Semiconductor device, circuit substrate, and electronic device

Abstract

A semiconductor device has a through electrode formed in a through hole which penetrates a Si substrate from one surface to the other surface of the Si substrate, wherein a rectangular electrode pad is provided on the other surface with an insulation film laid between the electrode pad and the other surface, an opening of the through hole on the one surface side is circular, an opening of the through hole on the other surface side is rectangular, and the area of the opening on the other surface side is made smaller than the area of the opening on the one surface side.

What is claimed is: 
     
       1. A semiconductor device, comprising:
 a silicon substrate that has a first surface and a second surface; 
 a through hole that is formed in the silicon substrate, the through hole penetrating the silicon substrate from the first surface to the second surface; 
 a rectangular electrode pad that is provided on the second surface with an insulation film provided between the electrode pad and the second surface; 
 a first opening of the through hole provided at the first surface, the first opening having a circular shape; 
 a second opening of the through hole provided at the second surface, the second opening having a rectangular shape; 
 a through electrode penetrates the through hole, and 
 
       wherein the through electrode has a first inclined surface and a second inclined surface. 
     
     
       2. The semiconductor device according to  claim 1 , wherein
 the first inclined surface of the through electrode is connected to the second inclined surface of the through electrode. 
 
     
     
       3. The semiconductor device according to  claim 1 , wherein
 the second inclined surface of the through electrode is connected to the rectangular electrode pad. 
 
     
     
       4. The semiconductor device according to  claim 2 , wherein
 the second inclined surface of the through electrode is connected to the rectangular electrode pad.