Strain inspection device and attaching method thereof

Abstract

A strain inspection device of a printed circuit board (PCB) which is easily cracked or damaged by external pressure (force) applied to the PCB while the PCB is being assembled, and an attaching method thereof. The strain inspection device of a printed circuit board (PCB) includes a fixing member; and a damage indicator fixed to the PCB by the fixing member, having a crack guide through hole, and cracked or damaged along a corner of the crack guide through hole due to deformation of the PCB.

What is claimed is: 
     
       1. A strain inspection device of a printed circuit board (PCB), the device comprising:
 a first fixing member; and 
 a damage indicator fixed to the PCB by the first fixing member, the damage indicator having a crack guide through hole, and the damage indicator being cracked or damaged along a corner of the crack guide through hole due to deformation of the PCB, 
 wherein the crack guide through hole is provided at an inner center of the damage indicator, wherein the crack guide through hole includes at least a first corner and a second corner that opposes the first corner, wherein an angle between a first line linking the first and second corners of the crack guide through hole and a first side of the damage indicator is a right angle, 
 wherein the damage indicator is a glass plate having the crack guide through hole, the glass plate is fixedly attached to the PCB by a bonding agent or an adhesive, the bonding agent or the adhesive is injected on the PCB through a through hole of a film mask, and wherein the first fixing member is the bonding agent or the adhesive fixedly attaching the damage indictor to the PCB. 
 
     
     
       2. The strain inspection device of  claim 1 , wherein at least a third corner of the crack guide through hole is positioned to face the first side of the damage indicator. 
     
     
       3. The strain inspection device of  claim 1 , wherein the crack guide through hole is a square through hole formed at the inner center of the damage indicator. 
     
     
       4. The strain inspection device of  claim 1 , wherein the crack guide through hole is a diamond-shaped through hole formed at the inner center of the damage indicator. 
     
     
       5. The strain inspection device of  claim 1 , wherein the crack guide through hole includes a third corner and a fourth corner that opposes the third corner,
 wherein a direction of the line linking the first and second corners of the crack guide through hole opposing each other is positioned as a length direction of the damage indicator, and a direction of a second line that links the third and fourth corners of the crack guide through hole is positioned as a width direction of the damage indicator. 
 
     
     
       6. The strain inspection device of  claim 1 , wherein the crack guide through hole is a through hole having a plurality of corners. 
     
     
       7. The strain inspection device of  claim 1 , wherein the crack guide through hole is formed in plurality at uniform intervals on the damage indicator. 
     
     
       8. The strain inspection device of  claim 1 , wherein one or a plurality of crack guide through holes are formed at uniform intervals on the damage indicator in a length direction of the damage indicator. 
     
     
       9. The strain inspection device of  claim 1 , wherein one or a plurality of crack guide through holes are formed at different intervals on the damage indicator in a length direction of the damage indicator. 
     
     
       10. The strain inspection device of  claim 1 , further comprising:
 a second fixing member attached to the first fixing member such that the second fixing member covers both edges of the damage indicator in a length direction. 
 
     
     
       11. The strain inspection device of  claim 1 , wherein the first fixing member is a film type thermosetting bonding agent or an epoxy resin bonding agent. 
     
     
       12. The strain inspection device of  claim 1 , wherein a material of the damage indicator is any one of glass, silicon wafer, plaster, and plastic. 
     
     
       13. The strain inspection device of  claim 1 ,
 wherein a length of the damage indicator ranges from 4 to 7 mm, a width thereof ranges from 1 to 3 mm, and a thickness thereof ranges from 80 to 150 mm, and a width of the crack guide through hole ranges from 0.7 to 2 mm. 
 
     
     
       14. The strain inspection device of  claim 1 , wherein the crack guide through hole includes a third corner and a fourth corner that opposes the third corner. 
     
     
       15. The strain inspection device of  claim 14 , wherein an angle between a second line linking the third and fourth corners of the crack guide through hole and a second side of the damage indicator is a right angle. 
     
     
       16. A method for attaching a strain inspection device of a printed circuit board (PCB), the method comprising:
 forming a crack guide through hole having a corner on a glass plate; and 
 fixedly attaching the glass plate with the crack guide through hole formed thereon to the PCB by using a bonding agent or an adhesive such that the glass plate is cracked along the corner of the crack guide through hole due to deformation of the PCB, 
 wherein the attaching of the glass plate to the PCB comprises:
 positioning a film mask having a through hole on the PCB; 
 injecting a bonding agent or an adhesive into the through hole of the film mask; and 
 removing the film mask and subsequently fixedly attaching the glass plate to the PCB by using the bonding agent or the adhesive. 
 
 
     
     
       17. The method of  claim 16 , further comprising:
 applying heat to the bonding agent or the adhesive to thermally cure the bonding agent or the adhesive.