Multi-layer packaging scheme for implant electronics

Abstract

The present invention provides a micropackaged device comprising: a substrate for securing a device with a corrosion barrier affixed to the substrate, wherein the corrosion barrier comprises a first thin-film layer, a metal film coating the thin-film layer and a second thin-film layer to provide a sandwich layer; and optionally at least one feedthrough disposed in the substrate to permit at least one input and or at least one output line into the micropackaged device, wherein the micropackaged device is encapsulated by the corrosion barrier. Methods of producing the micropackaged device are also disclosed.

What is claimed is: 
     
       1. A method for preparing a micropackaged device, said method comprising:
 providing a substrate for securing the device; 
 coating the device with a first thin-film layer to provide a first thin-film layer over the device; 
 depositing a surrounding metal film over the first thin-film layer to produce a metal coat, wherein depositing a surrounding metal film over the first thin-film layer to produce a metal coat is accomplished in a plurality of stages: 
 (i) in a first stage, the device is held at about 45° to the metal deposition source to complete encapsulation of one side of the device; 
 (ii) in a second stage, the device is flipped 180° and held at about 45° to the metal deposition source to complete encapsulation of the other side of the device; and 
 coating the metal coat layer with a second thin-film layer to provide an encapsulated micropackaged device. 
 
     
     
       2. The method of  claim 1 , wherein said device is a member selected from the group consisting of an integrated circuit (IC) chip, a printed circuit board (PCB), a microelectromechanical system (MEMS), a capacitor, an inductor, an oscillator, and a combination thereof. 
     
     
       3. The method of  claim 1 , wherein the first thin-film layer is made of a material selected from the group consisting of parylene, polyimide, Teflon and Kapton. 
     
     
       4. The method of  claim 1 , wherein the second thin-film layer is made of a material selected from the group consisting of parylene, polyimide, Teflon and Kapton. 
     
     
       5. The method of  claim 3 , wherein the first thin-film layer is parylene. 
     
     
       6. The method of  claim 4 , wherein the second thin-film layer is parylene. 
     
     
       7. The method of  claim 1 , wherein the metal film is a biocompatible metal. 
     
     
       8. The method of  claim 7 , wherein the metal film is a member selected from the group consisting of Au, Ag, Pt, Pd, Ti and an alloy. 
     
     
       9. The method of  claim 1 , wherein depositing a surrounding metal film surrounding the device is performed with a holder in constant motion. 
     
     
       10. The method of  claim 1 , wherein the first thin-film layer, the metal film coating and the second thin-film layer is a sandwich layer. 
     
     
       11. The method of  claim 10 , wherein said sandwich layer is a parylene-metal film-parylene. 
     
     
       12. The method of  claim 10 , wherein said sandwich is a corrosion barrier. 
     
     
       13. The method of  claim 1 , wherein said substrate comprises at least one feedthrough disposed therein to permit at least one input and or at least one output line into said micropackaged device. 
     
     
       14. The micropackaged device produced by the method of  claim 1 .