Semiconductor package having wire bond wall to reduce coupling

Abstract

A system and method for a package including a wire bond wall to reduce coupling is presented. The package includes a substrate, and a first circuit on the substrate. The first circuit includes a first electrical device, a second electrical device, and a first wire bond array interconnecting the first electrical device and the second electrical device. The package includes a second circuit on the substrate adjacent to the first circuit, the second circuit includes a second wire bond array interconnecting a third electrical device and a fourth electrical device. The package includes a wire bond wall including a plurality of wire bonds over the substrate between the first circuit and the second circuit. The wire bond wall is configured to reduce an electromagnetic coupling between the first circuit and the second circuit during an operation of at least one of the first circuit and the second circuit.

What is claimed is: 
     
       1. A package, comprising:
 a substrate; 
 a first circuit on the substrate, the first circuit including a first electrical device, a second electrical device, and a first wire bond array interconnecting the first electrical device and the second electrical device; 
 a second circuit on the substrate adjacent to the first circuit, the second circuit including a third electrical device, a fourth electrical device, and a second wire bond array interconnecting the third electrical device and the fourth electrical device; 
 a plurality of connection pads on the substrate between the first circuit and the second circuit; and 
 a wire bond wall including a plurality of wire bonds over the substrate between the first circuit and the second circuit and electrically connecting the plurality of connection pads, the wire bond wall being configured to reduce an electromagnetic coupling between the first circuit and the second circuit during an operation of at least one of the first circuit and the second circuit. 
 
     
     
       2. The package of  claim 1 , wherein the plurality of wire bonds are interconnected and run along a region of the substrate that is between at least a portion of the first circuit and the second circuit. 
     
     
       3. The package of  claim 1 , wherein the plurality of wire bonds are arranged in at least a first row of wire bonds and a second row of wire bonds and wherein the first row of wire bonds is arranged in parallel with the second row of wire bonds. 
     
     
       4. The package of  claim 1 , wherein the first circuit is a carrier amplifier of a Doherty amplifier. 
     
     
       5. The package of  claim 4 , wherein the second circuit is a peaking amplifier of the Doherty amplifier. 
     
     
       6. The package of  claim 1 , wherein the wire bond wall is connected to a ground voltage terminal. 
     
     
       7. The package of  claim 1 , wherein the wire bond wall is connected to an integrated passive device. 
     
     
       8. The package of  claim 7 , wherein at least one of a capacitance and an inductance of the integrated passive device is selected to reduce an electromagnetic coupling between the first circuit and the second circuit over a range of frequencies when the integrated passive device is connected to the wire bond wall. 
     
     
       9. The package of  claim 1 , wherein at least one of the first electrical device, second electrical device, third electrical device, and fourth electrical device includes at least one of a capacitor, and a transistor. 
     
     
       10. A Doherty amplifier package, comprising:
 a substrate; 
 a carrier amplifier on the substrate; 
 a peaking amplifier on the substrate adjacent to the carrier amplifier; and 
 a plurality of wire bonds on the substrate, the plurality of wire bonds being interconnected and running along a region of the substrate located between at least a portion of the carrier amplifier and the peaking amplifier, the plurality of wire bonds forming a wire bond wall configured to reduce an electromagnetic coupling between the carrier amplifier and the peaking amplifier during an operation of at least one of the carrier amplifier and the peaking amplifier. 
 
     
     
       11. The Doherty amplifier package of  claim 10 , including a plurality of connection pads over the substrate and wherein the plurality of wire bonds electrically interconnect the connection pads. 
     
     
       12. The Doherty amplifier package of  claim 11 , wherein the plurality of connection pads are connected to a ground voltage. 
     
     
       13. The Doherty amplifier package of  claim 10 , wherein the plurality of wire bonds are connected to a ground voltage terminal. 
     
     
       14. The Doherty amplifier package of  claim 10 , wherein the plurality of wire bonds are connected to an integrated passive device. 
     
     
       15. The Doherty amplifier package of  claim 14 , wherein the integrated passive device has at least one of a capacitance and an inductance selected to reduce an electromagnetic coupling between the carrier amplifier and the peaking amplifier over a range of frequencies when the integrated passive device is connected to the plurality of wire bonds and during an operation of at least one of the carrier amplifier and the peaking amplifier. 
     
     
       16. The Doherty amplifier package of  claim 10 , wherein:
 the carrier amplifier includes a first wire bond array interconnecting a first electrical device of the carrier amplifier and a second electrical device of the carrier amplifier; and 
 the peaking amplifier includes a second wire bond array interconnecting a third electrical device of the carrier amplifier and a fourth electrical device of the carrier amplifier. 
 
     
     
       17. A method, comprising:
 attaching a carrier amplifier on a substrate; 
 attaching a peaking amplifier on the substrate adjacent to the carrier amplifier; and 
 forming a plurality of interconnected wire bonds on the substrate along a region of the substrate located between at least a portion of the carrier amplifier and the peaking amplifier, the plurality of wire bonds forming a wire bond wall configured to reduce an electromagnetic coupling between the carrier amplifier and the peaking amplifier during an operation of at least one of the carrier amplifier and the peaking amplifier. 
 
     
     
       18. The method of  claim 17 , including forming a plurality of connection pads over the substrate, wherein the plurality of wire bonds electrically interconnect the connection pads. 
     
     
       19. The method of  claim 18 , including connecting the plurality of connection pads to a ground voltage terminal. 
     
     
       20. The method of  claim 17 , including:
 mounting an integrated passive device to the substrate; and 
 connecting the plurality of wire bonds to the integrated passive device. 
 
     
     
       21. A package, comprising:
 a substrate; 
 a first circuit on the substrate; 
 a second circuit on the substrate adjacent to the first circuit; 
 an electronic component on the substrate between the first circuit and the second circuit; 
 a first lead on a first side of the package connected to the first circuit; 
 a second lead on a second side of the package connected to the first circuit, the second side of the package being opposite the first side of the package; 
 a third lead on the first side of the package connected to the second circuit; 
 a fourth lead on the second side of the package connected to the second circuit; 
 a first terminal on the first side of the package between the first lead and the second lead, the first terminal being connected to the electronic component; and 
 a second terminal on the second side of the package between the third lead and the fourth lead, the second terminal being connected to the electronic component. 
 
     
     
       22. The package of  claim 21 , wherein the electronic component is configured to reduce an electromagnetic coupling between the first circuit and the second circuit during an operation of at least one of the first circuit and the second circuit. 
     
     
       23. The package of  claim 22 , wherein the electronic component includes a wire bond wall. 
     
     
       24. The package of  claim 23 , including a plurality of connection pads over the substrate and wherein the wire bonds of the wire bond wall electrically interconnect the connection pads. 
     
     
       25. The package of  claim 23 , wherein the wire bond wall is connected to an integrated passive device. 
     
     
       26. The package of  claim 3 , wherein a first wire bond in the first row of wire bonds is connected to a first connection pad in the plurality of connection pads and none of the wire bonds in the second row of wire bonds are connected to the first connection pad.