Cooling system for electronic components and led lamp having the same

Abstract

The present invention is directed to a cooling system ( 1 ) for electronic components ( 4 ). The cooling system ( 1 ) comprises means ( 7 ) for producing cyclic air pressure fluctuations, wherein the electronic components ( 4 ) are distanced from the pressure producing means ( 7 ). In the vicinity of the electronic components ( 4 ) are situated means ( 5 ), preferably restrictions like holes, which are affected by the cyclic air pressure fluctuations, and which produce cyclic air jets ( 6 ). The air jets ( 6 ) affect the surface of the electronic component ( 4 ), and since the air jets ( 6 ) originate directly in the vicinity of the electronic components ( 4 ), an efficient heat transfer is affected. Preferably, the pressure producing means ( 7 ) actuate a pressure Pc inside a chamber ( 2 ), and turbulent air jets ( 6 ) are produced through holes ( 5 ) of a substrate ( 3 ), onto which electronic components ( 4 ) are mounted.

The invention claimed is: 
     
       1. A cooling system ( 1 ) for electronic components ( 4 ) comprising
 means ( 7 ) for producing cyclic air pressure fluctuations, wherein the electronic components ( 4 ) are distanced from the pressure producing means ( 7 ); 
 converting means ( 5 ) for converting the cyclic air pressure fluctuations into cyclic air jets ( 6 ), wherein the converting means ( 5 ) are arranged in the vicinity of the electronic components ( 4 ), so that the cyclic air jets ( 6 ) are turbulent air streams and produced directly at the location of the electronic components ( 4 ) in order to increase the heat transfer at the surface of the electronic components ( 4 ), and 
 wherein the converting means ( 5 ) comprises at least one opening in a range of 100 μm to 8 mm and wherein a distance between the electronic components ( 4 ) and the converting means ( 5 ) is less than 10 mm 
 wherein the cooling system ( 1 ) further comprises 
 a chamber ( 2 ), wherein the pressure producing means ( 7 ) are provided and produce a cyclic chamber air pressure (Pc), which is alternately higher and lower than the air pressure (Po) outside of the chamber ( 2 ); 
 a substrate ( 3 ) constituting one side wall of the chamber ( 2 ), the electronic components ( 4 ) being attached to a surface of the substrate ( 3 ); 
 wherein the substrate ( 3 ) is provided with at least one hole ( 5 ), which produces the cyclic air jets ( 6 ) due to the cyclic chamber air pressure (Pc). 
 
     
     
       2. The cooling system ( 1 ) according to  claim 1 , wherein the pressure producing means ( 7 ) comprise at least one membrane, which is adapted to be driven to suck in and expulse air in two movement phases, respectively, wherein the two-movement phases are cycled 5 to 500 times per second. 
     
     
       3. The cooling system ( 1 ) according to  claim 2 , wherein the at least one membrane is adapted to be magnetically driven. 
     
     
       4. The cooling system ( 1 ) according to  claim 1 , wherein the pressure producing means ( 7 ) comprise a pump, which contains a piezoelectric element. 
     
     
       5. The cooling system ( 1 ) according to  claim 1 , further comprising a heat sink ( 8 ), which is connected to the substrate ( 3 ) and/or at least one of the electronic components ( 4 ). 
     
     
       6. The cooling system ( 1 ) according to  claim 5 , further comprising a plurality of heatsink fins ( 9 ), which are connected to the substrate ( 3 ) and/or at least one of the electronic components ( 4 ) and/or the heat sink ( 8 ), wherein the cyclic air jets ( 6 ) impinge on the heatsink fins ( 9 ). 
     
     
       7. The cooling system ( 1 ) according to  claim 1 , wherein apart from the at least one hole ( 5 ) the chamber ( 2 ) is hermetically sealed to the outside. 
     
     
       8. The cooling system ( 1 ) according to  claim 1 , wherein the at least one hole ( 5 ) is provided with restrictions ( 5   a ) to enhance the turbulence of the air jets ( 6 ). 
     
     
       9. A LED lamp ( 100 ), especially retrofit LED lamp, operating with electronic components ( 4 ), wherein the LED lamp ( 100 ) has a cooling system ( 1 ) according to  claim 1  for the electronic components ( 4 ). 
     
     
       10. The LED lamp ( 100 ) according to  claim 9 , comprising
 a bulb ( 10 ), which is provided on one of its ends with a socket ( 11 ); 
 at least one LED ( 12 ) arranged inside the envelope ( 13 ); 
 wherein the cooling system ( 1 ) is arranged inside envelope ( 13 ), such that the electronic components ( 4 ) are positioned between the pressure producing means ( 7 ) and the socket ( 11 ), wherein the electronic components ( 4 ) drive the at least one LED ( 12 ). 
 
     
     
       11. The LED lamp ( 100 ) according to  claim 10 , further comprising heatsink fins ( 9 ), wherein the heatsink fins ( 9 ) are arranged on such a way that the path of the cyclic air jets ( 6 ) are directed along the heat fins ( 9 ) towards the socket ( 11 ). 
     
     
       12. The cooling system ( 1 ) according to  claim 2 , wherein the two-movement phases are cycled 20 to 120 times per second. 
     
     
       13. A cooling method for electronic components ( 4 ) comprising the steps of
 producing cyclic air pressure fluctuations by means ( 7 ), which are distanced from the electronic components ( 4 ); 
 producing cyclic air jets ( 6 ) by converting means ( 5 ) arranged in the vicinity of the electronic components ( 4 ), so that the cyclic air jets ( 6 ) are turbulent air streams and produced directly at the location of the electronic components ( 4 ), wherein the converting means ( 5 ) being affected by the cyclic air pressure fluctuations, and wherein the cyclic air jets ( 6 ) affect the surface of the electronic components ( 4 ), 
 wherein the converting means ( 5 ) comprises at least one opening in a range of 100 μm to 8 mm and wherein a distance between the electronic components ( 4 ) and the converting means ( 5 ) is less than 10 mm 
 creating a cyclic chamber air pressure (Pc) in a chamber ( 2 ), the air pressure (Pc) being alternately higher and lower than the air pressure (Po) outside of the chamber ( 2 ); and 
 producing the cyclic air jets ( 6 ) due to the cyclic chamber air pressure (Pc) by at least one hole ( 5 ) in a substrate ( 3 ), to which the electronic components ( 4 ) are attached.