Semiconductor device carrier tape with image sensor detectable dimples

Abstract

A semiconductor device carrier tape with image sensor detectable dimples is disclosed. The dimpled carrier tape is formed of a flexible strip of material. A plurality of pockets are disposed spaced apart along the length of the flexible strip of material. Each pocket is configured to hold a semiconductor device. A dimple is formed in each of the plurality of pockets where each dimple has a peripheral edge and a bottom surface. Detection of the dimple by an image sensor facilitates alignment of a semiconductor device with the pocket and precise placement of the semiconductor device in the pocket.

What is claimed is: 
     
       1. A semiconductor device carrier tape, comprising:
 a flexible strip of material; 
 a plurality of pockets disposed spaced apart along a length of the flexible strip of material, each pocket having a primary bottom surface and being configured to hold a semiconductor device; and 
 a dimple formed in each of the plurality of pockets, each dimple comprising a peripheral edge and a bottom surface, the bottom surface of each dimple including a surface texture that is different from the primary bottom surface of each pocket. 
 
     
     
       2. The semiconductor device carrier tape of  claim 1 , wherein the peripheral edge of the dimple is detectable by an image sensor. 
     
     
       3. The semiconductor device carrier tape of  claim 1 , wherein the bottom surface of the dimple is detectable by the image sensor. 
     
     
       4. The semiconductor device carrier tape of  claim 1 , further comprising a plurality of feed holes spaced apart along the length of the flexible strip of material. 
     
     
       5. The semiconductor device carrier tape of  claim 1 , wherein the primary bottom surface of the pocket, the peripheral edge and the bottom surface of the dimple is a continuous, uninterrupted surface. 
     
     
       6. The semiconductor device carrier tape of  claim 1 , wherein the peripheral edge is rounded. 
     
     
       7. The semiconductor device carrier tape of  claim 1 , wherein the peripheral edge is a sloped surface. 
     
     
       8. The semiconductor device carrier tape of  claim 1 , wherein the dimple extends from an underside of the pocket. 
     
     
       9. A method for placing a semiconductor device in a pocket of a carrier tape, comprising:
 detecting, using an image sensor, a dimple in a pocket of a carrier tape; 
 aligning a semiconductor device with the pocket based on the detection of the dimple; and 
 placing the semiconductor device in the pocket. 
 
     
     
       10. The method of  claim 9 , further comprising determining a position of the pocket from the detected dimple. 
     
     
       11. The method of  claim 9 , wherein detecting the dimple comprises detecting a contrast between an image of a bottom surface of the pocket and an image of a peripheral edge of the dimple. 
     
     
       12. The method of  claim 9 , wherein detecting the dimple comprises detecting a contrast between an image of a bottom surface of the pocket and an image of a bottom surface of the dimple. 
     
     
       13. The method of  claim 12 , wherein detecting the contrast comprises detecting a surface texture of the bottom surface of the dimple. 
     
     
       14. The method of  claim 9 , further comprising using the image sensor to detect that the dimple is covered by a previously placed semiconductor device. 
     
     
       15. The method of  claim 9 , wherein the aligning the semiconductor device with the pocket is based on the detection of a peripheral edge of the dimple. 
     
     
       16. The method of  claim 9 , wherein the aligning the semiconductor device with the pocket is based on detecting a bottom surface of the dimple. 
     
     
       17. The method of  claim 9 , further comprising advancing the carrier tape after the placement of the semiconductor device.