Electronic packaged device and manufacturing method thereof

Abstract

A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.

What is claimed is: 
     
       1. An electronic package device manufacturing method, comprising:
 configuring a plurality of electronic components on a surface of a substrate carrier; forming an encapsulating member on the surface of the substrate carrier to cover the electronic components; separating the substrate carrier from the encapsulating member; forming a plurality of first trenches and a plurality of first grounding trenches on a first surface of the encapsulating member; disposing conductive material on the first surface of the encapsulating member, in the first trenches, and in the first grounding trenches to form a conductive layer and a plurality of grounding structures; patterning the conductive layer on the first surface to form a circuit layer, wherein the circuit layer includes at least one grounding pad electrically connected to the grounding structures; forming a plurality of second trenches on a second surface of the encapsulating member corresponding to the first trenches, the second surface being opposite the first surface of the encapsulating member; forming conductive material in the second trenches, and electrically connecting the conductive material in the second trenches and the conductive material in the first trenches to cooperatively form at least one shielding structure in the first and the second trenches; separating the encapsulating member into a plurality of packaged units by cutting through the grounding structures of the encapsulating member; and forming an electromagnetic shielding layer on external surfaces of each of the packaged units with conductive material; wherein the electromagnetic shielding layer is electrically connected to the at least one grounding pad. 
 
     
     
       2. The method as recited in  claim 1 , wherein the formation of the second trenches comprising:
 removing portions of the encapsulating member from the second surface so as to interconnect the first and the second trenches and define at least two encapsulating compartments. 
 
     
     
       3. The method as recited in  claim 1 , further comprising:
 forming a plurality of through holes by removing portions of the encapsulating member in the first trenches after the step of forming the first trenches and the first grounding trenches. 
 
     
     
       4. The method as recited in  claim 3 , wherein the step of disposing conductive material on the first surface of the encapsulating member and in the first trenches further comprising:
 providing suction through the through holes from the second surface of the encapsulating member. 
 
     
     
       5. The method as recited in  claim 4 , wherein the step of forming the second trenches comprising:
 removing portions of the encapsulating member from the second surface proximate to the through holes to remove the through holes and interconnect the first and the second trenches. 
 
     
     
       6. The method as recited in  claim 1  further comprising:
 forming a protective layer to cover the encapsulating member before the step of forming the first trenches and the first grounding trenches. 
 
     
     
       7. The method as recited in  claim 6  further comprising:
 removing the protective layer after the step of forming the first trenches and the first grounding trenches. 
 
     
     
       8. The method as recited in  claim 1  further comprising:
 forming a protective layer to cover the circuit layer before the step of forming the second trenches corresponding to the first trenches on the second surface of the encapsulating member. 
 
     
     
       9. The method as recited in  claim 8  further comprising:
 removing the protective layer after the step of forming an electromagnetic shielding layer on external surfaces of the packaged units with conductive material. 
 
     
     
       10. The method as recited in  claim 1 , wherein the first trenches and the second trenches have different depths. 
     
     
       11. An electronic package device manufacturing method, comprising: configuring a plurality of electronic components on a surface of a substrate carrier; forming an encapsulating member on the surface of the substrate carrier to cover the electronic components; separating the substrate carrier from the encapsulating member; forming a plurality of first trenches and a plurality of first grounding trenches on a first surface of the encapsulating member; disposing conductive material on the first surface of the encapsulating member, in the first trenches and in the first grounding trenches to form a conductive layer; patterning the conductive layer on the first surface to form a circuit layer, wherein the circuit layer includes at least one grounding pad; forming a plurality of second trenches on a second surface of the encapsulating member corresponding to the first trenches, and forming a plurality of second grounding trenches on the second surface of the encapsulating member corresponding to the first grounding trenches; forming conductive material in the second trenches, electrically connecting the conductive material in the second trenches and the conductive material in the first trenches to cooperatively form at least one shielding structure in the first and the second trenches, forming conductive material in the second grounding trenches, and electrically connecting the conductive material in the second grounding trenches an the conductive material in the first grounding trenches to cooperatively form a plurality of grounding structures in the first and the second grounding trenches; and separating the encapsulating member into a plurality of packaged units by cutting through the grounding structures of the encapsulating member; wherein each of the packaged units has an electromagnetic shielding layer covering the encapsulating member and electrically connected to the at least one grounding pad. 
     
     
       12. The method as recited in  claim 11 , wherein the step of forming the second trenches and the second grounding trenches comprising:
 removing portions of the encapsulating member from the second surface thereof to interconnect the first and the second trenches, and removing portions of the encapsulating member from the second surface thereof to interconnect the first and the second grounding trenches. 
 
     
     
       13. The method as recited in  claim 11  further comprising:
 forming a protective layer to cover the encapsulating member before the step of forming the first trenches and the first grounding trenches. 
 
     
     
       14. The method as recited in  claim 13  further comprising:
 removing the protective layer after the step of forming the first trenches and the first grounding trenches. 
 
     
     
       15. The method as recited in  claim 11 , wherein the first trenches and the second trenches have different depths.