Electronic circuit, light source device, and method of manufacturing electronic circuit

Abstract

An electronic circuit having an electronic component mounted on a substrate, a light source device having the electronic circuit, and a method of manufacturing the electronic circuit on which the electronic component is mounted on the substrate are described. The electronic component has a plurality of lead pins to be electrically connected to wirings on the substrate. The substrate is formed with a hole having a larger dimension than a maximum distance between at least two lead pins of the lead pins. The lead pins are inserted into the hole from sides of tips of the lead pins while being bent at a plurality of bending portions, and fixed to the substrate by a solder.

What is claimed is: 
     
       1. An electronic circuit, comprising:
 a substrate having a first side and a second side opposite the first side formed with a hole having a larger dimension than a maximum distance between at least two lead pins of a plurality of lead pins of an electronic component; and 
 the electronic component having the plurality of lead pins to be electrically connected to wirings on the substrate, 
 wherein each of the lead pins is inserted in the hole from the first side to the second side of the substrate, and has a tip portion and a plurality of bending portions arranged external to the hole at the second side of the substrate, and 
 wherein each of the lead pins has a portion between the bending portions fixed at the second side of the substrate by solder. 
 
     
     
       2. The electronic circuit according to  claim 1 , wherein bending directions of bending portions of the plurality per lead pin provided at a greatest distance from tips of the lead pins among the plurality of bending portions are equivalent to directions in which the lead pins are separated from each other. 
     
     
       3. The electronic circuit according to  claim 1 , wherein bending directions of bending portions of the plurality per lead pin provided closest to tips of the lead pins among the plurality of bending portions are equivalent to directions in which the lead pins approach each other. 
     
     
       4. The electronic circuit according to  claim 1 , wherein the hole is provided with a positioning notch for each of the lead pins. 
     
     
       5. The electronic circuit according to  claim 1 ,
 wherein the bending portions of each of the lead pins includes:
 a first bending portion; and 
 a second bending portion provided on a tip side of the lead pin as compared to the first bending portion, and 
 
 wherein, for each of the lead pins, the portion is between the first bending portion and the second bending portion of the lead pin and contacts the second side of the substrate. 
 
     
     
       6. The electronic circuit according to  claim 5 , wherein the solder forms a fillet between the first bending portion and the second bending portion. 
     
     
       7. The electronic circuit according to  claim 1 , wherein the electronic component is mounted in plural on the substrate. 
     
     
       8. A light source device, comprising the electronic circuit according to  claim 1 . 
     
     
       9. The electronic circuit according to  claim 1 , wherein the tip portion runs parallel to a central axis of the hole. 
     
     
       10. A method of manufacturing an electronic circuit having an electronic component mounted on a substrate having a first side and a second side opposite the first side, the substrate formed with a hole having a larger dimension than a maximum distance between lead pins of the electronic component, the method comprising:
 inserting the lead pins into the hole; 
 forming, in each of the lead pins, a plurality of bending portions external to the hole at the second side of the substrate; and 
 soldering the lead pins to the substrate at the second side of the substrate, 
 wherein said soldering includes, for each of the lead pins, fixing a portion between the bending portions at the second side of the substrate using solder. 
 
     
     
       11. The method of manufacturing an electronic circuit according to  claim 10 ,
 wherein a positioning notch for each of the lead pins is provided on the hole, and 
 wherein said forming the bending portions includes: 
 causing the lead pins to abut peripheral walls of the notches. 
 
     
     
       12. The method of manufacturing an electronic circuit according to  claim 10 , wherein said soldering includes, for each of the lead pins, the portion between the bending portions contacting the second side of the substrate. 
     
     
       13. The electronic circuit according to  claim 12 , wherein, for each of the lead pins, the parallel running tip portions are offset from the central axis of the hole in an axial direction.