Flexible circuit board interconnection and methods

Abstract

Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

The invention claimed is: 
     
       1. A method of connecting a plurality of flexible circuit boards together comprising:
 applying a solder composition between first electrical contacts of an upper surface of a first flexible circuit board and second electrical contacts of a lower surface of a second flexible circuit board; 
 positioning a clamp to hold the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together such that the clamp does not contact the second electrical contacts which are exposed on an upper surface of the second flexible circuit board; and 
 reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. 
 
     
     
       2. The method of  claim 1 , further comprising applying a solder composition between an upper surface of the second flexible circuit board and a lower surface of a third flexible circuit board; and positioning a clamp to hold the upper surface of the second flexible circuit board and the lower surface of the third flexible circuit board together. 
     
     
       3. The method of  claim 1 , further comprising applying a solder composition between an upper surface of the third flexible circuit board and a lower surface of a fourth flexible circuit board; and holding the upper surface of the third flexible circuit board and the lower surface of the fourth flexible circuit board together. 
     
     
       4. The method of  claim 1 , further comprising positioning a plurality of components on at least one of the first and second flexible circuit boards. 
     
     
       5. The method of  claim 4 , the components comprising light emitting diodes. 
     
     
       6. The method of  claim 4 , wherein positioning the plurality of components on the first and second flexible circuit boards takes place before the step of reflowing the solder composition with a heat source and the plurality of components are bonded to at least one of the first and second flexible circuit boards during the step of reflowing the solder composition with a heat source. 
     
     
       7. The method of  claim 1 , the clamp comprising a u-shaped fastener, a spring tension arm connected to the u-shaped fastener, and an attachment hook attached to the spring tension arm. 
     
     
       8. The method of  claim 1 , wherein the heat source delivers heat from the bottom of the first and second flexible circuit boards. 
     
     
       9. The method of  claim 1 , wherein the heat source delivers heat from the top of the first and second flexible circuit boards. 
     
     
       10. The method of  claim 1 , wherein the heat source delivers heat from the bottom and top of the first and second flexible circuit boards. 
     
     
       11. The method of  claim 1 , wherein the solder composition is selected from the group consisting of solder, solder paste, and solder with flux. 
     
     
       12. The method of  claim 1 , further comprising the step of confirming bonding of the first flexible circuit board and the second flexible circuit board together by inspection of the solder having flowed through a hole in the first flexible circuit board. 
     
     
       13. The method of  claim 12 , wherein the formation of a dome shaped solder bead atop the hole confirms proper bonding of the first flexible circuit board and the second flexible circuit board together. 
     
     
       14. The method of  claim 1 , wherein the first and second flexible circuit boards are each part of arrays of circuit boards arranged parallel to one another.