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US9260788B2ActiveUtilityPatentIndex 52

Reinforced articles and methods of making the same

Assignee: GEN ELECTRICPriority: Oct 30, 2012Filed: Oct 30, 2012Granted: Feb 16, 2016
Est. expiryOct 30, 2032(~6.3 yrs left)· nominal 20-yr term from priority
Inventors:LIN DECHAOFENG GANJIANGKOTTILINGAM SRIKANTH CHANDRUDU
F01D 5/284B23H 9/10C23C 28/3455F01D 5/282B23K 9/04Y10T428/24322B23K 9/013F01D 5/288C23C 28/3215
52
PatentIndex Score
0
Cited by
49
References
8
Claims

Abstract

An article comprising a substrate; a bond layer disposed on the substrate, the bond layer comprising one or more bonding segments and at least one reinforcing segment; at least one protective layer disposed on the bond layer; and at least one cooling hole extending through the substrate, the at least one reinforcing segment and the at least one protective layer, wherein the at least one reinforcing segment reduces cracking and/or delamination at the interface between the substrate and the bond layer, and methods of making the same.

Claims

exact text as granted — not AI-modified
The invention claimed is:  
     
       1. A method comprising:
 providing a substrate, the substrate having a surface; 
 forming one or more bonding segments on one or more portions of the surface of the substrate, 
 forming at least one reinforcing segment on a portion of the surface of the substrate, the at least one reinforcing segment being formed on the surface of the substrate by electrospark deposition, wherein the one or more bonding segments and the at least one reinforcing segment form a bond layer; 
 forming at least one protective layer on the bond layer, 
 forming at least one cooling hole, the at least one cooling hole extending through the substrate, the at least one reinforcing segment and the at least one protective layer, 
 wherein forming the one or more bonding segments comprises forming a continuous layer on the surface of the substrate and removing at least one portion of the continuous layer simultaneously with forming the at least one reinforcing segment. 
 
     
     
       2. The method of  claim 1 , wherein the substrate comprises a metal, a metal alloy, a ceramic or a ceramic matrix composite. 
     
     
       3. The method of  claim 1 , wherein the at least one reinforcing segment and the one or more bonding segments have the same or substantially the same coefficient of thermal expansion. 
     
     
       4. The method of  claim 1 , wherein the at least one reinforcing segment is formed using a material which is also used to form the one or more bonding segments. 
     
     
       5. The method of  claim 1 , wherein the at least one cooling hole is disposed at an angle of inclination which is not perpendicular or substantially perpendicular to the surface of the substrate. 
     
     
       6. The method of  claim 1 , wherein the at least one protective layer comprises at least two layers. 
     
     
       7. The method of  claim 1 , wherein the substrate is a gas turbine engine component. 
     
     
       8. The method of  claim 1 , wherein the substrate is a turbine blade, a turbine vane, a turbine shroud, a turbine liner, a turbine combustor, a turbine transition piece, a turbine rotor component, a turbine exhaust flap, a turbine seal or a turbine fuel nozzle.

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