radical having a carbon number of 1 to 15, a halogen atom, or a hetero atom of oxygen, sulfur, or the like, and may form a monocyclic or polycyclic structure with one another; 
         m and n are integers greater than or equal to 0; and, 
         [M] in equation 1 represents a value of MFR at 260° C. 
       
     
     
       2. A thermal imprint method comprising:
 manufacturing a film comprising a resin for thermal imprint by spin coating method; and
 pressing a mold, which is heated to a temperature less than or equal to a glass transition temperature Tg (° C.) of the resin for thermal imprint+65° C., against the film thereby transferring a micrometer- or nanometer-scale pattern of the mold; 
 
 
       wherein the resin comprise a cyclic-olefin-based thermoplastic resin that contains at least one of skeletons, represented by a chemical equation 3 or a chemical equation 4, in a main chain; 
       a glass transition temperature Tg (° C.) of the resin and a value ([M]) of MFR at 260° C. satisfy a following equation 1; and
   [ M ]<20 and Tg>90° C.;
 
 
       and wherein the chemical equation 3 is represented by: 
       
         
           
           
               
               
           
         
       
       the chemical equation 4 is represented by: 
       
         
           
           
               
               
           
         
       
       and the equation 1 is:
   Tg(° C.)>219×log[ M ]−160;
 
 
       and further, wherein R 1  to R 29  in chemical equation 3 and chemical equation 4 may differ or may be same, each of which is a substituent containing a hydrogen atom, a deuterium atom, a hydrocarbon radical having a carbon number of 1 to 15, a halogen atom, or a hetero atom of oxygen, sulfur, or the like, and may form a monocyclic or polycyclic structure with one another; 
       m and n are integers greater than or equal to 0; and, 
       [M] in equation 1 represents a value of MFR at 260° C. 
     
     
       3. A thermal imprint method comprising steps of:
 manufacturing a film comprising a resin for thermal imprint by spin coating method;
 pressing a mold against the film; and 
 releasing the mold from the resin for thermal imprint at a temperature greater than or equal to a glass transition temperature (Tg) of the resin for thermal imprint−25° C.; 
 
 
       wherein the resin comprise a cyclic-olefin-based thermoplastic resin that contains at least one of skeletons, represented by a chemical equation 3 or a chemical equation 4, in a main chain; 
       a glass transition temperature Tg (° C.) of the resin and a value ([M]) of MFR at 260° C. satisfy a following equation 1; and
   [ M ]<20 and Tg>90° C.;
 
 
       and wherein the chemical equation 3 is represented by: 
       
         
           
           
               
               
           
         
       
       the chemical equation 4 is represented by: 
       
         
           
           
               
               
           
         
       
       and the equation 1 is:
   Tg(° C.)>219×log[ M ]−160;
 
 
       and further, wherein R 1  to R 29  in chemical equation 3 and chemical equation 4 may differ or may be same, each of which is a substituent containing a hydrogen atom, a deuterium atom, a hydrocarbon radical having a carbon number of 1 to 15, a halogen atom, or a hetero atom of oxygen, sulfur, or the like, and may form a monocyclic or polycyclic structure with one another; 
       m and n are integers greater than or equal to 0; and, 
       [M] in equation 1 represents a value of MFR at 260° C. 
     
     
       4. A thermal imprint method comprising steps of:
 manufacturing a film comprising a resin for thermal imprint by spin coating method;
 pressing a mold against the film at less than or equal to 2.5 MPa, thereby transferring a micrometer- or nanometer-scale pattern of the mold; 
 
 
       wherein the resin comprise a cyclic-olefin-based thermoplastic resin that contains at least one of skeletons, represented by a chemical equation 3 or a chemical equation 4, in a main chain; 
       a glass transition temperature Tg (° C.) of the resin and a value ([M]) of MFR at 260° C. satisfy a following equation 1; and
   [ M ]<20 and Tg>90° C.;
 
 
       and wherein the chemical equation 3 is represented by: 
       
         
           
           
               
               
           
         
       
       the chemical equation 4 is represented by: 
       
         
           
           
               
               
           
         
       
       and the equation 1 is:
   Tg(° C.)>219×log[ M ]−160;
 
 
       and further, wherein R 1  to R 29  in chemical equation 3 and chemical equation 4 may differ or may be same, each of which is a substituent containing a hydrogen atom, a deuterium atom, a hydrocarbon radical having a carbon number of 1 to 15, a halogen atom, or a hetero atom of oxygen, sulfur, or the like, and may form a monocyclic or polycyclic structure with one another; 
       m and n are integers greater than or equal to 0; and, 
       [M] in equation 1 represents a value of MFR at 260° C. 
     
     
       5. The method of  claim 1 , wherein the cyclic-olefin-based thermoplastic resin is a copolymer of at least one cyclic-olefin represented by a chemical equation 5 and α-olefin, or a polymer produced by hydrogenation after ring-opening polymerization of the cyclic-olefin;
 wherein chemical equation 5 is represented by: 
 
       
         
           
           
               
               
           
         
         and further wherein R 30  to R 48  in chemical equation 5 may differ or may be same, each of which is a substituent containing a hydrogen atom, a deuterium atom, a hydrocarbon radical having a carbon number of 1 to 15, a halogen atom, or a hetero atom of oxygen, sulfur, or the like, and may form a monocyclic or polycyclic structure with one another; and, 
         m and n are integers greater than or equal to 0. 
       
     
     
       6. The method of  claim 2 , wherein the cyclic-olefin-based thermoplastic resin is a copolymer of at least one cyclic-olefin represented by a chemical equation 5 and α-olefin, or a polymer produced by hydrogenation after ring-opening polymerization of the cyclic-olefin;
 wherein chemical equation 5 is represented by: 
 
       
         
           
           
               
               
           
         
         and further wherein R 30  to R 48  in chemical equation 5 may differ or may be same, each of which is a substituent containing a hydrogen atom, a deuterium atom, a hydrocarbon radical having a carbon number of 1 to 15, a halogen atom, or a hetero atom of oxygen, sulfur, or the like, and may form a monocyclic or polycyclic structure with one another; and, 
         m and n are integers greater than or equal to 0. 
       
     
     
       7. The method of  claim 3 , wherein the cyclic-olefin-based thermoplastic resin is a copolymer of at least one cyclic-olefin represented by a chemical equation 5 and α-olefin, or a polymer produced by hydrogenation after ring-opening polymerization of the cyclic-olefin;
 wherein chemical equation 5 is represented by: 
 
       
         
           
           
               
               
           
         
         and further wherein R 30  to R 48  in chemical equation 5 may differ or may be same, each of which is a substituent containing a hydrogen atom, a deuterium atom, a hydrocarbon radical having a carbon number of 1 to 15, a halogen atom, or a hetero atom of oxygen, sulfur, or the like, and may form a monocyclic or polycyclic structure with one another; and, 
         m and n are integers greater than or equal to 0. 
       
     
     
       8. The method of  claim 4 , wherein the cyclic-olefin-based thermoplastic resin is a copolymer of at least one cyclic-olefin represented by a chemical equation 5 and α-olefin, or a polymer produced by hydrogenation after ring-opening polymerization of the cyclic-olefin;
 wherein chemical equation 5 is represented by: 
 
       
         
           
           
               
               
           
         
         and further wherein R 30  to R 48  in chemical equation 5 may differ or may be same, each of which is a substituent containing a hydrogen atom, a deuterium atom, a hydrocarbon radical having a carbon number of 1 to 15, a halogen atom, or a hetero atom of oxygen, sulfur, or the like, and may form a monocyclic or polycyclic structure with one another; and, 
         m and n are integers greater than or equal to 0.