US9292102B2ActiveUtilityA1

Controlling and accessing content using motion processing on mobile devices

94
Assignee: INVENSENSE INCPriority: Jan 5, 2007Filed: Jun 5, 2013Granted: Mar 22, 2016
Est. expiryJan 5, 2027(~0.5 yrs left)· nominal 20-yr term from priority
A63F 13/5255A63F 2300/6676A63F 2300/204A63F 2300/105A63F 2300/1031A63F 13/92A63F 13/803A63F 13/235A63F 13/211A63F 2300/8017G03B 17/00G06F 2200/1637H04M 2250/12G06F 1/1626A63F 13/06H04M 1/72583G06F 3/0485G06F 3/0346G06F 3/03G06F 2203/04806G06F 3/017G06F 1/1694G06F 2200/1614A63F 13/428H04M 1/72469
94
PatentIndex Score
20
Cited by
376
References
15
Claims

Abstract

Handheld electronic devices including motion sensing and processing. In one aspect, a handheld electronic device includes a set of motion sensors provided on a single sensor wafer, including at least one gyroscope sensing rotational rate of the device around at least three axes and at least one accelerometer sensing gravity and linear acceleration of the device along the at least three axes. Memory stores sensor data derived from the at least one gyroscope and accelerometer, where the sensor data describes movement of the device including a rotation of the device around at least one of the three axes of the device, the rotation causing interaction with the device. The memory is provided on an electronics wafer positioned vertically with respect to the sensor wafer and substantially parallel to the sensor wafer. The electronics wafer is vertically bonded to and electrically connected to the sensor wafer.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A handheld device comprising:
 a first sub-module including a first sensor sensing rotational motion; 
 a second sub-module including a second sensor sensing linear acceleration; 
 an application processor, wherein the application processor implements different operating modes on the device; 
 a first bus coupling the first sub-module and the second sub-module, the bus enables direct communication of information between the first and second sub-modules; 
 a motion processor for receiving data from the first and second sub-modules; and 
 a second bus coupling the motion processor to the application processor. 
 
     
     
       2. The device of  claim 1 , wherein the first sub-module and the second sub-module are on a single wafer substrate. 
     
     
       3. The device of  claim 1 , wherein the information includes motion data generated by the first and second sensors. 
     
     
       4. The device of  claim 1 , wherein the information includes sensor related data. 
     
     
       5. The device of  claim 1 , wherein the information includes instruction to sensors. 
     
     
       6. The device of  claim 5 , wherein the instruction includes power down instructions. 
     
     
       7. The device of  claim 5 , wherein the instruction includes power up instructions. 
     
     
       8. The device of  claim 5 , wherein the instruction includes directions to adjust operation. 
     
     
       9. The device of  claim 1 , wherein the information includes data related to the operation or functionality of the first sub-module and the second sub-module. 
     
     
       10. The device of  claim 1 , further comprising a shared external bus coupling the first and second sub-modules. 
     
     
       11. The device of  claim 10 , further comprising an application processor coupled to the shared external bus. 
     
     
       12. The device of  claim 11 , further comprising a display coupled to the application processor by a display bus. 
     
     
       13. The device of  claim 11 , further comprising a display coupled to the application processor by the shared external bus. 
     
     
       14. The device of  claim 1 , further comprising an external system bus, wherein a first bus connecting the first sub-module to the external bus and a second bus connects the second sub-module to the external bus. 
     
     
       15. The device of  claim 1 , further comprising an external system bus, where in the bus connects the first and second sub-modules to the external bus.

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