US9353230B2ActiveUtilityA1
Resin pellet and method for producing the same
Est. expiryJun 19, 2029(~3 yrs left)· nominal 20-yr term from priority
C08J 3/124C08J 2323/08Y10T428/2991C08L 31/04B29B 9/00C08L 23/08C08J 3/12B29B 9/12B29B 2009/165
67
PatentIndex Score
1
Cited by
21
References
8
Claims
Abstract
A resin pellet of the present invention includes a resin base material and a plurality of microparticles embedded in the resin base material. The resin pellet is covered with the plurality of microparticles on the surface of the resin base material. According to the present invention, it is possible to prevent detachment of the microparticles to be applied on the resin base material and to effectively suppress blocking of resin pellets.
Claims
exact text as granted — not AI-modifiedThe invention claimed is:
1. A method for producing a resin pellet comprising:
preparing a resin base material;
embedding a plurality of microparticles in said resin base material by dispersing, in a liquid comprising water, said resin base material in a softened state and said microparticles; and
drying the resin base material in which the plurality of microparticles are embedded, to remove the liquid comprising the water,
wherein,
a shore hardness of said microparticles is higher than a shore hardness of said resin base material, the shore hardness being measured according to JIS K7215,
a degree of crystallinity of said microparticles is higher than a degree of crystallinity of said resin base material, the degree of crystallinity being measured by an X-ray diffraction method,
a Vicat softening point of said microparticles is higher than a Vicat softening point of said resin base material, the Vicat softening point being measured according to JIS K7206,
said resin base material contains an ethylene-vinyl acetate copolymer, a content of vinyl acetate in said ethylene-vinyl acetate copolymer contained in said resin base material is 20 to 50 mass %,
said microparticles contain an ethylene-vinyl acetate copolymer, a content of vinyl acetate in said ethylene-vinyl acetate copolymer contained in said microparticles is 5 to 20 mass %, and
in embedding said plurality of microparticles in said resin base material, the surface of said resin base material is covered with said plurality of microparticles.
2. The method for producing a resin pellet according to claim 1 ,
wherein, in embedding said plurality of microparticles in said resin base material, said resin base material comes into contact with said microparticles at a temperature of equal to or more than 35 degrees centigrade and equal to or less than 80 degrees centigrade.
3. The method for producing a resin pellet according to claim 1 , wherein both said resin base material and said microparticles are consisting of an ethylene-vinyl acetate copolymer.
4. The method for producing a resin pellet according to claim 1 , wherein the average particle size of said microparticles is equal to or less than 20 μm.
5. The method for producing a resin pellet according to claim 1 , wherein said resin base material is a particle.
6. The method for producing a resin pellet according to claim 1 , wherein in embedding said plurality of microparticles in said resin base material, an amount of said microparticles and the liquid is 0.001 to 20 times when the total weight of the resin base material is 100.
7. The method for producing a resin pellet according to claim 1 , wherein in embedding said plurality of microparticles in said resin base material, a dispersion in which said microparticles are dispersed in the water is used, and
an amount of the dispersion is 0.001 to 20 times when the total weight of the resin base material is 100.
8. The method for producing a resin pellet according to claim 1 , wherein in embedding said plurality of microparticles in said resin base material, a dispersion in which said microparticles are dispersed in the range of 10 to 70 mass % relative to the water is used, and
an amount of the dispersion is 0.001 to 20 times when the total weight of the resin base material is 100.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.