US9761778B2ActiveUtilityPatentIndex 52
Method for manufacturing thermoelectric materials
Est. expirySep 9, 2033(~7.2 yrs left)· nominal 20-yr term from priority
C04B 2235/85C04B 35/645C04B 2235/9607C04B 2235/446C04B 2235/407C04B 2235/77C04B 35/547H01L 35/34H01L 35/16H10N 10/852H10N 10/01
52
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10
Claims
Abstract
Disclosed is a method for manufacturing a thermoelectric material having high thermoelectric conversion performance in a broad temperature range. The method for manufacturing a thermoelectric material according to the present disclosure includes forming a mixture by weighing Cu and Se based on the following chemical formula 1 and mixing the Cu and the Se, and forming a compound by thermally treating the mixture: <Chemical Formula 1> Cu x Se where 2<x≦2.6.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A method for manufacturing a thermoelectric material, comprising:
forming a mixture by weighing Cu and Se based on the following chemical formula 1 and mixing the Cu and the Se;
forming a compound by thermally treating the mixture:
Cu x Se <Chemical Formula 1>
where 2<x≦2.6; and
after the forming of the compound, sintering the compound under pressure,
wherein Cu-containing particles are formed at a grain boundary in a matrix including the Cu and the Se during the pressure sintering, the Cu-containing particles including nano-dots,
wherein the forming of the compound is performed by a solid state reaction method.
2. The method of manufacturing a thermoelectric material according to claim 1 , wherein the forming of the compound is performed in a temperature range of 200° C. to 650° C.
3. The method for manufacturing a thermoelectric material according to claim 1 , wherein the pressure sintering is performed by a hot press or spark plasma sintering technique.
4. The method for manufacturing a thermoelectric material according to claim 1 , wherein the pressure sintering is performed under a pressure condition of 30 MPa to 200 MPa.
5. The method for manufacturing a thermoelectric material according to claim 1 , wherein the pressure sintering comprises grinding the compound into powder and sintering under pressure.
6. The method for manufacturing a thermoelectric material according to claim 1 , wherein the forming of the mixture comprises mixing Cu and Se in powder form.
7. The method for manufacturing a thermoelectric material according to claim 1 , wherein the nanoparticles include copper oxide.
8. The method for manufacturing a thermoelectric material according to claim 1 , wherein the thermoelectric material has a ZT value greater than or equal to 0.3 over a temperature range of 100° C. to 600° C.
9. The method for manufacturing a thermoelectric material according to claim 1 , wherein sintering the compound under pressure includes hot press sintering the compound under a vacuum condition.
10. The method for manufacturing a thermoelectric material according to claim 9 , wherein the compound is hot press sintered at a temperature of 650° C.Cited by (0)
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