Flat panel display device having thin film encapsulation and, manufacturing method thereof

Abstract

A flat panel display device and a manufacturing method thereof. In the flat panel display device, a thin film encapsulation structure covering a display unit on a substrate includes an alternating layers stack in which organic layers and inorganic layers are alternately stacked; and an AlOx layer on the alternating layers stack as an outermost thin film layer of the thin film encapsulation structure. According to the above structure, because the protective film is adhered onto the AlOx layer of the thin film encapsulation structure, which has a relatively weak adhesive force, the adhering and releasing processes may be performed smoothly, and thus, the thin film encapsulation structure may be prevented from being damaged in the adhering and releasing processes.

What is claimed is: 
     
       1. An intermediate structure for a flat panel display device, the intermediate structure comprising:
 a substrate; 
 a display unit on the substrate; 
 a thin film encapsulation structure comprising a plurality of thin film layers covering the display unit, wherein the thin film layers of the thin film encapsulation structure comprise:
 an alternating layers stack comprising alternately stacked at least one organic layer and at least one inorganic layer, one layer of the at least one inorganic layer being an outermost thin film layer of the alternating layers stack; and 
 an aluminum oxide (AlOx) layer on the alternating layers stack, the AlOx layer being an outermost thin film layer of the thin film encapsulation structure; and 
 
 a protective film adhered onto the aluminum oxide (AlOx) layer, wherein an adhesive force of the protective film to the outermost thin film layer of the alternating layers stack is greater than an adhesive force of the protective film to the aluminum oxide (AlOx) layer.