Motion sensor and packaging method thereof

Abstract

A motion sensor includes: a substrate, which includes a plurality of lead frame layers and a plurality of ceramic layers; a light source, disposed on the substrate, for emitting light; a sensing device, disposed on the substrate, for receiving the light to perform motion sensing; a cover, for fixing and protecting the light source and the sensing device; and an adhesive, for gluing the cover to the substrate, the adhesive including a component capable of blocking the light; wherein the light is infrared light, visible light or ultraviolet light.

What is claimed is: 
     
       1. A motion sensor, comprising:
 a substrate, comprising a plurality of lead frame layers and a plurality of ceramic layers, wherein the plurality of lead frame layers and the plurality of ceramic layers overlap in an interleaved manner; 
 a light source, disposed on the substrate, for emitting light; 
 a sensing device, disposed on the substrate, for receiving the light to perform motion sensing; 
 a cover, for fixing and protecting the light source and the sensing device; and 
 an adhesive, for gluing the cover to the substrate, the adhesive comprising a component capable of blocking the light; 
 wherein the light is infrared light, visible light or ultraviolet light. 
 
     
     
       2. The motion sensor of  claim 1 , wherein the cover is a ceramic compound, overlaid on the substrate, and a hole is formed over the light source and the sensing device in order to allow the light to pass. 
     
     
       3. The motion sensor of  claim 1 , wherein the cover is overlaid on the substrate by double injection molding. 
     
     
       4. The motion sensor of  claim 1 , wherein the cover comprises:
 a ceramic compound, overlaid on the substrate; 
 a first lens, placed over the light source, for protecting the light source and allowing the light to pass; and 
 a second lens, placed over the sensing device, for protecting the sensing device and allowing the light to pass. 
 
     
     
       5. The motion sensor of  claim 4 , wherein the first lens is a plastic lens. 
     
     
       6. The motion sensor of  claim 4 , wherein the second lens is a plastic lens or a wafer level lens. 
     
     
       7. The motion sensor of  claim 4 , wherein the first lens and the second lens are glued to the light source and the sensing device, respectively, via a silicone, an epoxy or an ultraviolet curable adhesive. 
     
     
       8. The motion sensor of  claim 1 , further comprising a driver, for driving operations of the light source. 
     
     
       9. The motion sensor of  claim 1 , wherein the sensing device is realized in a chip, and the chip is disposed on the substrate via a chip scale package (CSP). 
     
     
       10. A packaging method for a motion sensor, comprising:
 laying a plurality of lead frame layers and a plurality of ceramic layers in an interleaved manner to generate a substrate; 
 disposing a light source on the substrate for emitting light; 
 disposing a sensing device on the substrate for receiving the light to perform motion sensing; 
 laying an adhesive, the adhesive comprising a component capable of blocking the light; and 
 overlaying a cover and gluing the cover to the substrate via the adhesive, for protecting the light source and the sensing device; 
 wherein the light is infrared light, visible light or ultraviolet light. 
 
     
     
       11. The packaging method of  claim 10 , wherein the step of overlaying the cover and gluing the cover to the substrate via the adhesive for protecting the light source and the sensing device comprises:
 overlaying a ceramic compound on the substrate as the cover, wherein a hole is formed over the light source and the sensing device in order to allow the light to pass. 
 
     
     
       12. The packaging method of  claim 10 , wherein the cover is overlaid on the substrate by double injection molding. 
     
     
       13. The packaging method of  claim 10 , wherein the step of overlaying the cover and gluing the cover to the substrate via the adhesive for protecting the light source and the sensing device comprises:
 overlaying a ceramic compound on the substrate; 
 placing a first lens over the light source, for protecting the light source and allowing the light to pass; and 
 placing a second lens over the sensing device, for protecting the sensing device and allowing the light to pass. 
 
     
     
       14. The packaging method of  claim 13 , wherein the first lens is a plastic lens. 
     
     
       15. The packaging method of  claim 13 , wherein the second lens is a plastic lens or a wafer level lens. 
     
     
       16. The packaging method of  claim 13 , wherein the first lens and the second lens are glued to the light source and the sensing device, respectively, via a silicone, an epoxy or an ultraviolet curable adhesive. 
     
     
       17. The packaging method of  claim 10 , further comprising driving operations of the light source. 
     
     
       18. The packaging method of  claim 10 , wherein the sensing device is realized in a chip, and the chip is disposed on the substrate via a chip scale package (CSP).