Semiconductor device and method of manufacturing the same

Abstract

A soldering portion ( 4 ) and a Ni plating mark ( 5 ) are simultaneously forming by plating on a wiring pattern ( 2 ) of an insulating substrate ( 1 ). A semiconductor chip ( 6 ) is mounted on the insulating substrate ( 1 ). A position of the insulating substrate ( 1 ) is recognized by the Ni plating mark ( 5 ) and a wire ( 7 ) is bonded to the semiconductor chip ( 6 ). An electrode ( 8 ) is joined to the soldering portion ( 4 ) by solder ( 9 ). The insulating substrate ( 1 ), the semiconductor chip ( 6 ), the wire ( 7 ), and the electrode ( 8 ) are encapsulated in an encapsulation material ( 13 ).

The invention claimed is: 
     
       1. A method of manufacturing a semiconductor device comprising:
 simultaneously forming a soldering portion and a mark by plating on a wiring pattern of an insulating substrate; 
 mounting a semiconductor chip on the insulating substrate; 
 recognizing a position of the insulating substrate by the mark and bonding a wire to the semiconductor chip; 
 joining an electrode to the soldering portion by a solder; and 
 encapsulating the insulating substrate, the semiconductor chip, the wire, and the electrode in an encapsulation material. 
 
     
     
       2. A method of manufacturing a semiconductor device comprising:
 forming a soldering portion and a mark on a wiring pattern of an insulating substrate; 
 mounting a semiconductor chip on the insulating substrate; 
 recognizing a position of the insulating substrate by the mark and bonding a wire to the semiconductor chip; 
 joining an electrode to the soldering portion by a solder; and 
 encapsulating the insulating substrate, the semiconductor chip, the wire, and the electrode in an encapsulation material, 
 wherein a spacing between the soldering portion and the mark is set to at least 5 mm. 
 
     
     
       3. A semiconductor device comprising:
 an insulating substrate including a wiring pattern; 
 a soldering portion provided on the wiring pattern; 
 a mark provided on the wiring pattern and formed of same material as the soldering portion; 
 a semiconductor chip mounted on the insulating substrate; 
 a wire bonded to the semiconductor chip; 
 an electrode joined to the soldering portion by a solder; and 
 an encapsulation material encapsulating the insulating substrate, the semiconductor chip, the wire, and the electrode.