P
US9924593B2ActiveUtilityPatentIndex 51

Graphene wiring structure and method for manufacturing graphene wiring structure

Assignee: TOSHIBA KKPriority: Sep 11, 2015Filed: Sep 1, 2016Granted: Mar 20, 2018
Est. expirySep 11, 2035(~9.2 yrs left)· nominal 20-yr term from priority
Inventors:SAKAI TADASHIYAMAZAKI YUICHIMIYAZAKI HISAOKATAGIRI MASAYUKIISHIKURA TAISHIKAJITA AKIHIRO
H10W 20/435H10W 20/4462H10W 20/076H10W 20/072H10W 20/063H10W 20/057H10W 20/46H10W 20/01H05K 3/146H05K 1/09H05K 3/4076H05K 2201/0323H01L 21/768G11C 11/00H05K 1/115H05K 1/0306
51
PatentIndex Score
1
Cited by
47
References
15
Claims

Abstract

A graphene wiring structure of an embodiment has a substrate, a metal part on the substrate, multilayered graphene connected to the metal part, a first insulative film on the substrate, and a second insulative film on the substrate. The metal part is present between the first insulative film and the second insulative film. Edges of the multilayered graphene are connected to the metal part. A side face of the first insulative film vertical to the substrate opposes a side face of the second insulative film vertical to the substrate. A first outer face of the multilayered graphene is in physical contact with a first side face of the first insulative film vertical to the substrate. A second outer face of the multilayered graphene is in physical contact with a second side face of the second insulative film vertical to the substrate.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A graphene wiring structure comprising:
 a substrate; 
 a metal part on the substrate; 
 multilayered graphene being in direct contact with the metal part; 
 a first insulative film on the substrate; and 
 a second insulative film on the substrate, wherein 
 the metal part is present between the first insulative film and the second insulative film, 
 a side face of the first insulative film vertical to the substrate opposes a side face of the second insulative film vertical to the substrate, 
 a first outer face of the multilayered graphene is at least partly in direct contact with a first side face of the first insulative film vertical to the substrate, 
 a second outer face of the multilayered graphene is at least partly in direct contact with a second side face of the second insulative film vertical to the substrate, 
 the multilayered graphene sandwiches the metal part, 
 the first insulative film and the second insulative film sandwiches the multilayered graphene and the metal part, 
 one edge of the multilayered graphene is in direct contact with the metal part, and 
 the other edge of the multilayered graphene being opposite to the one edge is unconnected to the metal part. 
 
     
     
       2. The structure according to  claim 1 ,
 wherein the metal part is of a ridge type shape. 
 
     
     
       3. The structure according to  claim 1 ,
 wherein when a wiring width as a distance from the first outer face of the multilayered graphene to the second outer face is assumed as W, and 
 a wiring length as a length of the multilayered graphene vertical in the wiring width direction and parallel to the surface of the substrate is assumed as L, 
 the W and L meet L/W ≧3. 
 
     
     
       4. The structure according to  claim 1 ,
 wherein the wiring length direction is a longitudinal direction. 
 
     
     
       5. The structure according to  claim 1 ,
 wherein the multilayered graphene is multilayered graphene in which a first interlayer substance is present between its layers. 
 
     
     
       6. The structure according to  claim 5 ,
 wherein the first interlayer substance is further present between the first outer face of the multilayered graphene being unconnected to the first side face of the first insulative film and the first side face of the first insulative film, and 
 the first interlayer substance is further present between the second outer face of the multilayered graphene being unconnected to the second side face of the second insulative film and the second side face of the second insulative film. 
 
     
     
       7. The structure according to  claim 1 ,
 wherein a gap layer is provided between the first insulative film and the second insulative film. 
 
     
     
       8. The structure according to  claim 1 ,
 wherein a second interlayer substance is present between layers in the multilayered graphene at the end of the multilayered graphene opposite to the substrate, and 
 the second interlayer substance contains one or more from among oxides, nitrides, and carbides. 
 
     
     
       9. The structure according to  claim 1 ,
 wherein a wiring width of the multilayered graphene is between 1 nm and 20 nm. 
 
     
     
       10. The structure according to  claim 5 , wherein the first interlayer substance contains one or more first interlayer substances at least one selected from the group consisting of; metal chlorides, metal fluorides, alkali metals, alkali earth metals, halogens, and interhalogen compounds. 
     
     
       11. The structure according to  claim 1 ,
 wherein the substrate includes aluminum oxide or titanium oxide. 
 
     
     
       12. The structure according to  claim 1 , wherein the metal part includes a metal or alloy containing Fe, Ta, or Mo. 
     
     
       13. The structure according to  claim 1 , wherein a width of the metal part is between 1 nm and 20 nm. 
     
     
       14. The wiring according to  claim 1 , wherein the metal part, the first insulative film and the second insulative film are in direct contact with the substrate. 
     
     
       15. The wiring according to  claim 1 , wherein
 a height of the first insulative film from the substrate is larger than a height of the metal part from the substrate, and 
 a height of the second insulative film from the substrate is larger than a height of the metal part from the substrate.

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