Electronic module and method for the production thereof

Abstract

The invention relates to an electronic module, a support plate ( 2 ) having a base area ( 20 ) and at least one connection element ( 21 ). Said connection element ( 21 ) is a part of the base area ( 20 ) and is arranged at an angle (a) to the base area ( 20 ), in addition to at least one electronic component ( 3 ), in particular a sensor, which is arranged in the connection element ( 21 ).

What is claimed is: 
     
       1. An electronic module, comprising:
 a support plate ( 2 ) having a base area ( 20 ) and at least one connection element ( 21 ) extending from the base area ( 20 ), wherein said at least one connection element ( 21 ) is arranged at a non-zero angle (α) relative to the base area ( 20 ), 
 at least one electronic component ( 3 ) coupled to the at least one connection element ( 21 ), and 
 a detent connection ( 10 ) on the at least one connection element ( 21 ), the detent connection ( 10 ) is configured to connect the at least one connection element ( 21 ) to a counter body ( 4 ). 
 
     
     
       2. The electronic module according to  claim 1 , characterized in that the at least one electronic component is arranged in an end portion ( 21   a ) of the at least one connection element ( 21 ). 
     
     
       3. The electronic module according to  claim 1 , characterized in that at least one of the at least one connection element ( 21 ) or the support plate ( 2 ) is surrounded by a sealing compound or a foaming material. 
     
     
       4. The electronic module according to  claim 1 , characterized in that the at least one connection element ( 21 ) includes a plurality of connection elements ( 21 ) that each extend from the base area ( 20 ), wherein the connection elements ( 21 ) have various lengths. 
     
     
       5. The electronic module according to  claim 1 , furthermore comprising a base plate ( 8 ), the support plate ( 2 ) being disposed on the base plate ( 8 ). 
     
     
       6. The electronic module according to  claim 1 , characterized in that the at least one electronic component is at least one sensor. 
     
     
       7. The electronic module according to  claim 1 , characterized in that the at least one connection element ( 21 ) includes a plurality of connection elements ( 21 ) that each extend from the base area ( 20 ) and are each arranged at non-angles (α) to the base area ( 20 ). 
     
     
       8. The electronic module according to  claim 1 , furthermore comprising a base plate ( 8 ), which is a sheet metal plate, the support plate ( 2 ) being disposed on the base plate ( 8 ). 
     
     
       9. The electronic module according to  claim 1 , wherein the detent connection ( 10 ) includes a lug ( 11 ) on the at least one connection element ( 21 ). 
     
     
       10. The electronic module according to  claim 9 , further comprising the counter body ( 4 ), wherein the counter body ( 4 ) has a recess ( 12 ) that is configured to receive the lug ( 11 ). 
     
     
       11. The electronic module according to  claim 1 , wherein the detent connection ( 10 ) includes a recess ( 12 ) on the at least one connection element ( 21 ). 
     
     
       12. The electronic module according to  claim 11 , further comprising the counter body ( 4 ) having a lug ( 11 ) configured to be received within the recess ( 12 ). 
     
     
       13. The electronic module according to  claim 1 , wherein the at least one connection element ( 21 ) is integrally formed with the base area ( 20 ). 
     
     
       14. A structural component, comprising:
 an electronic module according to  claim 1 , and 
 the counter body ( 4 ) having a recess ( 5 ), 
 wherein at least one end portion ( 21   a ) of the at least one connection element ( 21 ) being disposed in the recess ( 5 ). 
 
     
     
       15. The structural component according to  claim 14 , characterized in that the recess ( 5 ) is a blind hole. 
     
     
       16. The structural component according to  claim 14 , characterized in that the recess ( 5 ) is filled with a sealing compound. 
     
     
       17. The structural component according to  claim 16 , characterized in that the recess ( 5 ) is a blind hole. 
     
     
       18. A method for producing an electronic module, comprising the steps:
 a) equipping a support plate ( 2 ) with at least one electronic component ( 3 ), 
 b) forming a connection element ( 21 ) from the support plate ( 2 ), the at least one electronic component ( 3 ) being situated on the connection element ( 21 ), 
 (c) forming a detent connection ( 10 ) on the connection element ( 21 ), the detent connection ( 10 ) is configured to connect the connection element ( 21 ) to a counter body ( 4 ), and 
 d) bending the connection element ( 21 ) out of a plane of the support plate ( 2 ),
 wherein step a) is carried out prior to or after step b). 
 
 
     
     
       19. The method according to  claim 18 , characterized in that the connection element ( 21 ) is milled out of the support plate ( 2 ) prior to the step of the bending. 
     
     
       20. The method according to  claim 18 , characterized in that the at least one electronic component ( 3 ) is at least one sensor.