US9318631B2ActiveUtilityA1
Photodiode and method for making the same
Est. expiryJul 16, 2032(~6 yrs left)· nominal 20-yr term from priority
H10F 77/1433H10F 77/211H10F 77/127H10F 10/16H10F 77/143H10F 30/20H01L 31/022425Y02E10/50H01L 31/035218H01L 31/035209H01L 31/072H01L 31/0324
57
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Cited by
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References
12
Claims
Abstract
A method for manufacturing a photodiode including the steps of providing a substrate, solution depositing a quantum nanomaterial layer onto the substrate, the quantum nanomaterial layer including a number of quantum nanomaterials having a ligand coating, and applying a thin-film oxide layer over the quantum nanomaterial layer.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A photodiode comprising:
a substrate comprising doped germanium and a sulfur-passivated surface;
a solution-cast quantum nanomaterial layer positioned on said sulfur-passivated surface of said substrate,
said solution-cast quantum nanomaterial layer comprising a plurality of quantum nanomaterials tuned to absorb radiation within a bandwidth of mid-wavelength infrared and long-wavelength infrared,
each quantum nanomaterial of said plurality of quantum nanomaterials comprising:
a core comprising tin-telluride;
a ligand coating on said core, said ligand coating comprising a metal chalcogenide complex, comprising at least one of tin-sulfide, tin-selenide and tin-telluride; and
a thin-film oxide layer over said solution-cast quantum nanomaterial layer.
2. The photodiode of claim 1 wherein said germanium is doped p-type germanium.
3. The photodiode of claim 1 wherein each quantum nanomaterial of said plurality of quantum nanomaterials has a maximum cross-sectional dimension between 15 nanometers and 50 nanometers.
4. The photodiode of claim 1 wherein said thin-film oxide layer comprises an amorphous oxide semiconductor.
5. The photodiode of claim 1 further comprising a first contact layer on said thin-film oxide layer.
6. The photodiode of claim 5 further comprising a second contact layer on said substrate.
7. A photodiode comprising:
a substrate comprising doped germanium and a sulfur-passivated surface;
a solution-cast quantum nanomaterial layer positioned on said sulfur-passivated surface of said substrate,
said solution-cast quantum nanomaterial layer comprising a plurality of quantum nanomaterials tuned to absorb radiation within a bandwidth of mid-wavelength infrared and long-wavelength infrared,
each quantum nanomaterial of said plurality of quantum nanomaterials comprising:
a core comprising lead-tin-telluride;
a ligand coating on said core, said ligand coating comprising a metal chalcogenide complex, comprising at least one of tin-sulfide, tin-selenide and tin-telluride; and
a thin-film oxide layer over said solution-cast quantum nanomaterial layer.
8. The photodiode of claim 7 wherein said germanium is doped p-type germanium.
9. The photodiode of claim 7 wherein each quantum nanomaterial of said plurality of quantum nanomaterials has a maximum cross-sectional dimension of at least 7.5 nanometers.
10. The photodiode of claim 7 wherein said thin-film oxide layer comprises an amorphous oxide semiconductor.
11. The photodiode of claim 7 further comprising a first contact layer on said thin-film oxide layer.
12. The photodiode of claim 11 further comprising a second contact layer on said substrate.Cited by (0)
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