Test system with localized heating and method of manufacture thereof

Abstract

A test system, and a method of manufacture thereof, including: a thermal management head including a heat spreader; an electronic device in direct contact with the heat spreader; and an electrical current for transferring energy between the heat spreader and the electronic device.

What is claimed is: 
     
       1. A method of manufacture of a test system comprising:
 providing a thermal management head including a thermal management element, a heat spreader with a plurality of projections, and a thermally insulative mounting substrate, wherein the thermal management element is thermally engaged with the heat spreader and has a portion that is not covered by the heat spreader, and the thermally insulative mounting substrate covers the portion of the thermal management element to stop heat from radiating outward from the portion of the thermal management element; 
 placing each of the projections in direct contact with a respective electronic device of a plurality of electronic devices; and 
 transferring heat from the plurality of projections to the plurality of electronic devices by supplying an electrical current to the thermal management head. 
 
     
     
       2. The method as claimed in  claim 1  further comprising heating at least one electronic device of the plurality of electronic devices at a ramp rate of at least seven degrees Celsius per minute. 
     
     
       3. The method as claimed in  claim 1  further comprising providing a proportional-integral-derivative (PID) controller, and a sensor for communicating information about the heat transfer between the heat spreader and the plurality of electronic devices to the PID controller for controlling the temperature of the plurality of electronic devices. 
     
     
       4. The method as claimed in  claim 1  wherein the thermal management element includes a Peltier device. 
     
     
       5. The method as claimed in  claim 1  wherein placing the plurality of projections in direct contact with the plurality of electronic devices includes placing the plurality of projections in direct contact with a plurality of integrated circuits, a plurality of devices under test, or a plurality of sockets. 
     
     
       6. The method as claimed in  claim 1  wherein each of the respective electronic devices is on a substrate. 
     
     
       7. The method as claimed in  claim 1  further comprises testing the plurality of electronic devices by heating or cooling the plurality of electronic devices. 
     
     
       8. The method as claimed in  claim 1 
 further comprising placing the thermal management element in contact with the heat spreader. 
 
     
     
       9. The method as claimed in  claim 1  wherein the heat spreader includes an aperture. 
     
     
       10. A test system comprising:
 a thermal management head including a thermal management element, a heat spreader with a plurality of projections, and a thermally insulative mounting substrate, wherein the thermal management element is thermally engaged with the heat spreader and has a portion that is not covered by the heat spreader, and the thermally insulative mounting substrate covers the portion of the thermal management element to stop heat from radiating outward from the portion of the thermal management element; 
 wherein the plurality of projections are configured to directly contact respective electronic devices of a plurality of electronic devices; and 
 a power connector to provide an electrical current for transferring heat from the plurality of projections to the plurality of electronic devices. 
 
     
     
       11. The system as claimed in  claim 10  wherein the thermal management element is in contact with the heat spreader. 
     
     
       12. The system as claimed in  claim 10  wherein the heat spreader includes an aperture. 
     
     
       13. The system as claimed in  claim 10  further comprising a proportional-integral-derivative (PID) controller, and a sensor for communicating information about the heat transfer between the heat spreader and the plurality of electronic devices to the PID controller for controlling the temperature of the plurality of electronic devices. 
     
     
       14. The system as claimed in  claim 10  wherein each electronic device of the plurality of electronic devices is on a substrate. 
     
     
       15. The system as claimed in  claim 10  wherein the plurality of electronic devices includes a plurality of integrated circuits, a plurality of devices under test, or a plurality of sockets. 
     
     
       16. The system as claimed in  claim 10  wherein the thermal management head is further configured to cool the plurality of electronic devices. 
     
     
       17. The system as claimed in  claim 10  wherein the thermal management element includes a Peltier device. 
     
     
       18. The system as claimed in  claim 10  wherein at least one electronic device of the plurality of electronic devices is heated at a ramp rate of at least seven degrees Celsius per minute.