Transferring system and transferring method

Abstract

A transfer system ( 1 ) for transferring a fine transfer pattern (M 1 ) formed in a mold (M) to a to-be-molded material (D) provided on a substrate (W) includes a positioning device ( 3 ) configured to position the substrate (W) relative to the mold (M) and to bond the mold (M) and the substrate (W) together after the positioning, and a transfer device ( 5 ) provided separately from the positioning device ( 3 ) and configured to receive the mold (M) and the substrate (W) positioned and bonded together by the positioning device ( 3 ), and to cure the to-be-molded material (D) while pressing the mold (M) and the substrate (W) thereby to perform transfer.

The invention claimed is: 
     
       1. A transfer system configured to transfer a fine transfer pattern formed in a mold to a to-be-molded material provided on a substrate, comprising:
 a positioning device configured to position the substrate relative to the mold and to bond the mold and the substrate together after the positioning; and 
 a transfer device including a roller and a mold-substrate holder, the transfer device provided separately from the positioning device and configured to receive the mold and the substrate positioned and bonded together by the positioning device, and to mold the to-be-molded material by pressing the mold and the substrate against each other by sandwiching the mold and the substrate between the roller and the mold-substrate holder thereby to perform the transfer, wherein 
 the positioning device includes one or more dispensers configured to eject an adhesive at least at two positions for the bonding to a side surface of the mold or of the substrate, the side surface being away from regions of the mold and the substrate to be pressed by the transfer device; and 
 at least one of the roller and the mold-substrate holder has a width along a rotation axis of the roller, the width being smaller than an interval between the two positions of the adhesive. 
 
     
     
       2. The transfer system according to  claim 1 , wherein
 the positioning device comprises heating means for heating the substrate and the mold, 
 the transfer device comprises heating means being different from the heating means of the positioning device, and 
 the heating means of the positioning device and the heating means of the transfer device is temperature-controllable on the basis of individual set values. 
 
     
     
       3. The transfer system according to  claim 1 , wherein
 the to-be-molded material is a thermosetting resin, 
 the positioning device comprises heating means for heating the substrate and the mold, 
 the substrate and the mold are heated by using the heating means of the positioning device up to a temperature lower than a temperature to cure the thermosetting resin, and the substrate is positioned relative to the mold after the heating, 
 the transfer device comprises heating means for heating the substrate and the mold bonded together, and 
 the thermosetting resin is molded by using the heating means of the transfer device. 
 
     
     
       4. The transfer system according to  claim 1 , wherein
 the to-be-molded material is a thermoplastic resin, 
 the positioning device comprises heating means for heating the substrate and the mold, 
 the substrate and the mold are heated by using the heating means of the positioning device up to a temperature equal to or lower than a temperature to soften and mold the thermoplastic resin, and the substrate is positioned relative to the mold after the heating, 
 the transfer device comprises heating means for heating the substrate and the mold bonded together, and 
 the thermoplastic resin is softened and the fine transfer pattern is transferred to the thermoplastic resin by using the heating means of the transfer device. 
 
     
     
       5. The transfer system according to  claim 1 , wherein the positioning device is configured to perform the bonding by using any one of an ultraviolet curable resin, thermosetting resin, and an instantaneous adhesive as the adhesive. 
     
     
       6. The transfer system according to  claim 1 , wherein
 a region where the mold is bonded to the substrate by the positioning device is prevented from coming into contact with at least any one of the roller and the mold-substrate holder by at least any of a cutout portion formed in the roller and a cutout portion formed in the mold-substrate holder. 
 
     
     
       7. A transfer system configured to transfer a fine transfer pattern formed in a mold to a substrate made of a thermoplastic resin, comprising:
 a positioning device configured to position the substrate relative to the mold and to bond the mold and the substrate together after the positioning; and 
 a transfer device including a roller and a mold-substrate holder, the transfer device provided separately from the positioning device and configured to receive the mold and the substrate positioned and bonded together by the positioning device, and to press the mold and the substrate against each other by sandwiching the mold and the substrate between the roller and the mold-substrate holder thereby to perform the transfer, wherein 
 the positioning device includes heating means for heating the substrate and the mold, 
 the substrate and the mold are heated by using the heating means of the positioning device up to a temperature equal to or lower than a temperature to soften and mold the thermoplastic resin, and the substrate is positioned relative to the mold after the heating, 
 the positioning device includes one or more dispensers configured to eject an adhesive at least at two positions for the bonding to a side surface of the mold or of the substrate, the side surface being away from regions of the mold and the substrate to be pressed by the transfer device, 
 at least one of the roller and the mold-substrate holder has a width along a rotation axis of the roller, the width being smaller than an interval between the two positions of the adhesive 
 the transfer device includes heating means for heating the substrate and the mold bonded together, and 
 the substrate is softened and the fine transfer pattern is transferred to the substrate by using the heating means of the transfer device. 
 
     
     
       8. The transfer system according to  claim 7 , wherein the positioning device is configured to perform the bonding by using any one of an ultraviolet curable resin, a thermosetting resin, and instantaneous adhesive as the adhesive. 
     
     
       9. The transfer system according to  claim 7 , wherein
 a region where the mold is bonded to the substrate by the positioning device is prevented from coming into contact with at least any one of the roller and the mold-substrate holder by at least any of a cutout portion formed in the roller and a cutout portion formed in the mold-substrate holder. 
 
     
     
       10. A transfer method of transferring a fine transfer pattern formed in a mold to a to-be-molded material provided on a substrate, comprising:
 a positioning step of positioning the substrate relative to the mold; 
 a bonding step of bonding the mold and the substrate together after positioning in the positioning step; 
 a delivering step of delivering the mold and the substrate bonded in the bonding step; and 
 a transferring step of, after delivery in the delivering step, molding the to-be-molded material by pressing the bonded mold and substrate against each other to thereby perform the transfer, wherein 
 the bonding step includes ejecting an adhesive for the bonding to a side surface of the mold or of the substrate, the side surface being away from regions of the mold and the substrate to be pressed in the transferring step, and 
 the transferring step is performed while the adhesive is prevented from being pressed.