Display device and method of manufacturing the same

Abstract

A method of manufacturing a display device includes providing a display panel including a first alignment mark on one side of opposite facing sides, obtaining location information of the first alignment mark by imaging the one side of the display panel, providing a flexible printed circuit board that includes a second alignment mark and a subsidiary mark on one side of the flexible printed circuit board, the subsidiary mark being spaced apart from the display panel and being spaced a predetermined distance apart from the second alignment mark, aligning the first alignment mark and the second alignment mark by disposing the subsidiary mark to be spaced the predetermined distance apart from the first alignment mark on the basis of the location information of the first alignment mark, and bonding the display panel and the flexible printed circuit board.

What is claimed is: 
     
       1. A method of manufacturing a display device comprising:
 providing a display panel including opposite facing sides and a first alignment mark on one side of the opposite facing sides; 
 obtaining location information of the first alignment mark by imaging the one side of the display panel; 
 providing a flexible printed circuit board that includes a second alignment mark and a subsidiary mark on one side of the flexible printed circuit board, 
 wherein the one side of the flexible printed circuit board faces the one side of the display panel, and 
 wherein the subsidiary mark is spaced apart from the display panel in a plan view, and the second alignment mark and the subsidiary mark are spaced a predetermined distance apart from each other in a first direction; 
 aligning the first alignment mark and the second alignment mark by disposing the subsidiary mark to be spaced the predetermined distance apart from the first alignment mark on the basis of the location information of the first alignment mark; and 
 bonding the display panel and the flexible printed circuit board in which the first and second alignment marks are aligned. 
 
     
     
       2. The method as claimed in  claim 1 , further comprising obtaining location information of the subsidiary mark by imaging the one side of the flexible printed circuit board. 
     
     
       3. The method as claimed in  claim 2 , wherein the location information of the first alignment mark is still image data and the location information of the subsidiary mark is real time video data. 
     
     
       4. The method as claimed in  claim 3 , further comprising, after obtaining the location information of the first alignment mark, displaying the location information of the first alignment mark on an alignment monitor. 
     
     
       5. The method as claimed in  claim 4 , further comprising, after obtaining the location information of the subsidiary mark, overlapping the location information of the first alignment mark displayed on the alignment monitor and the location information of the subsidiary mark by displaying the location information of the subsidiary mark on the alignment monitor. 
     
     
       6. The method as claimed in  claim 1 , wherein the flexible printed circuit board is made of a semitransparent or opaque material. 
     
     
       7. The method as claimed in  claim 6 , wherein the flexible printed circuit board is a chip on film. 
     
     
       8. The method as claimed in  claim 1 , further comprising a polarizing plate on another one of the opposite facing sides of the display panel, the another one of the opposite facing sides being opposite the one side of the display panel. 
     
     
       9. The method as claimed in  claim 8 , wherein the polarizing plate has a phase difference of ¼ wavelength. 
     
     
       10. The method as claimed in  claim 1 , wherein a black pattern covering at least the first alignment mark is on another one of the opposite facing sides of the display panel, the another one of the opposite facing sides being opposite the one side of the display panel. 
     
     
       11. The method as claimed in  claim 1 , wherein the display panel includes a base substrate and a display layer, the display layer being disposed on the base substrate to display an image, and the base substrate being made of an opaque material. 
     
     
       12. The method as claimed in  claim 1 , further comprising disposing an anisotropic conductive film on the one side of the display panel covering the first alignment mark. 
     
     
       13. The method as claimed in  claim 12 , wherein the bonding of the display panel and the flexible printed circuit board compresses the display panel and the flexible printed circuit board with the anisotropic conductive film therebetween. 
     
     
       14. The method as claimed in  claim 13 , wherein the bonding of the display panel and the flexible printed circuit board includes;
 pre-compressing the display panel and the flexible printed circuit substrate; and 
 main-compressing the display panel and the flexible printed circuit board to electrically connect the display panel and the flexible printed circuit board through the anisotropic conductive film.