Exposure apparatus and device manufacturing method

Abstract

An apparatus which projects a pattern of an original onto a substrate by a projection optical system within a chamber to expose the substrate, comprises a measurement unit which performs measurement to calculate a deformation amount of the original, and a controller which calculates a predicted deformation amount of the original and corrects a projection magnification of the projection optical system so as to correct the predicted deformation amount, based on information representing a relationship between the deformation amount with reference to a shape of the original at a certain temperature and a time for which the original receives exposure light, a deformation amount of the original before exposure determined based on a measurement value obtained by measuring, by the measurement unit, the deformation amount of the original loaded into the chamber and unused for exposure, and the time for which the original receives the exposure light.

What is claimed is: 
     
       1. An exposure apparatus which projects a pattern of an original onto a substrate by a projection optical system within a chamber to expose the substrate, comprising:
 a measurement unit configured to obtain a measurement value; and 
 a controller configured to calculate a predicted deformation amount of the original and to correct a projection magnification of the projection optical system so as to correct the predicted deformation amount, the predicted deformation amount of the original is calculated based on information representing a relationship between a deformation amount of the original with reference to a shape of the original at a certain temperature and a time for which the original receives exposure light, 
 wherein in the calculation of the predicted deformation amount of the original, the controller determines an elapsed time in the relationship, the elapsed time is corresponding to the deformation amount of the original which is loaded into the chamber and unused for exposure based on the measurement value before exposure, and calculates the predicted deformation amount of the original based on the determined elapsed time in the relationship, the time for which the original receives the exposure light, and the information. 
 
     
     
       2. The exposure apparatus according to  claim 1 , wherein the certain temperature is a temperature in the chamber. 
     
     
       3. The exposure apparatus according to  claim 1 ,
 wherein the measurement unit measures a position of a mark drawn on the original, and
 wherein the controller determines the deformation amount of the original before exposure by correcting a drawing error of the mark included in the measurement value obtained by the measurement unit. 
 
 
     
     
       4. The exposure apparatus according to  claim 3 ,
 wherein the drawing error is determined by measurement thereof by the measurement unit after a time has elapsed sufficient for a temperature of the original to reach the temperature in the chamber. 
 
     
     
       5. The exposure apparatus according to  claim 4 , further comprising a temperature control unit configured to control the temperature of the original loaded into the chamber close to the temperature in the chamber. 
     
     
       6. The exposure apparatus according to  claim 3 , further comprising a receiving unit configured to receive information representing the drawing error from an external apparatus. 
     
     
       7. The exposure apparatus according to  claim 1 ,
 wherein the controller causes the measurement unit to measure a position of a mark drawn on the original and a position of a mark located on an original stage which holds the original, and calculates the predicted deformation amount based on the measurement values obtained by the measurement unit. 
 
     
     
       8. The exposure apparatus according to  claim 1 ,
 wherein the measurement unit includes a sensor configured to measure a temperature of the original. 
 
     
     
       9. The exposure apparatus according to  claim 1 ,
 wherein the controller corrects not only the projection magnification of the projection optical system but also a scanning speed of at least one of the original and the substrate so as to correct the predicted deformation amount. 
 
     
     
       10. A device manufacturing method comprising the steps of:
 exposing a substrate using an exposure apparatus; and 
 developing the substrate, 
 wherein the exposure apparatus projects a pattern of an original onto a substrate by a projection optical system within a chamber to expose the substrate and comprises: 
 a measurement unit configured to obtain a measurement value, and 
 a controller configured to calculate a predicted deformation amount of the original and correct a projection magnification of the projection optical system so as to correct the predicted deformation amount, the predicted deformation amount of the original is calculated based on information representing a relationship between a deformation amount of the original with reference to a shape of the original at a certain temperature and a time for which the original receives exposure light, 
 wherein in the calculation of the predicted deformation amount of the original, the controller determines an elapsed time in the relationship, corresponding to the deformation amount of the original which is loaded into the chamber and unused for exposure based on the measurement value before exposure, and calculates the predicted deformation amount of the original based on the determined elapsed time in the relationship, the time for which the original receives the exposure light, and the information. 
 
     
     
       11. An exposure apparatus which projects a pattern of an original onto a substrate by a projection optical system within a chamber to expose the substrate, comprising:
 a measurement unit configured to obtain a measurement value; and 
 a controller configured to calculate a predicted deformation amount of the original and correct a projection magnification of the projection optical system so as to correct the predicted deformation amount, the predicted deformation amount of the original is calculated based on information representing a relationship between a deformation amount of the original with reference to a shape of the original at a certain temperature and a parameter having a correlation with the total amount of exposure energy accumulated in the original, 
 wherein in the calculation of the predicted deformation amount of the original, the controller determines a value of the parameter in the relationship, the determined value of the parameter is corresponding to the deformation amount of the original which is loaded into the chamber and unused for exposure based on the measurement value before exposure, and calculates the predicted deformation amount of the original based on the determined value of the parameter, the arbitrary value of the parameter, and the information. 
 
     
     
       12. The exposure apparatus according to  claim 11 , wherein the certain temperature is a temperature in the chamber. 
     
     
       13. The exposure apparatus according to  claim 11 ,
 wherein the measurement unit measures a position of a mark drawn on the original, and 
 wherein the controller determines the deformation amount of the original before exposure by correcting a drawing error of the mark included in the measurement value obtained by the measurement unit. 
 
     
     
       14. The exposure apparatus according to  claim 13 ,
 wherein the drawing error is determined by measurement thereof by the measurement unit after a time has elapsed sufficient for a temperature of the original to reach the temperature in the chamber. 
 
     
     
       15. The exposure apparatus according to  claim 14 , further comprising a temperature control unit configured to control the temperature of the original loaded into the chamber close to the temperature in the chamber. 
     
     
       16. The exposure apparatus according to  claim 11 ,
 wherein the controller causes the measurement unit to measure a position of a mark drawn on the original and a position of a mark located on an original stage which holds the original, and calculates the predicted deformation amount based on the measurement values obtained by the measurement unit. 
 
     
     
       17. The exposure apparatus according to  claim 11 , wherein the measurement unit includes a sensor configured to measure a temperature of the original. 
     
     
       18. The exposure apparatus according to  claim 11 ,
 wherein the controller corrects not only the projection magnification of the projection optical system but also a scanning speed of at least one of the original and the substrate so as to correct the predicted deformation amount. 
 
     
     
       19. The exposure apparatus according to  claim 11 , wherein the parameter is an amount of exposure light. 
     
     
       20. The exposure apparatus according to  claim 19 , wherein the amount of exposure light determined by one of a number of processed substrates, a number of exposed shot regions, and a number of pulses of exposure light irradiating the original.