Manufacturing method of display substrate using a carrier substrate and a sacrificial layer

Abstract

A manufacturing method of a display substrate, including preparing a carrier substrate; preparing a mixture of an organic material, an inorganic particle, and solvent; coating the mixture on the carrier substrate; forming a sacrificial layer including the inorganic particle in the organic material by curing the mixture; forming a barrier layer on the sacrificial layer; forming a display substrate on the barrier layer; and separating the barrier layer and the display substrate from the carrier substrate by applying a laser to the sacrificial layer.

What is claimed is: 
     
       1. A manufacturing method of a display substrate, comprising:
 preparing a carrier substrate; 
 preparing a mixture of an organic material, inorganic particles, and a solvent; 
 coating the mixture on the carrier substrate; 
 forming a sacrificial layer including the inorganic particles in the organic material by curing the mixture; 
 forming a barrier layer on the sacrificial layer; 
 forming a display substrate on the barrier layer; and 
 separating the barrier layer and the display substrate from the carrier substrate by applying laser energy to the sacrificial layer. 
 
     
     
       2. The manufacturing method of the display substrate as claimed in  claim 1 , wherein the organic material includes one or more of poly-para-xylene or poly dimethyl diphenyl siloxane resin. 
     
     
       3. The manufacturing method of the display substrate as claimed in  claim 1 , wherein the inorganic particles include one or more of molybdenum oxide (MoO 3 ), silicon (Si), indium-tin-oxide (ITO), and gallium nitride (GaN). 
     
     
       4. The manufacturing method of the display substrate as claimed in  claim 1 , wherein a diameter of the inorganic particles is about 0.1 μm to about 3 μm. 
     
     
       5. The manufacturing method of the display substrate as claimed in  claim 1 , wherein the solvent includes one or more of 1-methoxy-2-propanol or ethyl-3-ethoxypropionate. 
     
     
       6. The manufacturing method of the display substrate as claimed in  claim 1 , wherein the mixture is coated on the carrier substrate by a spin coating method, a slit coating method, a printing method, or a chemical vapor deposition method. 
     
     
       7. The manufacturing method of the display substrate as claimed in  claim 1 , wherein the solvent is removed by curing the mixture with light or heat. 
     
     
       8. The manufacturing method of the display substrate as claimed in  claim 1 , wherein a thickness of the sacrificial layer is about 40 nm to about 800 nm. 
     
     
       9. The manufacturing method of the display substrate as claimed in  claim 1 , wherein the carrier substrate includes one or more of glass, quartz, or a ceramic material. 
     
     
       10. The manufacturing method of the display substrate as claimed in  claim 1 , wherein the carrier substrate has a thickness greater than 0 mm and equal to or less than about 3 mm. 
     
     
       11. The manufacturing method of the display substrate as claimed in  claim 1 , wherein the barrier layer includes one or more of a silicon nitride (SiN x ), a silicon oxide (SiO x ), an aluminum oxide (Al 2 O 3 ), a silicon oxynitride, an aluminum nitride, or an aluminum oxynitride. 
     
     
       12. The manufacturing method of the display substrate as claimed in  claim 1 , wherein the display substrate is a flexible display substrate including a flexible substrate. 
     
     
       13. The manufacturing method of the display substrate as claimed in  claim 12 , wherein the flexible substrate includes one or more of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyether ether ketone (PEEK), or polyethylene. 
     
     
       14. The manufacturing method of the display substrate as claimed in  claim 1 , wherein the laser energy is from an excimer laser or a solid-state laser. 
     
     
       15. The manufacturing method of the display substrate as claimed in  claim 1 , wherein the mixture coated on the carrier substrate is a suspension. 
     
     
       16. The manufacturing method of the display substrate as claimed in  claim 2 , wherein forming the display substrate on the barrier layer includes processes performed at a temperature above 400° C. 
     
     
       17. The manufacturing method of the display substrate as claimed in  claim 1 , wherein,
 a diameter of the inorganic particles in the sacrificial layer is about 0.1 μm to about 3 μm, 
 a thickness of the organic material in the sacrificial layer is about 40 nm to about 800 nm, and 
 at least some of the inorganic particles have a diameter greater than the thickness of the organic material such that the sacrificial layer has a rough surface resulting from inorganic particles protruding from the organic material.