Miniature microphone, protection frame thereof and method for manufacturing the same

Abstract

A method of manufacturing a protection frame used in a miniature microphone is provided. In one embodiment, the method comprises the steps of: (1) preparing a substrate made of an insulating material with a prescribed thickness and a prescribed area; (2) forming a plurality of holes at prescribed intervals on the substrate; (3) forming a first metal shielding layer on the inner surface of each of the plurality of holes formed on the substrate; (4) filling an insulating material in the plurality of holes; (5) forming a plurality of extended portions on the surfaces of both sides of the substrate, each extended portion covering a part of the end face of the insulating material and the whole end face of the first metal shielding layer of a hole; (6) forming a cavity in each insulating material-filled hole, the caliber of each cavity being slightly smaller than the inner caliber of the corresponding extended portion formed in the above mentioned step (5); and (7) cutting the plurality of holes from the substrate to produce a collection of protection frames.

What is claimed is: 
     
       1. A method of manufacturing a protection frame used in a miniature microphone comprising:
 (1) preparing a substrate made of a material that is insulating with a prescribed thickness and a prescribed area; 
 (2) forming a plurality of holes at prescribed intervals on the substrate; 
 (3) forming a first metal shielding layer on an inner surface of each of the plurality of holes formed on the substrate; 
 (4) filling an insulating material in the plurality of holes; 
 (5) forming a plurality of extended portions on surfaces of opposing sides of the substrate, each extended portion covering a part of an end face of the insulating material and a whole end face of the first metal shielding layer of one of the plurality of holes; 
 (6) forming a cavity in each of the plurality of holes that are filled with the insulating material, a caliber of each cavity being slightly smaller than an inner caliber of the extended portions formed in the above mentioned step (5); and 
 (7) cutting the plurality of holes from the substrate to produce a collection of protection frames. 
 
     
     
       2. A method of manufacturing a protection frame used in a miniature microphone comprising:
 (1) preparing a substrate made of a material that is insulating with a prescribed thickness and a prescribed area; 
 (2) forming a plurality of adjacent holes at prescribed positions on the substrate, contours of the holes are partially overlapped to form slits, but any two of the adjacent holes at any corner of rectangular processing regions are not overlapped; 
 (3) forming a first metal shielding layer on the inner surface of each of the plurality of holes; 
 (4) filling an insulating material in the plurality of holes; 
 (5) forming a plurality of extended portions on surfaces of opposing sides of the substrate, each extended portion covering a part of an end face of the insulating material and an end face of the first metal shielding layer of one of the plurality of holes; 
 (6) forming a cavity in each of the holes filled with the insulating material, a caliber of each of the cavities being slightly smaller than an inner caliber of the extended portions formed in the above mentioned step (5); and 
 (7) cutting the plurality of holes from the substrate to produce a collection of protection frames. 
 
     
     
       3. The method of  claim 1 , further comprising:
 installing capacitance components and conductive parts in each of the plurality of holes before step (7). 
 
     
     
       4. The method of  claim 2 , further comprising:
 installing capacitance components and conductive parts in each of the plurality of holes before step (7). 
 
     
     
       5. The method of  claim 1 , further comprising:
 installing circuit board substrates and bottom plates, both equal in number to the holes, at upper part and bottom part, respectively, of the substrate, before step (7). 
 
     
     
       6. The method of  claim 2 , further comprising:
 installing circuit board substrates and bottom plates, both equal in number to the holes, at the upper part and the bottom part, respectively, of the substrate, before step (7).