Manufacturing method of inertial sensor and inertial sensor

Abstract

A manufacturing method of an inertial sensor which includes a movable body that is disposed in a cavity formed by a base body and a lid, and in which a wiring groove of wiring communicating with the cavity and electrically connected to the movable body is formed in the base body, includes forming a first opening section, which does not penetrate through the lid by wet etching; accommodating the movable body in the cavity by bonding the base body and the lid; forming a first sealing material with which the wiring groove is sealed after the accommodating of the movable body; forming a through-hole communicating with the cavity by penetrating through the first opening section by dry etching after the forming of the first sealing material; and forming a second sealing material with which the through-hole is sealed.

What is claimed is: 
     
       1. A manufacturing method of an inertial sensor which includes a movable body that is disposed in a cavity formed by a base body and a lid, and in which a wiring groove of wiring communicating with the cavity and electrically connected to the movable body is formed in the base body, the manufacturing method comprising:
 forming a first opening section, which does not penetrate through the lid by wet etching; 
 accommodating the movable body in the cavity by bonding the base body and the lid; 
 forming a first sealing material with which the wiring groove is sealed after the accommodating of the movable body; 
 forming a through-hole communicating with the cavity by penetrating through the first opening section by dry etching after the forming of the first sealing material; and 
 forming a second sealing material with which the through-hole is sealed. 
 
     
     
       2. The manufacturing method of an inertial sensor according to  claim 1 ,
 wherein the forming of the first sealing material is performed by forming a thin film by a vapor phase growing method. 
 
     
     
       3. The manufacturing method of an inertial sensor according to  claim 1 ,
 wherein the forming of the second sealing material is performed by heating and melting a solder ball. 
 
     
     
       4. The manufacturing method of an inertial sensor according to  claim 1 , further comprising:
 forming a second opening section, which does not penetrate through the lid, communicating with the cavity in the lid, 
 wherein an opening area of the second opening section is smaller than the minimum opening area of the first opening section, 
 wherein in the forming of the through-hole, the through-hole is formed by communicating the first opening section with the second opening section.