Method for producing a wafer equipped with transparent plates

Abstract

A production method for a wafer equipped with transparent plates includes: formation of a row of through-holes in a wafer; formation of at least one strip-shaped recess in a wafer surface, each of the through-holes of the same row intersecting partly with the respectively associated strip-shaped recess; an uninterrupted groove being formed in each intermediate region between two adjacent through-holes of the same row, the floor surface of the groove being oriented so as to be inclined relative to the wafer surface by an angle of inclination greater than 0° and less than 90°; and covering at least one through-hole with at least one transparent plate made of at least one material transparent to at least a sub-spectrum of electromagnetic radiation.

What is claimed is: 
     
       1. A production method for a wafer equipped with transparent plates, comprising:
 formation of at least one row of through-holes in a wafer; 
 formation of at least one strip-shaped recess in a wafer surface of the wafer, using a mechanical tool; 
 wherein the formation of the at least one row of through-holes and the formation of the at least one strip-shaped recess are carried out in such a way that each of the through-holes of the same row intersects partly with the respectively associated strip-shaped recess, and an uninterrupted groove is formed in each intermediate region between two adjacent through-holes of the same row, the floor surface of the groove being oriented so as to be inclined relative to the wafer surface by an angle of inclination greater than 0° and less than 90°; and 
 covering at least one through-hole with at least one transparent plate made of at least one material transparent to at least a sub-spectrum of electromagnetic radiation. 
 
     
     
       2. The production method as recited in  claim 1 , wherein the at least one strip-shaped recess is configured so as to extend, in each case, from a first segment of a side edge of the wafer up to a second segment of the side edge of the wafer in the wafer surface. 
     
     
       3. The production method as recited in  claim 1 , wherein at least two through-holes which are adjacent and which intersect with the same strip-shaped recess are covered by a single transparent plate. 
     
     
       4. The production method as recited in  claim 1 , wherein the at least one transparent plate covering the at least one through-hole is at least one of: an optical window, a UV window, a window having an anti-reflective coating, a lens, a prism, and a filter. 
     
     
       5. The production method as recited in  claim 1 , wherein the at least one transparent plate is fastened on the at least one through-hole by a fastening element. 
     
     
       6. The production method as recited in  claim 5 , wherein the at least one through-hole is hermetically sealed by the fastening element and by the at least one transparent plate. 
     
     
       7. The production method as recited in  claim 6 , wherein an outer side of the at least one transparent plate, oriented toward the wafer surface, is covered with at least one protective lacquer. 
     
     
       8. The production method as recited in  claim 1 , further comprising:
 structuring out a covering cap from the wafer provided with the at least one transparent plate.