Electronic module

Abstract

The invention relates to an electronic module comprising at least one electronic or electric component ( 3 ), a base plate ( 4 ), and a support plate ( 2 ), in particular a printed circuit board or a substrate. Said support plate ( 2 ) is arranged on the base plate ( 4 ) and comprises conductor paths. Said base plate ( 4 ) comprises a blind hole-type recess ( 5 ) on a side oriented towards the support plate ( 2 ). The component ( 3 ) is in contact on the support plate ( 2 ) and is arranged in the recess ( 5 ) of the base plate ( 4 ).

The invention claimed is: 
     
       1. An electronic module, comprising:
 at least one electronic or electric component ( 3 ), 
 a base plate ( 4 ) and 
 a support plate ( 2 ), said support plate ( 2 ) being arranged on the base plate ( 4 ) and comprising conductor paths, 
 wherein said base plate ( 4 ) comprises a blind hole-type recess ( 5 ) on a side oriented towards the support plate ( 2 ), 
 wherein the at least one electronic or electric component ( 3 ) is mounted on the support plate ( 2 ) and is arranged in the recess ( 5 ) of the base plate ( 4 ), and 
 wherein the support plate ( 2 ) comprises a base area ( 20 ) and at least one connection element ( 21 ), which is integrally formed with the base area ( 20 ) and is positioned at a non-zero angle (α) to said base area ( 20 ), a sensor ( 6 ) being arranged in the at least one connection element ( 21 ). 
 
     
     
       2. The electronic module according to  claim 1 , characterized in that at least one sensor ( 6 ,  8 ) is arranged on a side of the support plate ( 2 ) facing away from the base plate ( 4 ). 
     
     
       3. The electronic module according to  claim 1 , characterized in that the at least one electronic or electric component ( 3 ) is an interference suppression component. 
     
     
       4. The electronic module according to  claim 3 , characterized in that the interference suppression component is arranged on the support plate ( 2 ) facing the base plate ( 4 ) in proximity of a component in which interference is to be suppressed. 
     
     
       5. The electronic module according to  claim 1 , characterized in that the at least one electronic or electric component ( 3 ) is a HDI printed circuit board. 
     
     
       6. The electronic module according to  claim 1 , characterized in that a cavity ( 5   a ) of the recess ( 5 ) is completely or partially filled with a sealing compound. 
     
     
       7. The electronic module according to  claim 1 , characterized in that the base plate ( 4 ) is embodied as a cooling plate. 
     
     
       8. The electronic module according to  claim 1 , characterized in that the at least one electronic or electric component ( 3 ) arranged in the recess ( 5 ) is fixedly bonded in said recess ( 5 ) by means of an adhesive. 
     
     
       9. The electronic module according to  claim 1 , further comprising a reinforcing element ( 7 ) which supports the connection element ( 21 ). 
     
     
       10. The electronic module according to  claim 1 , characterized in that the support plate ( 2 ) is a printed circuit board or a substrate. 
     
     
       11. The electronic module according to  claim 1 , characterized in that the base plate ( 4 ) is embodied as a cooling plate made from aluminum. 
     
     
       12. The electronic module according to  claim 1 , characterized in that a cavity ( 5   a ) of the recess ( 5 ) is completely or partially filled with a sealing compound which has a very good thermal conductivity.