Heat-dissipation structure for an indicia reading module

Abstract

Small mobile computing devices place stringent requirements on the electronic modules integrated within. High temperatures inside these mobile computing devices are unavoidable; therefore good thermal management is important to insure proper module operation. Here a heat-dissipation structure for an indicia-reading module integrated within a mobile computing device is disclosed.

The invention claimed is: 
     
       1. An indicia-reading module configured to integrate within a mobile computing device's body, comprising:
 a sensor subassembly; 
 an illuminator-aimer subassembly; 
 a processing subassembly; 
 an interface subassembly; and 
 a thermally-conductive, unitary indicia-reading module housing containing the sensor subassembly, the illuminator-aimer subassembly, the processing subassembly, and the interface subassembly, wherein the indicia-reading module housing thermally connects the mobile computing device's body to the sensor subassembly, the illuminator-aimer subassembly, the processing subassembly, and/or the interface subassembly. 
 
     
     
       2. The indicia-reading module according to  claim 1 , wherein the sensor subassembly comprises:
 a sensor printed circuit board (PCB) with a first surface to which a metallic circuit pad is affixed; 
 a substrate having (i) a top surface to which a metallic top pad is affixed, (ii) a bottom surface to which a metallic bottom pad is affixed, and (iii) an array of metallic vias thermally connecting the metallic top pad and the metallic bottom pad; and 
 a sensor integrated circuit (IC) having (i) a front surface with a plurality of pixels and (ii) a back surface opposite the front surface; 
 wherein the substrate is (i) affixed to the sensor PCB's first surface so that the substrate's metallic bottom pad is in thermal contact with the sensor PCB's metallic circuit pad; and (ii) attached via thermally conductive epoxy to the sensor IC's back surface so that the substrate's metallic top pad is in thermal contact with the sensor IC's back surface. 
 
     
     
       3. The indicia-reading module according to  claim 2 , wherein the metallic circuit pad is thermally connected to the indicia-reading module housing. 
     
     
       4. The indicia-reading module according to  claim 1 , wherein the sensor subassembly comprises an adjustable lens for imaging the indicia-reading module's field of view onto a sensor integrated circuit (IC) with a plurality of pixels for detecting an image. 
     
     
       5. The indicia-reading module according to  claim 1 , wherein the illuminator-aimer subassembly projects a visible aligning pattern onto a target within the indicia-reading module's field of view and the visible aligning pattern corresponds with the indicia-reading module's field of view. 
     
     
       6. The indicia-reading module according to  claim 1 , wherein the illuminator-aimer subassembly comprises:
 an illuminator light source; 
 an illuminator aperture for limiting a spatial extent of the illuminator light source, the illuminator aperture positioned in front of the illuminator light source; and 
 an illuminator lens for projecting light from the illuminator light source onto a target within the indicia-reading module's field of view, the illuminator lens positioned in front of the illuminator aperture. 
 
     
     
       7. The indicia-reading module according to  claim 6 , comprising a thermally conductive heat sink affixed to the illuminator light source. 
     
     
       8. The indicia-reading module according to  claim 1 , wherein the illuminator-aimer subassembly comprises:
 an aimer light source; 
 an aimer aperture for creating a visible aligning pattern corresponding to the indicia-reading module's field of view, the aimer aperture positioned in front of the aimer light source; and 
 an aimer lens for projecting light from the aimer light source onto a target within the indicia-reading module's field of view, the aimer lens positioned in front of the aimer aperture. 
 
     
     
       9. The indicia-reading module according to  claim 8 , comprising a thermally conductive heat sink affixed to the aimer light source. 
     
     
       10. The indicia-reading module according to  claim 1 , wherein the processing subassembly executes image-processing algorithms. 
     
     
       11. The indicia-reading module according to  claim 1 , wherein the processing subassembly comprises a processor integrated circuit (IC) for executing image processing algorithms. 
     
     
       12. The indicia-reading module according to  claim 11 , comprising a thermally conductive heat sink affixed to the processor IC. 
     
     
       13. The indicia-reading module according to  claim 11 , wherein the processor IC is thermally connected to the indicia-reading module housing. 
     
     
       14. A device, comprising:
 a body; and 
 an indicia-reading module physically integrated within the body, the indicia-reading module comprising:
 a sensor subassembly; 
 an illuminator-aimer subassembly; 
 a processing subassembly; 
 an interface subassembly; and 
 a thermally-conductive, unitary indicia-reading module housing thermally connecting the body to the sensor subassembly, the illuminator-aimer subassembly, the processing subassembly, and/or the interface subassembly. 
 
 
     
     
       15. The device according to  claim 14 , wherein the sensor subassembly comprises an adjustable lens for imaging the indicia-reading module's field of view onto a sensor integrated circuit (IC) with a plurality of pixels for detecting an image. 
     
     
       16. The device according to  claim 14 , wherein the illuminator-aimer subassembly projects a visible aligning pattern onto a target within the indicia-reading module's field of view and the visible aligning pattern corresponds with the indicia-reading module's field of view. 
     
     
       17. The device according to  claim 14 , wherein:
 the illuminator-aimer subassembly comprises an illuminator light source; and 
 the device comprises a thermally conductive heat sink affixed to the illuminator light source. 
 
     
     
       18. The device according to  claim 14 , wherein:
 the illuminator-aimer subassembly comprises an aimer light source; and 
 the device comprises a thermally conductive heat sink affixed to the aimer light source. 
 
     
     
       19. The device according to  claim 14 , wherein:
 the processing subassembly comprises a processor integrated circuit (IC) for executing image processing algorithms; and 
 the device comprises a thermally conductive heat sink affixed to the processor IC. 
 
     
     
       20. The device according to  claim 19 , wherein the processor IC is thermally connected to the indicia-reading module housing.