Semiconductor device

Abstract

A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.

The invention claimed is: 
     
       1. A semiconductor device comprising:
 a semiconductor chip having an upper surface and a lower surface; 
 an island having a lower surface, and an upper surface to which the semiconductor chip is bonded; 
 a plurality of leads arranged around the island; 
 for each lead, a bonding wire extending between the upper surface of the semiconductor chip and an upper surface of the lead; and 
 a resin package sealing the semiconductor chip, the island, the plurality of leads and the bonding wires; 
 wherein the leads on a lower surface of the resin package are adapted to allow the semiconductor device to be surface mounted; 
 wherein, in bottom plan view, the island has an area defined by four sides, each of which is not parallel to any sides of the resin package, and for each side of said area of the island the angle between the side of the island and any of the sides of the resin package is less than a perpendicular angle; 
 wherein at least two of the plurality of leads are arranged at respective corners of the semiconductor device in bottom plan view; 
 wherein each of the plurality of leads has a side facing a respective one of the four sides of the area of the island, the side of the lead and the respective side of the island forming a facing pair of sides; and 
 wherein one of the facing pairs includes a recess such that at least a portion of the respective side of the area of the island and at least a portion of the recess are non-parallel. 
 
     
     
       2. The semiconductor device according to  claim 1 , wherein the recessed portion is formed at a position apart from a corner of at least one of the leads. 
     
     
       3. The semiconductor device according to  claim 1 , wherein the recessed portion is arcuately shaped in bottom plan view. 
     
     
       4. The semiconductor device according to  claim 1 , wherein the recessed portion includes a portion infiltrated by the resin package to strengthen the attachment of the lead to the resin package. 
     
     
       5. The semiconductor device according to  claim 4 , wherein the infiltrated portion has a portion parallel to a lower surface of the semiconductor device. 
     
     
       6. The semiconductor device according to  claim 4 , wherein the infiltrated portion is held by the resin package from both of the upper and lower sides thereof. 
     
     
       7. The semiconductor device according to  claim 4 , wherein the infiltrated portion further covers the part of the resin package from a side thereof. 
     
     
       8. The semiconductor device according to  claim 1 , wherein the recessed portion is disposed at a center of the facing portion. 
     
     
       9. The semiconductor device according to  claim 1 , wherein both the side of the island and the side of at least one of the leads have a liner portion inclined with respect to a side of the resin package in bottom plan view. 
     
     
       10. A semiconductor device comprising:
 a semiconductor chip having an upper surface and a lower surface; 
 an island having a lower surface, and an upper surface, the semiconductor chip being bonded to the upper surface of the island; 
 at least one lead disposed around the island; 
 for each lead, a bonding wire extending between the upper surface of the semiconductor chip and an upper surface of the at least one lead; and 
 a resin package sealing the semiconductor chip, the island, the at least one lead, and the bonding wire; 
 wherein the at least one lead on a lower surface of the resin package is adapted to allow the semiconductor device to be surface mounted; 
 wherein, in bottom plan view, the island has four sides, each of the four sides of the island not parallel to any side of the resin package, and for each side of said area of the island the angle between the side of the island and any of the sides of the resin package is less than a perpendicular angle; 
 wherein the at least one lead is disposed at a corner of the semiconductor device in bottom plan view; 
 wherein the at least one lead has a side facing one or more sides of the area of the island; 
 wherein at least one side of the area of the island and at least one side of the at least one lead face each other and form a facing portion; and 
 wherein the facing portion includes a recess such that a portion of the at least one side of the area of the island and at least a portion of the recess are non-parallel. 
 
     
     
       11. The semiconductor device according to  claim 10 , wherein the recessed portion is formed at a position apart from a corner of the at least one lead. 
     
     
       12. The semiconductor device according to  claim 10 , wherein the recessed portion is arcuately shaped in bottom plan view. 
     
     
       13. The semiconductor device according to  claim 10 , wherein the recessed portion includes a portion infiltrated by the resin package to strengthen the attachment of the lead to the resin package. 
     
     
       14. The semiconductor device according to  claim 13 , wherein the infiltrated portion has a portion parallel to a lower surface of the semiconductor device. 
     
     
       15. The semiconductor device according to  claim 13 , wherein the infiltrated portion is held by the resin package from both of the upper and lower sides thereof. 
     
     
       16. The semiconductor device according to  claim 13 , wherein the infiltrated portion further covers the part of the resin package from a side thereof. 
     
     
       17. The semiconductor device according to  claim 10 , wherein the recessed portion is disposed at a center of the facing portion. 
     
     
       18. The semiconductor device according to  claim 10 , wherein both the side of the island and the side of the at least one lead have a liner portion inclined with respect to a side of the resin package in bottom plan view. 
     
     
       19. The semiconductor device according to  claim 1 , wherein at least three recessed portions are formed on one of the leads. 
     
     
       20. The semiconductor device according to  claim 1 , wherein the recessed portion is formed on each of at least two sides of one of the leads, respectively. 
     
     
       21. The semiconductor device according to  claim 10 , wherein at least three recessed portions are formed on one of the leads. 
     
     
       22. The semiconductor device according to  claim 10 , wherein the recessed portion is formed on each of at least two sides of one of the leads, respectively.