Printed circuit board including inductor

Abstract

A printed circuit board (PCB) includes an insulating substrate, a plurality of copper foil pattern layers and a plurality of insulating adhesive sheets sequentially stacked on an upper side of the insulating substrate and a lower side of the insulating substrate, an inductor included in the copper foil pattern layer disposed on the upper side of the insulating substrate, a grounding element included in the copper foil pattern layer disposed on the lower side of the insulating substrate, and a single through hole penetrating the insulating substrate and the insulating adhesive sheets. The single through hole is disposed between the inductor and the grounding element.

What is claimed is: 
     
       1. A printed circuit board (PCB) comprising:
 an insulating substrate; 
 a plurality of copper foil pattern layers and a plurality of insulating adhesive sheets sequentially stacked on an upper side of the insulating substrate and a lower side of the insulating substrate; 
 an inductor included in the copper foil pattern layer disposed on the upper side of the insulating substrate; 
 a grounding element included in the copper foil pattern layer disposed on the lower side of the insulating substrate; and 
 a through hole penetrating the insulating substrate and the insulating adhesive sheets, 
 wherein the through hole is disposed between the inductor and the grounding element, 
 wherein the through hole is not filled with a conductive material, and the through hole is disposed directly under the inductor and directly and entirely over the grounding element. 
 
     
     
       2. The PCB according to  claim 1 , wherein the inductor comprises a body having a horseshoe shape, a first connection terminal which is a first end of the body, and a second connection terminal which is a second end of the body. 
     
     
       3. The PCB according to  claim 1 , wherein the through hole is filled with air. 
     
     
       4. The PCB according to  claim 1 , further comprising: a single hollow dielectric filling the through hole, and being hollow therein. 
     
     
       5. The PCB according to  claim 1 , further comprising: a single dielectric filling the through hole. 
     
     
       6. The PCB according to  claim 1 , wherein the insulating substrate and the insulating adhesive sheets include a prepreg. 
     
     
       7. The PCB according to  claim 1 , further comprising: a first insulating layer disposed between the grounding element and the through hole, and a second insulating layer disposed between the inductor and the through hole. 
     
     
       8. The PCB according to  claim 1 , further comprising a first coating layer covering the copper foil pattern layer including the inductor disposed on the upper side of the insulating substrate and a second coating layer covering the copper foil pattern layer including the grounding element disposed on the lower side of the insulating substrate. 
     
     
       9. The PCB according to  claim 4 , wherein the single hollow dielectric is a low dielectric material including at least one of a polyimide resin, a Teflon resin, and a silicone resin, and wherein the low dielectric material has a dielectric constant lower than about 4.3. 
     
     
       10. The PCB according to  claim 5 , wherein the single dielectric is a low dielectric material including at least one of a polyimide resin, a Teflon resin, and a silicone resin, and wherein the low dielectric material has a dielectric constant lower than about 4.3. 
     
     
       11. The PCB according to  claim 6 , wherein the prepreg includes a reinforcing fiber and a thermosetting resin. 
     
     
       12. The PCB according to  claim 7 , wherein the first insulating layer or the second insulating layer includes a prepreg and a polyimide film. 
     
     
       13. A printed circuit board (PCB) comprising:
 an insulating substrate; 
 a plurality of copper foil pattern layers and a plurality of insulating adhesive sheets sequentially stacked on an upper side of the insulating substrate and a lower side of the insulating substrate; 
 an inductor included in the copper foil pattern layer disposed on the upper side of the insulating substrate; 
 a grounding element included in the copper foil pattern layer disposed on the lower side of the insulating substrate; 
 a first through hole penetrating a first insulating adhesive sheet disposed directly under the inductor; and 
 a second through hole penetrating a second insulating adhesive sheet disposed directly and entirely over the grounding element, 
 wherein the first through hole and the second through hole are disposed between the inductor and the grounding element, and 
 wherein the first through hole is spaced apart, from the second through hole by the insulating substrate. 
 
     
     
       14. The PCB according to  claim 13 , further comprising:
 a first hollow dielectric filling the first through hole and having a dielectric constant lower than about 4.3; and 
 a second hollow dielectric filling the second through hole and having the dielectric constant lower than about 4.3. 
 
     
     
       15. The PCB according to  claim 13 , further comprising:
 a first dielectric filling the first through hole and having a dielectric constant lower than about 4.3; and 
 a second dielectric filling the second through hole and having the dielectric constant lower than about 4.3. 
 
     
     
       16. The PCB according to  claim 13 , further comprising a first coating layer covering the copper foil pattern layer including the inductor disposed on the upper side of the insulating substrate and a second coating layer covering the copper foil pattern layer including the grounding element disposed on the lower side of the insulating substrate. 
     
     
       17. A semiconductor package comprising:
 a printed circuit board (PCB); 
 a semiconductor chip mounted on an upper side of the PCB; 
 a plurality of chip bumps disposed on a lower side of the semiconductor chip; 
 a plurality of upper lands disposed on the upper side of the PCB; 
 a plurality of lower lands disposed on a lower side of the PCB; and 
 a plurality of solder balls disposed on the lower side of the PCB, 
 wherein the PCB comprises: 
 an insulating substrate, 
 a first copper foil pattern layer disposed on an upper side of the insulating substrate, 
 a second copper foil pattern layer disposed on a lower side of the insulating substrate, wherein the first copper foil pattern layer and the second copper foil pattern layer include a circuit line layer, 
 a first insulating adhesive sheet disposed on an upper surface of the first copper foil pattern layer, 
 a first insulating layer disposed on an upper surface of the first insulating adhesive sheet, 
 a third copper foil pattern layer disposed on an upper surface of the first insulating layer, wherein the third copper foil pattern layer includes the upper lands and an inductor, 
 a second insulating adhesive sheet disposed on a lower surface of the second copper foil pattern layer, 
 a second insulating layer disposed on a lower surface of the second insulating adhesive sheet, 
 a fourth copper foil pattern layer disposed on a lower surface of the second insulating layer, wherein the fourth copper foil pattern layer includes the lower lands and a grounding element, 
 a single through hole penetrating the insulating substrate and the first insulating adhesive sheet and the second insulating adhesive sheet, and wherein the single through hole is disposed between the inductor and the grounding element, 
 a first coating layer covering the third copper foil pattern layer, and 
 a second coating layer covering the fourth copper foil pattern layer. 
 
     
     
       18. The semiconductor package according to  claim 17 , wherein an interior of the single through hole is filled with air having a dielectric constant of about 1. 
     
     
       19. The semiconductor package according to  claim 17 , wherein the inductor comprises a body having a horseshoe shape, a first connection terminal which is one end of the body, and a second connection terminal which is another end of the body, wherein the first connection terminal and the second connection terminal of the inductor are electrically connected to the upper lands.