US9871165B2ActiveUtilityPatentIndex 82
Advanced electronic device structures using semiconductor structures and superlattices
Est. expiryMay 27, 2034(~7.9 yrs left)· nominal 20-yr term from priority
H10P 14/3434H10P 14/3426H10P 14/3416H10P 14/3254H10P 14/3252H10P 14/3234H10P 14/3226H10P 14/3216H10P 14/2921H10P 14/2908H10P 14/2905H01L 33/06H01L 33/14H01L 21/02554H01L 33/10H01L 21/02381H01L 21/0254H01L 27/15H01L 21/02483H01L 33/16H01L 21/02472H01L 21/02507H01L 21/0251H01L 21/02389H01L 21/02565H01L 21/0242H01L 33/18H01L 33/32H01L 33/007H01L 21/02458H10H 20/036H10H 20/825H10H 20/812H10H 20/818H10H 20/816H10H 20/01335H10H 20/814H10H 20/81H10H 29/10H10H 20/817
82
PatentIndex Score
4
Cited by
156
References
16
Claims
Abstract
Semiconductor structures and methods for forming those semiconductor structures are disclosed. For example, a p-type or n-type semiconductor structure is disclosed. The semiconductor structure has a polar crystal structure with a growth axis that is substantially parallel to a spontaneous polarization axis of the polar crystal structure. The semiconductor structure changes in composition from a wider band gap (WBG) material to a narrower band gap (NBG) material or from a NBG material to a WBG material along the growth axis to induce p-type or n-type conductivity.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A method of forming a p-type or n-type semiconductor structure, the method comprising:
growing along a growth axis a semiconductor having a polar crystal structure, the growth axis being substantially parallel to a spontaneous polarization axis of the polar crystal structure; and
changing a composition of the semiconductor monotonically from a wider band gap (WBG) material to a narrower band gap (NBG) material or from a NBG material to a WBG material along the growth axis to induce p-type or n-type conductivity.
2. The method of claim 1 , wherein the composition of the semiconductor comprises:
at least two types of metal atom cations; and
a non-metal atom anion.
3. The method of claim 2 , wherein the non-metal atom anion is nitrogen or oxygen.
4. The method of claim 2 , wherein changing the composition of the semiconductor comprises: changing a molar fraction of one or more of the at least two types of metal atom cations in the composition along the growth axis.
5. The method of claim 1 , wherein the p-type conductivity is induced by:
growing the semiconductor with a cation-polar crystal structure and changing the composition of the semiconductor monotonically from a WBG material to a NBG material along the growth axis; or
growing the semiconductor with an anion-polar crystal structure and changing the composition of the semiconductor monotonically from a NBG material to a WBG material along the growth axis.
6. The method of claim 1 , wherein the n-type conductivity is induced by:
growing the semiconductor with a cation-polar crystal structure and changing the composition of the semiconductor monotonically from a NBG material to a WBG material along the growth axis; or
growing the semiconductor with an anion-polar crystal structure and changing the composition of the semiconductor monotonically from a WBG material to a NBG material along the growth axis.
7. The method of claim 1 , wherein the polar crystal structure is a polar wurtzite crystal structure.
8. The method of claim 1 , wherein the composition of the semiconductor is changed in a stepwise manner along the growth axis.
9. The method of any claim 1 , wherein the composition of the semiconductor is selected from group-III metal nitride compositions.
10. The method of claim 1 , wherein the composition of the semiconductor is selected from the following:
aluminium gallium nitrides (Al x Ga 1-x N) where 0≦x≦1;
aluminium gallium indium nitrides (Al x Ga y In 1-x-y N) where 0≦x≦1, 0≦y≦1 and 0≦(x+y)≦1; and
magnesium zinc oxides (Mg x Zn x-1 O) where 0≦x≦1.
11. The method of claim 1 , further comprising:
including impurity dopants in the composition of the semiconductor to enhance the induced p-type or n-type conductivity.
12. A method of forming a complex semiconductor structure, the method comprising: forming two or more contiguous semiconductor structures and/or semiconductor superlattices, wherein the contiguous semiconductor structures and/or semiconductor superlattices are each formed according to the method of claim 1 .
13. The method of claim 12 , further comprising flipping a polarity-type of material between two of the two or more contiguous semiconductor structures.
14. The method of claim 12 , wherein a first of the two or more contiguous semiconductor structures has a larger change in composition along the growth axis and a second of the two or more contiguous semiconductor structures has a smaller change in composition along the growth axis.
15. A p-type or n-type semiconductor structure having a polar crystal structure with a growth axis that is substantially parallel to a spontaneous polarization axis of the polar crystal structure, the semiconductor structure having an induce p-type or n-type conductivity resulting from a monotonic change in composition from a wider band gap (WBG) material to a narrower band gap (NBG) material or from a NBG material to a WBG material along the growth axis.
16. A complex semiconductor structure comprising two or more contiguous semiconductor structures in accordance with claim 15 .Cited by (0)
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